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Date 28-29 Jan. 1989

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Displaying Results 1 - 23 of 23
  • Automotive Power Electronics (Cat. No.89TH0299-8)

    Publication Year: 1989
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    Freely Available from IEEE
  • EMC related issues for power electronics

    Publication Year: 1989, Page(s):46 - 53
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    Various issues related to the electromagnetic compatibility (EMC) of the automotive electronic system are discussed. As a case study, experiments performed to demonstrate the importance of proper wire harness routing and configuration to avoid ignition noise coupling to the vehicle's entertainment system are also reported. Definitions for five major requirements of EMC assurance are discussed. The... View full abstract»

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  • High speed solenoid control techniques

    Publication Year: 1989, Page(s):54 - 59
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    Some specialized power control strategies and electronic drive circuits available to enhance solenoid performance, together with a discussion on the relative merits of each, are presented. The operating principles of the solenoid are examined, and some insight is given as to the areas where it is possible to benefit from power control techniques. Digital solutions to the equations governing soleno... View full abstract»

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  • An improved automotive power distribution system using nonlinear resonant switch converters

    Publication Year: 1989, Page(s):60 - 65
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (516 KB)

    Insertion of a DC-DC converter between the automobile battery and electrical loads is proposed. This allows gradual conversion to higher battery voltage, regulation of DC distribution voltage, and multiple distribution voltage levels. Switching loss arising from parasitic inductances is a serious problem in this application. The nonlinear resonant switch can remove this source of loss, achieving z... View full abstract»

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  • Electronic packaging reliability in automotive applications

    Publication Year: 1989, Page(s):79 - 83
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given View full abstract»

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  • Future directions in semiconductor technology for automotive power electronics

    Publication Year: 1989
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (64 KB)

    The authors reports on a panel session which was organized to discuss developments in power semiconductor technology suitable for automotive applications. The panel was chaired by the author, and the panel members were Kailash Jain, King Owyang, Miro Glogolja, Larry Latham, and Bill Dunn. The topics covered were device breakdown voltage specification, the best devices for low and high voltages, di... View full abstract»

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  • TI-Strate-a new substrate for automotive power electronics

    Publication Year: 1989, Page(s):98 - 102
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (452 KB)

    The thermal, dielectric, mechanical, and automotive application related properties of a substrate called TI-Strate, formed by a laminate of a metal, a polymer and a metal are studied. Aspects are examined of the interaction between the materials used in the system and the processing and environmental parameters and their effect on the properties of the substrate. Data presented show the resistance... View full abstract»

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  • The impact of the automotive environment on power semiconductors

    Publication Year: 1989, Page(s):84 - 88
    Cited by:  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (416 KB)

    The authors discuss: (1) the increased use of power semiconductors (specifically power MOSFETs) in automotive applications; (2) environmental factors that have an impact on device cost; (3) changes that should be made to vehicles to reduce component and system cost; and (4) recent power semiconductor developments that increase the chances of survival in the harsh automotive environment. Basic powe... View full abstract»

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  • Trench j-MOS power field-effect transistors

    Publication Year: 1989, Page(s):3 - 8
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    A normally-on MOSFET structure called j-MOS for automotive electronic systems applications is discussed. These devices are built on silicon-on-insulator (SOI) and in bulk silicon and can be integrated as a smart power circuit element. The lowest on-resistance j-MOS device is built in an ideal trench configuration in bulk silicon and can be operated in either a three-terminal or a four-terminal mod... View full abstract»

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  • Summary of additional topics from the session on packaging and reliability

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (100 KB)

    High-temperature electronics for automotive applications are discussed. It is reported that, by extending existing technology, automotive electronics can be operated at temperatures between 150°C and 200°C. Automotive load dump and its effect on reliability and future automotive electronics development are also discussed. It is stated that the improved efficiency that can be achieved by op... View full abstract»

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  • Smart power integration for automotive applications

    Publication Year: 1989, Page(s):119 - 125
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (460 KB)

    Some of the unique requirements of automotive power electronics applications are reviewed, and the technology approaches that can be applied to the requirements are shown. Tradeoffs in terms of technology selection, MOS versus bipolar, and structure are discussed. IC design examples are presented to illustrate the tradeoff selections for applications like high side drivers, ignition, and low side ... View full abstract»

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  • A fiber optic connection system designed for automotive applications

    Publication Year: 1989, Page(s):39 - 45
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (452 KB)

    A fiber optic connection system designed specifically to meet automotive requirements is presented. Application requirements are defined, potential solutions are reviewed, and a connection system designed to meet these requirements is presented. The design considerations discussed include fiber selection, electrooptical device packaging, optical receiver selection, light-emitting diode (LED) devic... View full abstract»

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  • Automotive electrically driven air conditioner system

    Publication Year: 1989, Page(s):71 - 72
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (204 KB)

