Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,

25-27 Sept. 1989

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  • Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

    Publication Year: 1989
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    Freely Available from IEEE
  • Managing manufacturing performance

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (33 KB)

    Summary form only given. Participative and performance management, employee involvement, educational upgrades, and organizational redesign are several strategies being employed by Harris Semiconductor to address the 'humanware' side of the equation. Manufacturing technology, with emphasis on tools such as statistics, just-in-time, and computer-aided manufacturing, is equally applied on the 'hardwa... View full abstract»

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  • Fluoropolymer composite multichip modules

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (199 KB)

    Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4*4 in. and greater) to be manufactured. Fluoropolym... View full abstract»

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  • Mass production back-grinding/wafer-thinning technology for GaAs devices

    Publication Year: 1989, Page(s):209 - 213
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (543 KB)

    A mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in GaAs device manufacturing is described. Excellent productivity has been realized because the brittleness of GaAs has been overcome. A mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding method with slight chemical etching. The thickness of the defo... View full abstract»

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  • Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

    Publication Year: 1989
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (124 KB)

    Summary form only given. A number of plastic encapsulated devices in the as-received condition were screened and documented using SLAM (scanning laser acoustic microscopy). Those parts containing flaws were then examined using a C-SAM (C-mode scanning acoustic microscope) to characterize the type of flaw and depth of the defect. Several of the defect-free parts were also evaluated on the C-SAM to ... View full abstract»

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  • Enhanced high speed performance from HDI thin film multichip modules

    Publication Year: 1989
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (114 KB)

    Summary form only given. A novel packaging technology, ideal for CMOS multichip modules, is described. Thin-film metal and polymer dielectric are used to fabricate five aluminum metal layer structures with 25- mu m-wide, 5- mu m-thick traces, and 11- mu m-thick dielectric layers. The polyimide has a dielectric constant of 3.4 and a dissipation factor of 0.003. A proprietary process is used to gene... View full abstract»

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  • Cantilever beam micro-contacts in a multi-chip interconnection system

    Publication Year: 1989, Page(s):239 - 245
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (728 KB)

    In order to examine the use of a compliant cantilever beam structure as a contact scheme for a multichip interconnection system (MIS), multilayer (metals and SiO2) cantilever beams were fabricated utilizing standard IC processing technologies and micromachining of silicon. The mechanical behavior and electrical characteristics of the beams were investigated to establish their optimum di... View full abstract»

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  • Solder joint reliability of fine pitch surface mount technology assemblies

    Publication Year: 1989, Page(s):48 - 60
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1080 KB)

    The reliability of fine pitch solder joint interconnection has been studied. It consists of two different fine pitch surface mount components (SMCs), namely, the EIAJ (Electronic Industry Associates of Japan) 160-pin quad flat pack (QFP) and the JEDEC (Joint Electronic Device Engineering Council) 132-pin plastic quad flat pack (PQFP). Each has a lead-spacing (from lead-center to lead-center) of ap... View full abstract»

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  • TAB implementation: a military user's viewpoint

    Publication Year: 1989, Page(s):234 - 238
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (444 KB)

    The uses of tape automated bonding (TAB) at Hughes Aircraft Company are reviewed. It is noted that TAB design and manufacture is currently troubled by nonstandardization issues and technology issues. Hughes has learned that the existing ASIC and memory chips are not compatible with TAB standards. Reconciliation of ILB (inner lead bond) footprints is an IC design interface, OLB (outer lead bond) is... View full abstract»

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  • Effect of heat and moisture on thick positive photoresist

    Publication Year: 1989, Page(s):310 - 313
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (828 KB)

    A Novolac resin AZ 4903 for lithographic evaluation is discussed from the standpoint of moisture and heat effects. Differential gravimetric and thermogravimetric analyses (DTG and TGA) were used for investigating the chemical changes of the photoresist associated with heat. The variations of moisture (humidity levels) were used to evaluate the hydrolyzation of the photoresist. The hydrolyzation wa... View full abstract»

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  • The reliability of reflow soldering by hot air reflow

    Publication Year: 1989, Page(s):43 - 47
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (244 KB)

