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Electrical Insulation Magazine, IEEE

Issue 1 • Date Jan.-Feb. 1996

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Displaying Results 1 - 12 of 12
  • Partial discharge. XXII. High frequency attenuation in shielded solid dielectric power cable and implications thereof for PD location

    Publication Year: 1996 , Page(s): 9 - 16
    Cited by:  Papers (48)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (948 KB)  

    PD testing and location is an essential part of factory testing of shielded solid dielectric power cable. The accuracy with which a PD source can be located is limited by high frequency attenuation of PD pulses as they propagate through the cable. View full abstract»

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  • Progress in Japan of space charge field measurement in gaseous dielectrics using a Pockels sensor

    Publication Year: 1996 , Page(s): 17 - 28
    Cited by:  Papers (13)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1427 KB)  

    The practical application of Pockels voltage and field sensors to electric power networks is expected to continue to increase not only in Japan but also throughout the world, with the introduction of optical telecommunication technology. View full abstract»

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  • Electrical strength of pressboard components for transformer insulations

    Publication Year: 1996 , Page(s): 29 - 33
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (466 KB)  

    More and more, the insulation systems used in oil-filled transformers consist of oil-impregnated pressboard placed around the low and high-voltage windings and supported by the iron core. This system provides high mechanical stability both in the main and end insulation areas. The thin oil layers within the multilayer pressboard structure result in high electrical strength, which increases with pressboard density. In addition, the oil passing between the individual pressboard components of the insulation structure allows for heat dissipation, so that the necessary electrical and thermal performance may be achieved provided the insulation is sized correctly. View full abstract»

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  • Orbegk receives Forster award at CEIDP

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (736 KB)  
    Freely Available from IEEE
  • HANDBOOK OF ELECTRICAL AND ELECTRONIC INSULATING MATERIALS, SECOND EDITION {Schoch's Review]

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (162 KB)  
    Freely Available from IEEE
  • Plastics Additives, Fourth Edition [Schoch's Review]

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (160 KB)  
    Freely Available from IEEE
  • Hybrid Microelectronics Handbook, Second Edition [Schoch's Review]

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (297 KB)  
    Freely Available from IEEE
  • Sensor Technology and Devices [Schoch's Review]

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (145 KB)  
    Freely Available from IEEE
  • Polymer Films in Sensor Applications [Schoch's Review]

    Publication Year: 1996
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | PDF file iconPDF (145 KB)  
    Freely Available from IEEE
  • Lifeskills and Leaderhsip for Engineers [Schoch's Review]

    Publication Year: 1996
    Save to Project icon | Request Permissions | PDF file iconPDF (145 KB)  
    Freely Available from IEEE
  • Engineering Your Future [Schoch's Review]

    Publication Year: 1996
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    Freely Available from IEEE
  • The Career Trap [Schoch's Review]

    Publication Year: 1996
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    Freely Available from IEEE

Aims & Scope

The EI Magazine is specifically concerned with publishing articles in the development and characterization of the dielectric, chemical, mechanical, and environmental properties of all vacuum, gaseous, liquid, and solid electrical insulation, and with utilization of these materials in circuits and systems under conditions of use.

Full Aims & Scope

Meet Our Editors

Co-Editor-in-Chief
Edward Cherney

Co-Editor-in-Chief
Robert Fleming