Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Issue 2 • Date Jun 1990
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Displaying Results 1 - 25 of 34
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Full wave three-dimensional simulation of Maxwell's equations for the electrical characterization of high-speed interconnects
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PDF (456 KB)
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A study of the off-contact screen printing process. II. Analysis of the model of the printing process
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PDF (432 KB)
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Multilayer ceramic packaging alternatives
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PDF (704 KB)
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Ag-Pd thick film conductor for AlN ceramics
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PDF (692 KB)
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A study of the off-contact screen printing process. I. Model of the printing process and some results derived from experiments
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PDF (772 KB)
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A novel method of metallization for MMICs
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PDF (192 KB)
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The tribological properties of N2+ implanted AuAgCu alloy and palladium in sliding contact with gold electroplate
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PDF (460 KB)
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Capacitance of a strip capacitor
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PDF (396 KB)
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Analysis of the dynamic phenomena during lamination of multilayer printed circuit board by the measurement of pressure distribution
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PDF (364 KB)
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Aims & Scope
IEEE Transactions on Components, Hybrids, and Manufacturing Technology was published 1978-1993. The latest title for this publication is IEEE Transactions on Advanced Packaging.
