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Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Issue 2 • Date Apr 1997

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Displaying Results 1 - 8 of 8
  • Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

    Publication Year: 1997 , Page(s): 95 - 100
    Cited by:  Papers (27)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (184 KB)  

    Flip chip attachments provide the highest interconnection density possible, which makes this technology very attractive for use with liquid crystal display (LCD) packaging methods. This technology stimulated the development of new interconnection techniques, such as anisotropic adhesives. However, several factors have hindered the wide use of this technology. These factors include the availability... View full abstract»

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  • A stair-like CIM system architecture

    Publication Year: 1997 , Page(s): 101 - 110
    Cited by:  Papers (7)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (200 KB)  

    Computer integrated manufacturing (CIM) has received growing acceptance from both industries and academia alike. However, even with the increasing reliance on computing technologies, there are still wide-spread concerns about the true impacts on the actual performance of the companies implementing CIM. In particular, the overall coherence of the entire system has been considered as a key issue. To... View full abstract»

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  • Yield learning in integrated circuit package assembly

    Publication Year: 1997 , Page(s): 133 - 141
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (148 KB)  

    This paper describes a yield learning model for integrated circuit package assembly. The goal was to provide a management tool for making yield projections, resource allocations, understanding operating practices, and performing what-if analyses. The model was developed using a series of case studies of packages entering manufacturing. These studies were a tape carrier package (TCP) at Intel, Chan... View full abstract»

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  • Intelligent X-ray inspection for quality control of solder joints

    Publication Year: 1997 , Page(s): 111 - 120
    Cited by:  Papers (17)  |  Patents (5)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (248 KB)  

    Today automated X-ray inspection is a reliable technique for inline process monitoring and 100% quality control of solder joints. In order to further optimize X-ray inspection there are three key tasks: (1) improvement of X-ray sensors with respect to resolution and contrast; (2) development and integration of three-dimensional (3-D) tomographic reconstruction algorithms in order to separate super... View full abstract»

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  • Technology and change in the Chinese electronics industry

    Publication Year: 1997 , Page(s): 142 - 151
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (136 KB)  

    A wide-ranging study of the technological capability of the mainland China electronics industry has been conducted. The study reveals that the Chinese industry is driven to improve technologically mainly by foreign technology transfer, though local process innovation has been observed that can improve the output of foreign process technology. Surface mount manufacturing technology is common in Chi... View full abstract»

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  • Automatic classification of wafer defects: status and industry needs

    Publication Year: 1997 , Page(s): 164 - 167
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (88 KB)  

    This paper describes the automatic defect classification (ADC) beta site evaluations performed as part of the SEMATECH ADC project. Two optical review microscopes equipped with ADC software were independently evaluated in manufacturing environments. Both microscopes were operated in bright-field mode with white light illumination, ADC performance was measured on three process levels of random logi... View full abstract»

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  • A self-tuning EWMA controller utilizing artificial neural network function approximation techniques

    Publication Year: 1997 , Page(s): 121 - 132
    Cited by:  Papers (27)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (208 KB)  

    Recent works have shown that an exponentially weighted moving average (EWMA) controller can be used on semiconductor processes to maintain process targets over extended periods for improved product quality and decreased machine downtime. Proper choice of controller parameters (EWMA weights) is critical to the performance of this system. This work examines how different process factors affect the o... View full abstract»

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  • Alternative facility layouts for semiconductor wafer fabrication facilities

    Publication Year: 1997 , Page(s): 152 - 163
    Cited by:  Papers (9)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (468 KB)  

    Semiconductor wafer fabrication facilities are widely acknowledged to be among the most complicated industrial systems from a production planning and control point of view. The design of most wafer fabrication facilities has followed the process layout, where similar machines are located together. This feeds to complex, reentrant product flows through the facility. In this paper, we examine the ef... View full abstract»

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Aims & Scope

This Transaction ceased production in 1998. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope