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Browse Journals & Magazines > Components, Packaging, and Man ... Volume 20 Issue 3

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Issue 3 • Date Sep 1997

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Title History

A high heat flux IGBT micro exchanger setup

Adhesion strength and microstructural evaluation in electroless Ni-P metallized AlN substrate

Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package

Finite element analysis of PWB warpage due to the solder masking process

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis

Thermal phenomena in compact electronic enclosures: a numerical study

Moisture absorption and desorption predictions for plastic ball grid array packages

Three-dimensional visualization of multilayered assemblies using X-ray laminography

A study on thermal-stress-reliability of Si-based PLC substrate

Electronic Components Obsolescence

1/f noise in bismuth ruthenate based thick-film resistors

Coffin-Manson fatigue model of underfilled flip-chips

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