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Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade

12-17 Feb. 1989

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  • Ninth IEEE/CHMT International Electronic Manufacturing Technology Symposium. Competitive Manufacturing for the Next Decade. Proceedings 1990 IEMT Symposium (Cat. No. 90CH2864-7)

    Publication Year: 1990
    Request permission for commercial reuse | PDF file iconPDF (40 KB)
    Freely Available from IEEE
  • Manufacturing electronic equipment in Europe

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (108 KB)

    Summary form only given. The author explores the current structure of electronic equipment manufacturers in Europe and speculates on the likely changes that will occur in the industry as the wider political and economic changes work through a large, affluent, electronically developing market. Western Europe consists of 18 nations, 12 of whom will form the European Community and a single market ent... View full abstract»

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  • International cooperation to develop intelligent manufacturing systems (IMS)

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (88 KB)

    Summary form only given. The author discusses some aspects of advanced manufacturing and the advantages of international collaboration and suggests some areas for collaboration. He outlines the Japanese intelligent manufacturing system (IMS) proposal and enumerates its background. The IMS proposal includes the following elements: (1) the move away from manufacturing by the work force, (2) the appe... View full abstract»

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  • An automated solder application process for TAB and fine pitch surface mount assembly

    Publication Year: 1990
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (46 KB)

    Summary form only given. Technology has been developed that provides for high-yielding, low-variability solder application to fine pitch component card sites. The technology was developed specifically for the hot bar reflow outer lead bond attachment process associated with tape automated bonding (TAB): however, it can be extended to hot bar quad flat pack component attachment and to automated sit... View full abstract»

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  • Run by run process control

    Publication Year: 1990
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (51 KB)

    Summary form only given. The authors present an approach to process control in VLSI processing where the recipe is modified between every product run, based on measured results, in order to compensate for small drifts and shifts. This approach is implemented in the run-by-run controller, which is part of a process control system being developed at MIT. The run-by-run controller implements a form o... View full abstract»

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  • Manufacturing information systems and productivity improvement activities

    Publication Year: 1990, Page(s):12 - 16
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (256 KB)

    The author describes the development of a shop floor control systems (SFCSs) over the past decade and also discusses activities aimed at improving productivity through the use of an SFCS. An SFCS has the following functions: database operation, data collection, information services, and manufacturing equipment control and monitoring. Two examples of leading-edge and typical SFCSs in the Japanese e... View full abstract»

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  • Semiconductor manufacturing in the 21st century: capital investment vs. technological innovation

    Publication Year: 1990, Page(s):3 - 11
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (924 KB)

    The author describes the technological problems which must be solved if the goal of utilizing the dramatic improvements in cost/performance of computer technology to replace manufacturing methods which have become prohibitively expensive is to be realized. Envisioning a manufacturing environment of rapid change (anathema to most manufacturing organizations), three basic components of a futuristic ... View full abstract»

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  • Application of mechanical-technology CAD to microelectronic device design and manufacturing

    Publication Year: 1990, Page(s):350 - 355
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    A computer-aided-design (CAD) architecture for microelectromechanical systems is presented in which conventional mask layout and process simulation tools are linked to three-dimensional mechanical CAD and finite-element tools for analysis and simulation. The architecture is exercised at an elementary level by modeling the first steps of the MIT baseline CMOS process. An architecture for an object-... View full abstract»

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  • Placement for productibility and assembly: information requirements

    Publication Year: 1990, Page(s):340 - 349
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1460 KB)

    The information requirements of board-level electronics design and assembly processes are surveyed in an effort to identify and explain the importance of proper information utilization in electronics design. The information discussed is used to develop a methodology for placing microelectronic components on mixed-technology printed wiring boards as a function of component mix, component types, the... View full abstract»

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  • A rule based flow control plan for management of work-in-process

    Publication Year: 1990, Page(s):270 - 276
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    The authors describe development of an integrated movement handling and work-in-process management system of an automated storage and retrieval system that is used as the material handling system for a highly automated electronic card assembly line. The line is designed for high-volume assembly of surface mount technology electronic boards. Use of an automated storage and retrieval system for work... View full abstract»

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  • CEPT-a computer aided manufacturing application for managing equipment reliability and availability and maintainability in the semiconductor industry

    Publication Year: 1990, Page(s):31 - 40
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    The need for a comprehensive equipment information management system is crucial for driving high equipment reliability/utilization in manufacturing. The authors describe the features of one such system developed and implemented at Intel's factories. This equipment management system was layered on top of the preexisting shop-floor computer-aided-manufacturing (CAM) system, Workstream. Focus areas o... View full abstract»

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  • Technology development: focus on manufacturability

    Publication Year: 1990, Page(s):334 - 339
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The authors discuss the integration of manufacturability from the early stages of technology development based on the experiences of the leading-edge semiconductor development program at IBM's facility in Essex Junction, Vermont. An overview is presented of the methods used, the resultant line and information architectures developed, and experience and results to date. Major changes in the technol... View full abstract»

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  • Group technology for high-mix printed circuit assembly

    Publication Year: 1990, Page(s):264 - 269
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (524 KB)

    The authors chronicle the successful application of the greedy board heuristic to the problem of assigning individual printed circuit board assemblies to product cells in a high-mix, capacity-constrained production environment. The specific case presented concerns the design of a high-speed surface mount line. The algorithm requires a list of boards, board volumes, and a bill of materials for each... View full abstract»

