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Browse Journals & Magazines > Components, Packaging, and Man ... Volume 21 Issue 4

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

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Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Issue 4 • Date Oct. 1998

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Title History

1998 Author index

1998 Subject Index

Heat-transfer enhancing features for handler tray-type device carriers

Energy model for end-of-life computer disposition

Use of compliant adhesives in the large area processing of MCM-D substrates

Compression flow modeling of underfill encapsulants for low cost flip-chip assembly

Influence of well profile and gate length on the ESD performance of a fully silicided 0.25 μm CMOS technology

Very fast transmission line pulsing of integrated structures and the charged device model

Protection of high voltage power and programming pins

The behavior of solder pastes in stencil printing with vibrating squeegee

The impact of technology scaling on ESD robustness of aluminum and copper interconnects in advanced semiconductor technologies

A study of ESD protection devices for input pins. Discharge characteristics of diode, lateral bipolar transistor, and thyristor under MM and HBM tests

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