Advanced Packaging, IEEE Transactions on
Issue 4 • Date Nov. 1999
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Displaying Results 1 - 19 of 19
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Author index
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PDF (197 KB)
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Subject index
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PDF (203 KB)
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Optoelectronic/VLSI
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PDF (400 KB)
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A compact optical active connector: an optical interconnect module with an electrical connector interface
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PDF (1372 KB)
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Efficient computation of frequency-dependent parameters for on-chip interconnects via two-dimensional FDTD and time signal prediction technique
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PDF (224 KB)
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Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates
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PDF (200 KB)
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A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates
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PDF (112 KB)
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High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components
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PDF (300 KB)
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Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput
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PDF (680 KB)
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Design and test methodology for an analog-to-digital converter multichip module for experimental all-digital radar receiver operating at 2 gigasamples/s
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PDF (800 KB)
Aims & Scope
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Meet Our Editors
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
