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Browse Journals & Magazines > Components, Packaging, and Man ... Volume 19 Issue 4

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

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Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Issue 4 • Date Oct. 1996

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1996 Index IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C: Manufacturing Vol. 19

Mechanical failure in COB-technology using glob-top encapsulation

Process induced residual stresses in isotropically conductive adhesive joints

FCOB reliability evaluation simulating multiple rework/reflow processes

Use of neural networks in modeling relations between exposure energy and pattern dimension in photolithography process [MOS ICs]

Electrically conductive adhesives for surface mount solder replacement

Effect of polyimide processing on multichip glass ceramic module fabrications

Surface insulation resistance methodology for today's manufacturing technology

Run by run control of chemical-mechanical polishing

A robust metric for measuring within-wafer uniformity

Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory

Lasersonic bonding of TAB components to epoxy-glass circuit boards

The Second "Adhesives '96" International Conference

Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment

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