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IEEE Circuits and Devices Magazine

Issue 2 • March 1990

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  • Low-temperature electronics

    Publication Year: 1990, Page(s):12 - 24
    Cited by:  Papers (39)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1470 KB)

    An overview of semiconductor-based and superconductor-based low-temperature electronics is presented. The general issues of reliability and thermal expansion mismatch are discussed. The discussion of semiconductor electronics starts with a description of a cryogenic supercomputer, the ETA, and then covers devices and materials, noise and applications to signal processing for sensors. Superconducto... View full abstract»

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  • Scanning optical microscopes close in on submicron scale

    Publication Year: 1990, Page(s):28 - 31
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (706 KB)

    The principles and advantages of the confocal scanning optical microscope (CSOM) are described, and the history of the concept is given. The CSOM is compared with the scanning electron microscope, scanning acoustic microscope, scanning tunneling microscope, scanning force microscope, and near-field scanning optical microscope. The imaging properties and applications of the CSOM are discussed.< View full abstract»

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  • NSF engineering centers aim to revitalize industry

    Publication Year: 1990, Page(s):37 - 41
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (524 KB)

    The National Science Foundation initiated the Engineering Research Centers (ERC) Program in 1985 in response to concern that US industries have not been as successful as their international competitors at converting the fruits of basic and applied research into profitable commercial ventures. A description is given of aspects of the program at the University of Illinois, Columbia University, and U... View full abstract»

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  • Hybrid microelectronics: Old hat for new times?

    Publication Year: 1990, Page(s):42 - 47
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (565 KB)

    The proliferation of hybrid techniques, which are adapting to new demands in automotive electronics, household appliances, packaging structures for the VHSIC program, and many other applications, is examined. Thick- and thin-film materials, design, and processing are described and compared. The use of multilayer ceramic systems and advances in power hybrids and hybrid microwave integrated circuits... View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

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Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org