Components and Packaging Technologies, IEEE Transactions on
Issue 1 • Date March 2002
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Displaying Results 1 - 24 of 24
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Editorial
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PDF (145 KB)
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Humidity management of outdoor electronic equipment: methods, pitfalls, and recommendations
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PDF (239 KB)
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A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements
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PDF (316 KB)
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Squeegee bump technology
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PDF (810 KB)
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High-temperature storage and thermal cycling studies of thick film and wirewound resistors
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PDF (404 KB)
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Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)
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PDF (576 KB)
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Single chamber compact two-phase heat spreaders with microfabricated boiling enhancement structures
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PDF (425 KB)
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Fabrication of high current and low profile micromachined inductor with laminated Ni/Fe core
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PDF (595 KB)
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Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin
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PDF (485 KB)
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Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
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PDF (453 KB)
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A constitutive model for a high lead solder
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PDF (321 KB)
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Aims & Scope
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Meet Our Editors
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
