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Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

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Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Date 4-6 Dec. 2002

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Title History

Proceedings of the 4th International Symposium on Electronic Materials and Packaging (Cat. No.02EX634)

The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization

Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

Reliability and failure mode of chip-on-film with non-conductive adhesive

Thermal analysis of power amplifier package in cellular phones

Conversion cost reduction using advanced process control (SPC) and real-time data analysis with ERP linkage [SMT assembly]

Surface-mountable dual side-feed circularly polarized ceramic chip antenna

Role of adhesive modulus on reliability of FCBGA with heat spreader

Failure analysis of BGA package by a TDR approach

Finite element analysis of substrate warpage during die attach process

The interface microstructure on the reliability of flip-chip laser diode bonding

Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages

Evolution of intermetallic compounds at interface between PBGA solder ball and pads during laser reflow soldering

LFBGA packaging stress measurements with piezoresistive sensors

Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

Worldwide markets for wafer level packages

A study on the conductive behavior of copper filled pastes for microelectronic packaging substrates

Electromigration in tin thin film

LCD driver IC assembly technologies and status

High speed data transmission common mode noise suppression - application to USB 2.0 and IEEE 1394

Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

Testing iterative logic arrays for delay faults with a constant number of patterns

Influence of Sb addition on microstructural evolution of Sn-Ag solder

The latest underfill materials for flip-chip applications

Board level reliability test of MPBGA assembly

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