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  • The equipment improvement program: a structured methodology for continuous improvement and increased equipment life

    Publication Year: 1990, Page(s):25 - 30
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB)

    The equipment improvement program, a SEMATECH initiative to help improve the US semiconductor industry's efficient use of capital equipment, is described. This program focuses on continuous performance improvement of existing equipment to meet current and future manufacturing requirements with the goal of extending their useful life by a generation. Working hand-in-hand with suppliers, these progr... View full abstract»

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  • Understanding the use of low coefficient of both hygroscopic and thermal expansion polymer matrix for the inner substrate multichip packages with multilevel interconnection

    Publication Year: 1990, Page(s):223 - 228
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    The development of a multimodule package based on an organic substrate adhering to a lead frame is described. This substrate has a small coefficient of both hygroscopic and temperature expansion, which keeps the lead-frame warping to a minimum amount. Several types of wire-bonding methods can be used. As the sealing material adhered to a metallic lead frame, this substrate has shown excellent adhe... View full abstract»

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  • Statistical design techniques for high-speed circuit boards with correlated structure distributions

    Publication Year: 1990, Page(s):185 - 191
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    New statistical design techniques have been developed for the line structures of high-speed circuit boards. These techniques account for dimensional distribution correlations caused by the fabrication process. Monte Carlo simulation is introduced into the finite-element method for calculating line parameters. The eye-pattern at the receiving end of transmission lines with parallel and stub parts i... View full abstract»

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  • Mechatronics, systems and elements

    Publication Year: 1990, Page(s):329 - 333
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    The author introduces and defines mechatronics and its elements. The term has come to designate all complex products/processes requiring the integration of electronic, mechanical, computer (microprocessor), consumer, industrial, and military products. The topics described are mechatronics systems elements; subsystem technology; challenges for US industry; US academic institution challenges; educat... View full abstract»

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  • Turning just-in-time concepts into reality: successful examples of change

    Publication Year: 1990, Page(s):256 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (812 KB)

    The author presents the progressive changes which have been made in five areas of material flow methods and procedures to incorporate just-in-time methods and total quality control through all areas of a business. The five areas are: (1) request and delivery of materials from the storeroom to each of the focused factories, (2) the elimination of make items in the storeroom, (3) the direct movement... View full abstract»

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  • Template approach to design and manufacturing

    Publication Year: 1990, Page(s):23 - 24
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (144 KB)

    A key to successfully managing cost and scheduling while producing high-quality products is the template approach. The assumptions for the template effort are different from most government improvement efforts. First, the template approach recognizes that weapons systems acquisition is an industrial process and not a purchasing process. Secondly, the template advocates believe that both government... View full abstract»

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  • Highly reliable Au-Sn bonding with background GaAs LSI chips

    Publication Year: 1990, Page(s):216 - 222
    Cited by:  Papers (7)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (788 KB)

    GaAs LSI chips (5.40mm×5.18 mm) with ground back-surfaces ( Rmax=0.1-1.0 μm) have been successfully bonded on alumina substrates using Au-Sn (80-20 wt.%) eutectic alloy with well-controlled scrubbing action. The authors investigated the reliability of mechanically ground chips through die-shear and thermal shock tests. No chip fracture occurred and no induced void was ... View full abstract»

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  • Manufacturing host computer workstation

    Publication Year: 1990, Page(s):325 - 328
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The author focuses on the concepts and physical integration of electronic notebooks, manufacturing claiming, feedback to the manufacturing operator, expert systems, statistical process control (SPC), engineering analysis of data, and decision support systems at a host computer manufacturing workstation. Future activity on a PC workstation with multitasking is also addressed, with a discussion of n... View full abstract»

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  • A model-based technique with a new indexing mechanism for industrial object recognition

    Publication Year: 1990, Page(s):56 - 60
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    The authors address the problem of industrial scene object recognition for the purposes of sensor-based robot assembly. They propose a technique in which the representation of the models (training phase) is performed by using a finite set of primitives and relations between them (object elements), characterized by a proper set of parameters. They describe a new index building mechanism, using both... View full abstract»

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  • Synchronizing manufacturing and materials flows

    Publication Year: 1990, Page(s):252 - 255
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (380 KB)

    The authors discuss a new logistics project being developed and implemented to synchronize materials flow with manufacturing. Called network management, the project is intended to satisfy the following requirements: recognize that not all parts should be ordered or controlled in the same manner; develop a system to classify parts to better determine what control mechanism to apply to which parts; ... View full abstract»

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  • FUSION: a plan for developing a familiar user-system interface for the IC fabrication industry

    Publication Year: 1990, Page(s):150 - 154
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The author discusses the concept of developing a set of industry guidelines for a familiar user-system interface (USI) for IC-fabrication equipment called FUSION (familiar user-system interface operation). A familiar USI across the industry would allow process engineers, operators, and service technicians to learn only one set of interface conventions. Successful standardization would lead to redu... View full abstract»

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  • Prospects of the automation for ULSI manufacturing

    Publication Year: 1990, Page(s):19 - 22
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    The present condition of semiconductor wafer manufacturing line automation and future prospects are described. The wafer manufacturing line includes direct operations such as the setting of processing parameters for the equipment, the inspection of the products, and the transport of wafers between equipment. It also includes indirect operations such as production control, quality control, and equi... View full abstract»

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