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IEEE Transactions on Electronics Packaging Manufacturing

Issue 3 • Date July 1999

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Displaying Results 1 - 9 of 9
  • Abstracts

    Publication Year: 1999, Page(s):182 - 184
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    Freely Available from IEEE
  • Run-by-run estimation-based control of meniscus coating

    Publication Year: 1999, Page(s):209 - 222
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    This paper describes the application of process control techniques to the meniscus coating process. Meniscus coating may be used to deposit polymers used in integrated circuits and electronics packages. Three control schemes are presented and each employs Kalman filtering to identify process coefficients. The three schemes differ according to the process model and amount of process information tha... View full abstract»

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  • Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation

    Publication Year: 1999, Page(s):195 - 201
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (180 KB)

    A flexible, smooth, and low profile conformal coating was developed to accomplish the encapsulation of a microelectromechanical system (MEMS) device that will be applied to sense the static pressure on aircraft during real flight testing. The encapsulant should be able to protect the MEMS device and the multichip module (MCM) from adverse environmental conditions, i.e., mechanical shock, temperatu... View full abstract»

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  • Conductivity mechanisms of isotropic conductive adhesives (ICAs)

    Publication Year: 1999, Page(s):223 - 227
    Cited by:  Papers (38)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (112 KB)

    Isotropic conductive adhesives (ICAs) are usually composites of adhesive resins with conductive fillers (mainly silver flakes). The adhesive pastes before cure usually have low electrical conductivity. The conductive adhesives become highly conductive only after the adhesives are cured and solidified. The mechanisms of conductivity achievement in conductive adhesives were discussed. Experiments we... View full abstract»

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  • Mechanisms underlying the unstable contact resistance of conductive adhesives

    Publication Year: 1999, Page(s):228 - 232
    Cited by:  Papers (33)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    One critical obstacle of current conductive adhesives is their unstable contact resistance with nonnoble metal finished components during high temperature and humidity aging. It is commonly accepted that metal oxide formation at the interface between the conductive adhesive and the nonnoble metal surface is responsible for the contact resistance shift. Two different mechanisms, simple oxidation an... View full abstract»

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  • Fuzzy assignment of manufacturing process tolerances

    Publication Year: 1999, Page(s):191 - 194
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (140 KB)

    The assignment of process tolerances is vital to the success of production, therefore, a systematic and reliable approach should be developed to assist the process planner in designing the tolerances. Conventional methods assign tolerances without considering the process capability of machinery, as a result, the tolerances allocated may not agreeable economically. This study proposes a new formula... View full abstract»

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  • Adaptive fuzzy process control of integrated circuit wire bonding

    Publication Year: 1999, Page(s):233 - 243
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    One step in the assembly of integrated circuits is wire bonding, requiring expert knowledge to optimize critical process characteristics. This paper describes a fuzzy logic controller which sets parameters for the wire bonding process for gold ball wire bonds, specifically controlling bonded ball diameter and shear strength density. While the focus is on control of ball bonds, the method is genera... View full abstract»

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  • Environmental effects in component packaging selection

    Publication Year: 1999, Page(s):185 - 190
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    Design for environment activities in electronics have been focused on issues of product life-cycle at the board design level and to facility-level process and material choices at the semiconductor fabrication level. An important bridge between these two domains has been the influence of component selection, particularly packaging selection, on environmental impacts. Component packaging influences ... View full abstract»

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  • Plating of small blind vias [multilayer PCBs]

    Publication Year: 1999, Page(s):202 - 208
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (980 KB)

    Metallization of laminates with blind vias on the dielectric side was performed by electroless copper plating with subsequent copper electroplating. The vertical cross section of blind vias with diameters between 125 and 75 μm were analyzed by reflective microscopy. Results indicate that ultrasonic vibration during the pretreatment processes of metallization enables complete electroless copper ... View full abstract»

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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University