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Components and Packaging Technologies, IEEE Transactions on

Issue 3 • Date Sept. 2001

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Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.