    An automotive electric air conditioning system is described. The system utilizes a brushless DC motor with back electromotive force (EMF) sensing in lieu of a position sensor. A 96 V power supply is proposed to reduce line current to well under 50 A. The motor and the back EMF sensing are described in detail. The electric system developed includes a hermetically sealed motor and plumbing similar t... View full abstract»

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  • Automotive power integrated circuit processes

    Publication Year: 1989, Page(s):106 - 108
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    Power integrated circuit (IC) processes are discussed with an emphasis on a bipolar power IC process developed by Texas Instruments. This power technology offers advantages in ruggedness, flexibility, and cost over other processes. The power device closely resembles a conventional single diffused bipolar power transistor. A comparison of safe operating area characteristics of several current power... View full abstract»

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  • Single switch dual output converter dynamic behavior and operating range

    Publication Year: 1989, Page(s):66 - 70
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (212 KB)

    The dynamic behavior and the operating range of a single-switch dual-output DC-DC converter is presented. The circuit is developed for automotive applications requiring regulated 12 V and 5 V supplies from a 24 V battery. The converter provides two independently regulated DC outputs from a single DC voltage source using one power semiconductor switch. Two discrete closed-loop feedback paths regula... View full abstract»

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  • Advances in discrete semiconductor packaging

    Publication Year: 1989, Page(s):76 - 78
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (180 KB)

    Surface-mount and module-type discrete semiconductor packaging are discussed. Packaged product development, pilot production techniques, and a clean room environment are also discussed. A breed of module introduced by Motorola called ICePAK, which combines the high-volume production techniques normally associated with discrete components with customization capability, the key element of the hybrid... View full abstract»

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  • Power MOS automotive electronics

    Publication Year: 1989, Page(s):30 - 35
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    Two power technologies, bipolar and MOS, with several variations in both technologies are evaluated for use in such automotive applications as lamps, motors, solenoids, heaters, ignition coils, voltage regulators, and displays. To determine which MOS technology variant will be most cost effective in a specific application, broad guidelines are given for the end user. Power MOS is constantly being ... View full abstract»

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  • Transient thermal impedance considerations in power semiconductor applications

    Publication Year: 1989, Page(s):89 - 97
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (560 KB)

    Cost-effective thermal design in power switching applications must consider the effect of thermal impedance of the packaging. A test method is presented for determining the transient thermal impedance of a package. Empirical measurements of the thermal impedance of some standard plastic packages, showing the effective thermal impedance under pulsed conditions, are also given. As an example of a pr... View full abstract»

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  • A bipolar smart power technology for high voltage applications

    Publication Year: 1989, Page(s):27 - 29
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (200 KB)

    A technology is discussed which allows integration of n-p-n and p-n-p transistors with a multistage Darlington output designed for voltages up to UCBO=600 V. With this technology, circuit functions like temperature-compensated current regulation and internal voltage clamping can be realized. A special MOS voltage clamping can be realized. A special MOS arrangement is employed t... View full abstract»

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  • PWM controllers for automotive applications

    Publication Year: 1989, Page(s):114 - 118
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    The pulse width modulation (PWM) circuit approaches used in such applications as switching mode voltage regulators, positional motor control, fuel injector drivers, ignition drivers, and ABS control are discussed, as are the process-performance tradeoffs. The power efficiency improvements and switching considerations which lead to reduced-temperature IC operation when PWM is used are demonstrated.... View full abstract»

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  • Smartdiscretes, new products for automotive applications

    Publication Year: 1989, Page(s):109 - 113
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Device structures and characteristics for three Smartdiscretes which have automotive applications are presented. Smartdiscretes are discrete power devices which incorporate a few small signal devices on a chip without added process complexity. The first is a power MOSFET with very low on-resistance and an integral temperature sensor. The second is an ignition coil driver with a temperature-compens... View full abstract»

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  • A high current short circuit tolerant MOSFET switch

    Publication Year: 1989, Page(s):15 - 26
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (716 KB)

    A type of MOSFET used for short-circuit protection, called a TEMPFET (temperature protected FET), is discussed. It is a MOSFET with built-in thermal protection. A temperature sensitive sensor chip connected between the gate and source electrodes becomes electrically conductive when the junction temperature exceeds 155-160°C. The low impedance path between the gate and source terminals effectiv... View full abstract»

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  • Advances in power MOSFET technologies for automotive applications

    Publication Year: 1989, Page(s):9 - 14
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB)

    Two advanced 60 V power MOSFET technologies are presented for automotive applications. The first is a submicron channel DMOS technology which yields a specific on-resistance of 1.7 mΩ-cm2, about half the value obtained by present production DMOS devices. The second is a trench DMOS technology developed to yield 1.1 mΩcm2 of specific on-resistance. Devices fabricat... View full abstract»

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