Electronics Packaging Manufacturing, IEEE Transactions on
Issue 4 • Date Oct. 2000
Society Sponsor
Filter Results
Displaying Results 1 - 25 of 32
-
An automated meniscus coating system for polymer deposition on large-area MCM-D and MCM-L substrates
|
PDF (15 KB)
-
A refine-or-sell decision model for a station with continous reprocessing options in an electronics recycling center
|
PDF (13 KB)
-
Author index
|
PDF (27 KB)
-
Subject index
|
PDF (41 KB)
-
Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memory
|
PDF (16 KB)
-
Conductive floor and footwear system as primary protection against human body model ESD event
|
PDF (16 KB)
-
Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity
|
PDF (16 KB)
-
-
Operational analysis of synchrotron-based X-ray lithography: comparison of 200 mm and 300 mm wafer flows
|
PDF (280 KB)
-
Operational analysis of synchrotron-based X-ray lithography: simulation model of wafer flows
|
PDF (140 KB)
-
Burn-in effect on yield
|
PDF (16 KB)
-
-
-
-
Conductive floor and footwear system as primary protection against human body model ESD event
|
PDF (92 KB)
-
-
A model for discrete processing decisions for bulk recycling of electronics equipment
|
PDF (124 KB)
-
-
-
-
-
-
Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memory
|
PDF (300 KB)
-
-
Burn-in effect on yield
|
PDF (200 KB)
Aims & Scope
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University
