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Browse Journals & Magazines > Components, Packaging, and Man ... Volume 21 Issue 2

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

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Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Issue 2 • Date April 1998

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Abstracts

Electrical characterization of laser machined and metallized vias in AlN with thick film interconnect

Material-centric modeling of PWB fabrication: an economic and environmental comparison of conventional and photovia board fabrication processes

Thermal modeling of a double-neck large diameter crystal growth process

Optimization for thermal and electrical wiring for a flip-chip package using physical-neural network modeling

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

Effective modeling of the reflow soldering process: basis, construction, and operation of a process model

Molding challenges of LOC packages with large devices

Improvements to X-ray laminography for automated inspection of solder joints

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