By Topic

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C

Issue 3 • Date July 1996

Filter Results

Displaying Results 1 - 9 of 9
  • The 17th EOS/ESD Symposium

    Publication Year: 1996, Page(s): 0_1
    Request permission for commercial reuse | PDF file iconPDF (28 KB)
    Freely Available from IEEE
  • Advanced CMOS protection device trigger mechanisms during CDM

    Publication Year: 1996, Page(s):169 - 177
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (204 KB)

    The charged device model (CDM) is now considered to be an important stress model for defining electrostatic discharge (ESD) reliability of integrated circuit (IC) chips. This paper examines the CDM performance for three different advanced protection devices in an 0.35-μm LDD complementary metal-oxide semiconductor (CMOS) technology. Through failure analysis and device simulations, the behavior ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Area bonding conductive epoxy adhesives for low-cost grid array chip carriers

    Publication Year: 1996, Page(s):184 - 188
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (128 KB)

    This paper describes a new type of Z-axis epoxy film adhesive, called area bonding conductive (ABC) epoxies, to replace solder and solder balls for surface mounting grid array chip carriers. The ABC adhesives are made by a low-cost screen printing process, starting from customer-supplied artwork, so that the conductive epoxy regions are located only at the desired bond pad locations. Reliability d... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A design for assembly evaluation methodology for photonic systems

    Publication Year: 1996, Page(s):189 - 200
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (256 KB)

    Photonic systems typically consist of components and subassemblies whose functions may be categorized as optical, electronic, or mechanical. In the present study, it is demonstrated that unlike mechanical assemblies, building optical assemblies typically involves only a few parts, but a large number of alignment/adjustment operations. So, the techniques of design for assembly (DFA) that are based ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Novel clamp circuits for IC power supply protection

    Publication Year: 1996, Page(s):150 - 161
    Cited by:  Papers (28)  |  Patents (171)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (240 KB)

    Biased and terminated p-n-p transistor chains are made from floating n-wells in p-substrate complementary metal-oxide semiconductor (CMOS) and used for power supply electrostatic discharge (ESD) clamps. The p-n-p gain may allow a compact termination circuit to be used, resulting in a stand-alone clamp. Bipolar p-n-p action accounts for unwanted low-voltage conduction as well as for very desirable ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A fast and accurate method for measuring the dielectric constant of printed wiring board materials

    Publication Year: 1996, Page(s):214 - 225
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    A new time-domain-reflectometry measurement method is described that provides accurate measurements of the average high-frequency (0.1 GHz to 5 GHz) dielectric constant of printed wiring board (PWB) materials and that is suitable for “factory-floor” usage. A parallel-plate transmission line is used for the sample geometry. A model is developed that describes the electrical behavior of ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • ESD evaluation methods for a charged device model

    Publication Year: 1996, Page(s):162 - 168
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (172 KB)

    Through the investigation of several evaluation methods for charged device model (CDM) ESD, the following results have been found: (1) although the waveforms of the small capacitance method (SCM-10 pF, 0 Ω) and three commercial pieces of CDM equipment are different, the destructive voltage for dielectric failure are equivalent. SCM is an efficient and easy test method for high-speed ESD eval... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Numerical calculation and measurement of transient fields from electrostatic discharges

    Publication Year: 1996, Page(s):178 - 183
    Cited by:  Papers (31)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (172 KB)

    The paper compares measured and numerically calculated results of currents and transient fields caused by electrostatic discharges (ESDs). An algorithm based on the magnetic field integral equation was combined with an arc model. It takes the nonlinearity of the arc and the dependence of the breakdown process on the arc length into account. It can calculate the discharge currents and the transient... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Excimer laser projection micromachining of polyimide thin films annealed at different temperatures

    Publication Year: 1996, Page(s):201 - 213
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (204 KB)

    A KrF excimer laser projection micromachining tool has been designed and implemented aiming to accomplish one-step etching with micron resolution for applications such as chip module packaging and polyimide technology in semiconductor manufacturing. Two polyimide (Probimide(R) 7020) thin films spun on the silicon wafers are annealed at 100°C and 400°C, respectively, in order to ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Transaction ceased production in 1998. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope