Advanced Packaging, IEEE Transactions on
Issue 1 • Date Feb 1999
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Displaying Results 1 - 13 of 13
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Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
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PDF (532 KB)
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Quantitative characterization of 96.5Sn3.5Ag and 80Au20Sn optical fiber solder bond joints on silicon micro-optical bench substrates
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PDF (308 KB)
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Characterization and performance prediction for integral resistors in low temperature co-fired ceramic technology
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PDF (548 KB)
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High frequency loss and electromagnetic field distribution for striplines and microstrips [MCM packages]
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PDF (488 KB)
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Crack formation mechanism in laser-welded Au-coated Invar materials for semiconductor laser packaging
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PDF (544 KB)
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Characterization and performance prediction for integral capacitors in low temperature co-fired ceramic technology
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PDF (520 KB)
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Parameter extraction and electrical characterization of high density connector using time domain measurements
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PDF (280 KB)
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An efficient solver for the three-dimensional capacitance of the interconnects in high speed digital circuit by the multiresolution method of moments
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PDF (292 KB)
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Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process
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PDF (824 KB)
Aims & Scope
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Meet Our Editors
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
