Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade

12-17 Feb. 1989

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  • Ninth IEEE/CHMT International Electronic Manufacturing Technology Symposium. Competitive Manufacturing for the Next Decade. Proceedings 1990 IEMT Symposium (Cat. No. 90CH2864-7)

    Publication Year: 1990
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    Freely Available from IEEE
  • Manufacturing electronic equipment in Europe

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (108 KB)

    Summary form only given. The author explores the current structure of electronic equipment manufacturers in Europe and speculates on the likely changes that will occur in the industry as the wider political and economic changes work through a large, affluent, electronically developing market. Western Europe consists of 18 nations, 12 of whom will form the European Community and a single market ent... View full abstract»

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  • International cooperation to develop intelligent manufacturing systems (IMS)

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (88 KB)

    Summary form only given. The author discusses some aspects of advanced manufacturing and the advantages of international collaboration and suggests some areas for collaboration. He outlines the Japanese intelligent manufacturing system (IMS) proposal and enumerates its background. The IMS proposal includes the following elements: (1) the move away from manufacturing by the work force, (2) the appe... View full abstract»

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  • An automated solder application process for TAB and fine pitch surface mount assembly

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (46 KB)

    Summary form only given. Technology has been developed that provides for high-yielding, low-variability solder application to fine pitch component card sites. The technology was developed specifically for the hot bar reflow outer lead bond attachment process associated with tape automated bonding (TAB): however, it can be extended to hot bar quad flat pack component attachment and to automated sit... View full abstract»

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  • Run by run process control

    Publication Year: 1990
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (51 KB)

    Summary form only given. The authors present an approach to process control in VLSI processing where the recipe is modified between every product run, based on measured results, in order to compensate for small drifts and shifts. This approach is implemented in the run-by-run controller, which is part of a process control system being developed at MIT. The run-by-run controller implements a form o... View full abstract»

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  • Applications of MPSX/MIP370 with ECL in optimum configuration of text fixtures in electronic cards assembly and test

    Publication Year: 1990, Page(s):120 - 122
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (240 KB)

    The author describes two applications of MPSX/MIP370 with ECL (mathematical programming system extended/mixed integer programming with the extended control language) in design configuration of fixtures commonly used for in-circuit testing of electronic boards. The applications described are used by IBM Austin's electronic card assembly and test line, which is responsible for the bulk of PS/2 board... View full abstract»

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  • Static simulation: a new method of facility automation analysis

    Publication Year: 1990, Page(s):114 - 119
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (640 KB)

    An example of a typical factory is presented in order to compare the requirements and the results of three methods for analyzing manufacturing facilities. While the process of obtaining the data is the same for the different types of modeling, the development of the model is different. The three methods are static modeling (the spreadsheet); dynamic simulation, which solves the requirement for obt... View full abstract»

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  • Turning just-in-time concepts into reality: successful examples of change

    Publication Year: 1990, Page(s):256 - 263
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    The author presents the progressive changes which have been made in five areas of material flow methods and procedures to incorporate just-in-time methods and total quality control through all areas of a business. The five areas are: (1) request and delivery of materials from the storeroom to each of the focused factories, (2) the elimination of make items in the storeroom, (3) the direct movement... View full abstract»

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  • Statistical design techniques for high-speed circuit boards with correlated structure distributions

    Publication Year: 1990, Page(s):185 - 191
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (432 KB)

    New statistical design techniques have been developed for the line structures of high-speed circuit boards. These techniques account for dimensional distribution correlations caused by the fabrication process. Monte Carlo simulation is introduced into the finite-element method for calculating line parameters. The eye-pattern at the receiving end of transmission lines with parallel and stub parts i... View full abstract»

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  • Desorption of moisture from stainless steel tubes and ceramic filters in high purity gas distribution systems

    Publication Year: 1990, Page(s):162 - 165
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (304 KB)

    The mechanism of moisture desorption from both stainless steel and ceramic surfaces is studied. A unique experimental setup was designed and utilized to determine desorption under gas flow conditions by monitoring the moisture concentration at the system outlet. A simple analytical technique that was used to analyze the desorption data so acquired, in an effort to normalize the results and thus ma... View full abstract»

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  • Technology development: focus on manufacturability

    Publication Year: 1990, Page(s):334 - 339
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (476 KB)

    The authors discuss the integration of manufacturability from the early stages of technology development based on the experiences of the leading-edge semiconductor development program at IBM's facility in Essex Junction, Vermont. An overview is presented of the methods used, the resultant line and information architectures developed, and experience and results to date. Major changes in the technol... View full abstract»

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  • MAXX: a manufacturing oriented simulator

    Publication Year: 1990, Page(s):109 - 113
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (396 KB)

    MAXX is a manufacturing oriented simulator designed for detailed modeling and analysis of a manufacturing line. MAXX Version 4 is designed to evaluate a manufacturing line not only for steady-state long-term performance, but also for transient performance based on short-term production schedules. At the same time, it is easy and efficient to use. A methodology for dealing with the tradeoff is desc... View full abstract»

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  • Synchronizing manufacturing and materials flows

    Publication Year: 1990, Page(s):252 - 255
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (380 KB)

    The authors discuss a new logistics project being developed and implemented to synchronize materials flow with manufacturing. Called network management, the project is intended to satisfy the following requirements: recognize that not all parts should be ordered or controlled in the same manner; develop a system to classify parts to better determine what control mechanism to apply to which parts; ... View full abstract»

