Issue 3 • Date July 2000
Filter Results
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Abstracts of forthcoming manuscripts
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PDF (32 KB)
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Confidence assessment of quality prediction from process measurement in sequential manufacturing processes
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PDF (188 KB)
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Multiple assignment of component types to feeder slots on automated printed circuit card placement machines
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PDF (204 KB)
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Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film
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PDF (572 KB)
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Aims & Scope
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University


