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IEEE Micro

Issue 4 • Date July-Aug. 1998

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Displaying Results 1 - 12 of 12
  • New Route In System Integration: Chip-Package Codesign

    Publication Year: 1998, Page(s):7 - 9
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (393 KB)

    First Page of the Article
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  • Microvias: the next generation of substrates and packages

    Publication Year: 1998, Page(s):10 - 16
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (290 KB)

    Shrinking traces and spaces combined with a rising layer count eventually enlarge density, but most fabricators merely choose to shrink via size. Vias (conductive vertical paths or holes in any substrate) were previously drilled mechanically. With the prevalence of lasers, however, the focus has turned to microvias or build-up technologies. Microvias (miniature holes smaller than 150 μm in... View full abstract»

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  • Large chip vs. MCM for a high-performance system

    Publication Year: 1998, Page(s):33 - 41
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (100 KB)

    The capabilities of modern semiconductor processes enable us to design a system on a chip. This implies a large function on a large chip. However, as we approach-and eventually exceed-a 1-GHz clock rate, it is valid to ask whether partitioning this chip into a few smaller chips and using a multichip module (MCM) to interconnect the functions is better for performance and cost. This article explore... View full abstract»

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  • Electrical modeling and simulation challenges in chip-package codesign

    Publication Year: 1998, Page(s):50 - 59
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (124 KB)

    High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach View full abstract»

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  • Uncertainty, prediction, and the unexpected

    Publication Year: 1998, Page(s):76 - 77
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (52 KB)

    There is a common (and I think, accurate) perception that today's high-technology markets contain an irreducible amount of uncertainty. It's easy to explain part of this uncertainty. Few people are considered experts on many technologies. Thus, most high-tech watchers are frequently surprised, disappointed, and delighted by commercial developments in fields about which they know almost nothing. Th... View full abstract»

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  • Starting an international standard

    Publication Year: 1998, Page(s):2 - 3
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (80 KB)

    Describes the procedure for developing international standards View full abstract»

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  • Restraints on technology advances

    Publication Year: 1998, Page(s):4 - 6, 78-81
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (228 KB)

    The US Antitrust Division's new case against Microsoft and the Federal Trade Commission's new case against Intel focus on restraints on technology advances. In both cases, the government's attorneys allege that the company charged with anticompetitive conduct has abused its dominant market position to extend its monopoly power from a first market to a second market. They also allege that part of t... View full abstract»

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  • Chip-package codesign for high-frequency circuits and systems

    Publication Year: 1998, Page(s):24 - 32
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    When the need for high frequency combines with the demand for low-cost consumer electronics, the challenge of ensuring correctly functioning components becomes paramount. Focusing on chip-package codesign offers a solution View full abstract»

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  • Future system-on-silicon LSI chips

    Publication Year: 1998, Page(s):17 - 22
    Cited by:  Papers (193)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    The development of system-on-silicon large-scale integration (LSI) devices has significantly influenced the demand for higher wiring connectivity within LSI chips. Currently, increasing the number of metal layers in a multilevel metallization as the device size decreases increases wiring connectivity. In the future, however, designers will have difficulty catching up with the rising demand for hig... View full abstract»

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  • Posix/Unix standards: foundation for 21st century growth

    Publication Year: 1998
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (40 KB)

    Posix standards represent approximately $80 billion of the $250+ billion-Unix market over the last decade; they also provide the basis for significant growth in the future. This picture of the substantial success of Posix standards (and the business impact of standards in general) differs from that presented in Micro's May/June 1998 issue. The overall Unix market boasts billions of dollars in reve... View full abstract»

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  • Virtual memory in contemporary microprocessors

    Publication Year: 1998, Page(s):60 - 75
    Cited by:  Papers (18)  |  Patents (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (152 KB)

    Here, we consider the memory management designs of a sampling of six recent processors, focusing primarily on their architectural differences, and hint at optimizations that someone designing or porting system software might want to consider. We selected examples from the most popular commercial microarchitectures: the MIPS R10000, Alpha 21164, PowerPC 604, PA-8000, UltraSPARC-I, and Pentium II. T... View full abstract»

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  • Area I/O's potential for future processor systems

    Publication Year: 1998, Page(s):42 - 49
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB)

    Bandwidth, latency, system speed, and, of course, the size of future microprocessor systems all highly depend on interconnection technologies. Interconnection will become the key performance bottleneck as semiconductor technology improvements continue to reduce feature size. In this article, we describe the use of on-chip area I/O for future microprocessor systems on the basis of a case study we m... View full abstract»

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Erik R. Altman
School of Electrical and Computer Engineering
IBM T.J. Watson Research Center