Components and Packaging Technologies, IEEE Transactions on
Issue 2 • Date Jun 2000
Society Sponsor
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Displaying Results 1 - 25 of 28
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Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
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PDF (904 KB)
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Anode spot vacuum arc model: graphite anode
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PDF (140 KB)
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Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies
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PDF (176 KB)
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Performance of a shape memory alloy coil-shaped clamp for enhanced normal force in pin-and-receptacle electrical connectors
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PDF (132 KB)
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Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
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PDF (356 KB)
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A measurement on electromagnetic noise and change of surface in arcing electric contacts
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PDF (724 KB)
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The volumetric erosion of electrical contacts
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PDF (1572 KB)
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A testing method and device for intrinsic stress measurement in wafer bumping process
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PDF (588 KB)
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A simulation study of IC layout effects on thermal management of die attached GaAs ICs
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PDF (1088 KB)
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A perspective on North American PWB technology hurdles and barriers and a strategy to overcome obstacles
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PDF (84 KB)
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The effect of fretting at elevated temperatures on a clad material (65Au21Pd14Ag) and an electroplated soft gold over palladium-nickel material system
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PDF (952 KB)
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Contact resistance changes of silver, silver alloys, and gold plated silver coupons exposed to ozone
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PDF (132 KB)
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The impact of sliding motion and current load on the deterioration of tin-coated contact terminals
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PDF (304 KB)
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Aims & Scope
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Meet Our Editors
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
