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Delay-Based Macromodeling of Long Interconnects From Frequency-Domain Terminal Responses
Chinea, A.; Triverio, P.; Grivet-Talocia, S.
Page(s): 1-11
Digital Object Identifier: 10.1109/TADVP.2008.2010525
Abstract | Full Text:
PDF (1763 KB)
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FPGA Based System for Open, Short, and RC Impedance Measurement
Newman, K. E.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2018463
Abstract | Full Text:
PDF (638 KB)
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Power-Bus Sensitivity Analysis
De Camillis, L.; Antonini, G.; Jandhyala, V.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2022322
Abstract | Full Text:
PDF (1235 KB)
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Fine-Pitch Capabilities of the Flat Ultra-Thin Chip Packaging (UTCP) Technology
Govaerts, J.; Bosman, E.; Christiaens, W.; Vanfleteren, J.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2018134
Abstract | Full Text:
PDF (1022 KB)
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Analysis of Shielded Electromagnetic Bandgap Structures Using Multiconductor Transmission-Line Theory
Payandehjoo, K.; Tavallaee, A.; Abhari, R.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2019266
Abstract | Full Text:
PDF (1454 KB)
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$z$ -Domain Orthonormal Basis Functions for Physical System Identifications
Nouri, B.; Achar, R.; Nakhla, M. S.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2019965
Abstract | Full Text:
PDF (795 KB)
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Fast Reduced-Order Finite-Element Modeling of Lossy Thin Wires Using Lumped Impedance Elements
Lee, S.-H.; Jin, J.-M.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2015958
Abstract | Full Text:
PDF (724 KB)
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Fast Passivity Enforcement for S-Parameter Models by Perturbation of Residue Matrix Eigenvalues
Gustavsen, B.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2008.2010508
Abstract | Full Text:
PDF (1040 KB)
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Hierarchical Finite-Element Reduction-Recovery Method for Large-Scale Transient Analysis of High-Speed Integrated Circuits
Gan, H.; Jiao, D.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2019844
Abstract | Full Text:
PDF (883 KB)
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On-Chip Coupled Transmission Line Modeling for Millimeter-Wave Applications Using Four-Port Measurements
Kang, K.; Brinkhoff, J.; Shi, J.; Lin, F.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2024212
Abstract | Full Text:
PDF (2300 KB)
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Active Heatsink Antenna for Radio-Frequency Transmitter
Alnukari, A.; Guillemet, P.; Scudeller, Y.; Toutain, S.
Page(s): 1-8
Digital Object Identifier: 10.1109/TADVP.2009.2023858
Abstract | Full Text:
PDF (1197 KB)
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Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz
Hwang, S.; Min, S.; Swaminathan, M.; Venkatakrishnan, V.; Chan, H.; Liu, F.; Sundaram, V.; Kennedy, S.; Baars, D.; Lacroix, B.; Li, Y.; Papapolymerou, J.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2023413
Abstract | Full Text:
PDF (1862 KB)
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Parallel Simulation of Massively Coupled Interconnect Networks
Paul, D.; Nakhla, N. M.; Achar, R.; Nakhla, M. S.
Page(s): 1-13
Digital Object Identifier: 10.1109/TADVP.2009.2025263
Abstract | Full Text:
PDF (854 KB)
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Peridynamic Theory for Thermomechanical Analysis
Kilic, B.; Madenci, E.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2029079
Abstract | Full Text:
PDF (861 KB)
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The Impact of On-Wafer Calibration Method on the Measured Results of Coplanar Waveguide Circuits
Li, Q.; Melde, K. L.
Page(s): 1-8
Digital Object Identifier: 10.1109/TADVP.2009.2025365
Abstract | Full Text:
PDF (1097 KB)
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Guaranteed Passive Parameterized Admittance-Based Macromodeling
Ferranti, F.; Knockaert, L.; Dhaene, T.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2029242
Abstract | Full Text:
PDF (1150 KB)
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Fast Iterative Solution Algorithms in the Frequency-Domain Layered Finite Element Method for Analyzing Integrated Circuits
Sheng, F.; Gan, H.; Jiao, D.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2029561
Abstract | Full Text:
PDF (786 KB)
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Time Domain Delay Extraction-Based Macromodeling Algorithm for Long-Delay Networks
Charest, A.; Nakhla, M. S.; Achar, R.; Saraswat, D.; Soveiko, N.; Erdin, I.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2029560
Abstract | Full Text:
PDF (1472 KB)
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Simplified Delay Extraction-Based Passive Transmission Line Macromodeling Algorithm
Nakhla, N.; Nakhla, M.; Achar, R.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2032157
Abstract | Full Text:
PDF (738 KB)
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Parametric Macromodeling of Lossy and Dispersive Multiconductor Transmission Lines
Ferranti, F.; Antonini, G.; Dhaene, T.; Knockaert, L.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2027892
Abstract | Full Text:
PDF (1313 KB)
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Rapid Assessment of BGA Fatigue Life Under Vibration Loading
Wu, M.-L.; Barker, D.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2025890
Abstract | Full Text:
PDF (887 KB)
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Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device
Jeong, B.-G.; Ham, S.-J.; Moon, C.-Y.; Kim, B.-S.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2019843
Abstract | Full Text:
PDF (1670 KB)
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Wideband Circuit Model for Planar EBG Structures
Mohajer-Iravani, B.; Ramahi, O. M.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2021156
Abstract | Full Text:
PDF (1365 KB)
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Fast Reduction Algorithms in the Frequency-Domain Layered Finite Element Method for the Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits
Sheng, F.; Jiao, D.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2014353
Abstract | Full Text:
PDF (844 KB)
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Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics
Wu, B.; Tsang, L.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2026482
Abstract | Full Text:
PDF (838 KB)
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Correction of the Method of Images for Partial Inductance Calculations of QFP
Paoletti, U.; Hisakado, T.; Wada, O.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2032927
Abstract | Full Text:
PDF (1103 KB)
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LTCC Spiral Inductor Synthesis and Optimization With Measurement Verification
Lu, H.-C.; Chan, T. B.; Chen, C. C.-P.; Liu, C.-M.; Hsing, H.-J.; Huang, P.-S.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2028636
Abstract | Full Text:
PDF (1402 KB)
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Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking
Lin, K. L.; Chae, J.; Jain, K.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2032158
Abstract | Full Text:
PDF (2661 KB)
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Comments on “Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging”
Yin, H. M.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033571
Abstract | Full Text:
PDF (98 KB)
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Finite-Difference Analysis of Interconnects With Frequency-Dependent Parameters Based on Equivalent Circuit Models
Tang, M.; Mao, J.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033200
Abstract | Full Text:
PDF (490 KB)
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On Simplified Fast Modal Analysis for Through Silicon Vias in Layered Media Based Upon Full-Wave Solutions
Guo, Z.; Pan, G. (G).
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033034
Abstract | Full Text:
PDF (910 KB)
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Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)
Choi, J.; Govind, V.; Swaminathan, M.; Bharath, K.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033705
Abstract | Full Text:
PDF (1556 KB)
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Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications
Joo, S.; Baldwin, D. F.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033809
Abstract | Full Text:
PDF (2117 KB)
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IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
de Paulis, F.; Raimondo, L.; Orlandi, A.
Page(s): 1-1
Digital Object Identifier: 10.1109/TADVP.2009.2033572
Abstract | Full Text:
PDF (964 KB)
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