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  • Material handling automation for wafer fabrication facilities

    Publication Year: 1990, Page(s):277 - 286
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (884 KB)

    A detailed analysis of the needs and requirements for successfully designing and implementing automated material handling and control systems in wafer fabs is presented. In addition, potential system configurations and options for both interbay and intrabay material handling designs are discussed. The control system requirements, the importance of total systems integration, and the role of the ski... View full abstract»

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  • Distributed control systems in automated IC manufacturing

    Publication Year: 1990, Page(s):155 - 161
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (584 KB)

    The authors describe the use of direct digital control systems at the diffusion furnace level and cell-level supervisory systems for the collection and analysis of production data. The application of integrated computer control to the manufacture of advanced ICs is shown to have a measurable impact on device parameters, wafer throughput, repeatability, and product quality. A representative example... View full abstract»

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  • Experimental modeling of the etch characteristics of polysilicon in CCl4/He/O2 plasmas

    Publication Year: 1990, Page(s):73 - 76
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (296 KB)

    The objective is to obtain a comprehensive set of statistical models for a variety of process data which accurately represent the behavior of a specific piece of equipment under a wide range of etch conditions. In particular, this study focuses on the control of etch rate, uniformity, and selectivity of n+-doped polysilicon in a CCl4/He/O2 plasma generated by a Lam... View full abstract»

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  • Mechatronics, systems and elements

    Publication Year: 1990, Page(s):329 - 333
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (372 KB)

    The author introduces and defines mechatronics and its elements. The term has come to designate all complex products/processes requiring the integration of electronic, mechanical, computer (microprocessor), consumer, industrial, and military products. The topics described are mechatronics systems elements; subsystem technology; challenges for US industry; US academic institution challenges; educat... View full abstract»

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  • Detail vs. simplifying assumptions for simulating semiconductor manufacturing lines

    Publication Year: 1990, Page(s):103 - 108
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (324 KB)

    Simulating semiconductor manufacturing lines is necessary in order to understand how various factors interact to affect the performance of these complex lines. The author reports on the effects of the commonly made assumptions of no rework, representing rework by increasing process times, no operator constraints, and no machine failures. The author uses a detailed, flexible model in which the assu... View full abstract»

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  • A high dielectric constant thick film capacitor with copper electrode

    Publication Year: 1990, Page(s):247 - 251
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (316 KB)

    A high-dielectric-constant thick-film capacitor with a copper electrode has been developed. The dielectric, which consists of the composition Pb(Mg1/3Nb2/3)0.7Ti0.2 (Ni1/2W1/2)0.1O3 and 15 mol.% of PbO2NiO, is added as a sintering aid. The use of PbO2 makes it possible to manufacture the t... View full abstract»

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  • A rule based flow control plan for management of work-in-process

    Publication Year: 1990, Page(s):270 - 276
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (520 KB)

    The authors describe development of an integrated movement handling and work-in-process management system of an automated storage and retrieval system that is used as the material handling system for a highly automated electronic card assembly line. The line is designed for high-volume assembly of surface mount technology electronic boards. Use of an automated storage and retrieval system for work... View full abstract»

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  • Statistical control of VLSI fabrication processes

    Publication Year: 1990, Page(s):174 - 183
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (840 KB)

    The authors present a formal approach to statistical process control of VLSIC fabrication processes. The system, developed at Carnegie Mellon University (CMU), aims at integrating the design (process and layout), wafer processing, testing, diagnosis, and control into a set of strongly interacting procedures that will aim at maximizing the profit from the fabrication line. The authors describe an i... View full abstract»

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  • FUSION: a plan for developing a familiar user-system interface for the IC fabrication industry

    Publication Year: 1990, Page(s):150 - 154
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (476 KB)

    The author discusses the concept of developing a set of industry guidelines for a familiar user-system interface (USI) for IC-fabrication equipment called FUSION (familiar user-system interface operation). A familiar USI across the industry would allow process engineers, operators, and service technicians to learn only one set of interface conventions. Successful standardization would lead to redu... View full abstract»

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  • A dedicated multichip module automatic optical inspection system

    Publication Year: 1990, Page(s):51 - 55
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (328 KB)

    The design of an automatic optical inspection (AOI) system for multichip modules (MCMs) is discussed. The system differs from AOI tools designed for other applications due to the special characteristics of MCMs. The system consists of two subsystems: image acquisition and image processing. The critical issues concerning the components of each subsystem are discussed together with the different pos... View full abstract»

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  • CAFE-the MIT computer aided fabrication environment

    Publication Year: 1990, Page(s):297 - 305
    Cited by:  Papers (6)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (744 KB)

    The computer-aided fabrication environment (CAFE) is a software system being developed at MIT for use in the manufacture of integrated circuits. CAFE is intended to be used in all phases of process design, development, planning, and manufacturing of integrated-circuit wafers. The CAFE architectural framework supports a wide variety of software modules, including both development tools and online a... View full abstract»

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  • A generic computer simulation model to characterize photolithography manufacturing area in an IC fab facility

    Publication Year: 1990, Page(s):66 - 72
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (444 KB)

    A generic computer simulation model has been developed to characterize the photolithography area in a semiconductor fabrication facility at Intel. Use of simulation to study the impact of policy decisions on key manufacturing system parameters like product cycle time, line throughput, work-in-process inventory, and utilizations are discussed. Details on the structured modeling approach taken to de... View full abstract»

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