Issue 2 • Date May 1998
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Displaying Results 1 - 12 of 12
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Microsystems and wafer processes for volume production of highly reliable fiber optic components for telecom- and datacom-application
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PDF (280 KB)
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Laser formed metallic connections
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PDF (120 KB)
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Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems
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PDF (136 KB)
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Accurate, rapid, high frequency empirically based predictive modeling of arbitrary geometry planar resistive passive devices
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PDF (140 KB)
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Wafer scale photonic-die attachment
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PDF (112 KB)
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Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging was published 1994-1998. The latest title for this publication is IEEE Transactions on Advanced Packaging.


