Issue 2 • Date April 2001
Filter Results
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Abstracts
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PDF (23 KB)
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Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials
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PDF (284 KB)
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Laser-assisted bumping for flip chip assembly
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PDF (196 KB)
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Wafer charging in process equipment and its relationship to GMR heads charging damage
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PDF (164 KB)
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A framework to encourage step-change reduction in environmental impact in the creation of electronics products
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PDF (244 KB)
Aims & Scope
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University