    The reliability of a solder joint produced on an FR-4 substrate by hot air reflow soldering in SMT (surface mount technology) was investigated. The hot air reflow method is shown to make the temperature of the mounted components and substrate equal to the ambient temperature and does not greatly damage components. The capacitance drift did not change after 700 cycles on MIL-STD-202F(107G), at -65&... View full abstract»

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  • LED array modules by new method micron bump bonding method

    Publication Year: 1989, Page(s):230 - 233
    Cited by:  Papers (5)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (248 KB)

    An LED (light-emitting diode) array module was developed by employing the micron bump bonding technique, in which electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light-setting insulating resin. The developed LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 LED chips and 54 driver LSIs on a gl... View full abstract»

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  • Dynamic behavior of SMT chip capacitors during solder reflow

    Publication Year: 1989, Page(s):23 - 29
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (604 KB)

    A dynamic model of a SMT (surface mount technology) type 1206 chip capacitor is developed. The model is used to determine the effects of pad geometry, chip metallization and dimensions, amount of solder, and chip displacement on the ability of the chip to lift (tombstone) and to self-align itself during solder reflow. Both static and dynamic characterizations are shown. The model simulations show ... View full abstract»

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  • CALCE research opportunities at the University of Maryland

    Publication Year: 1989, Page(s):182 - 185
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (408 KB)

    The University of Maryland has initiated an integrated program in computer-aided life cycle engineering (CALCE) to assist the nation's industries in competitively meeting the foreign challenge both economically and technically. To meet current needs in electronic design, the University of Maryland established an Industry/University Cooperative Research Center whose research theme is to promote bas... View full abstract»

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  • Knowledge based control of adhesive dispensing for surface mount device assembly

    Publication Year: 1989, Page(s):267 - 272
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (392 KB)

    The results to date of a project using knowledge-based control techniques to resolve the problems encountered in the dispensing of the very viscous adhesives used to secure mounted components to mixed technology circuit boards before wave soldering are given. The work has two major thrusts, the accommodation of process variability with a rule-based system that controls a manufacturing cell and the... View full abstract»

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  • Engineering research centers: the Purdue experience

    Publication Year: 1989, Page(s):206A - 206D
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (404 KB)

    Activities at the Purdue Engineering Research Center (ERC) for Intelligent Manufacturing Systems, created in May, 1985, are described. The Purdue ERC has established a clear research agenda, a strong education program, close industry collaboration, and the organizational structure and policies to manage this ambitious effort. Over 200 students and faculty from 13 departments are directly involved ... View full abstract»

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  • Dielectric studies of solder paste fluxes and applications to no-clean paste formulations

    Publication Year: 1989, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (224 KB)

    Ionic mobility is monitored using a 12.5-μm interdigitated electrode to monitor conductivity, loss factor, and permittivity of solder flux, solder vehicle, and solder residue. Maximum ionic mobility is achieved at the temperature for minimum viscosity (87°C) and other increases can be seen at the melting point of abietic acid. Ionic mobility is shown to be dependent on the amount of plastic... View full abstract»

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  • In-line statistical process control and feedback for VLSI integrated circuit manufacturing

    Publication Year: 1989, Page(s):70 - 75
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (512 KB)

    A number of quality control and yield improvement techniques are used in the Hewlett Packard Fort Collins IC wafer fabrication line. Four of these are described, with examples of how each has improved quality and yield. Silicon wafer measurements obtained from the vendor or made at incoming inspection are correlated with device parameters and chip yield. Control charts on the manufacturing line ar... View full abstract»

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  • Plastic package moisture absorption hazards in SMT board assembly

    Publication Year: 1989, Page(s):38 - 42
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (456 KB)

    The package cracking hazard is discussed from an SMT (surface mount technology) board assembly manufacturer's point of view. On the basis of previous studies, the allowed maximum moisture levels after drying and after moisture absorption are defined. Drying curves and moisture absorption curves after drying are plotted for different component types, including quad-flat-packs, under specified condi... View full abstract»

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  • Recent developments in silicon hybrid multi-chip modules

    Publication Year: 1989, Page(s):111 - 117
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (548 KB)

    The author describes the Research Initiative Silicon Hybrids (RISH) programme, established in September, 1986, to investigate all aspects of silicon in multichip module applications. A series of test vehicles has been fabricated to demonstrate the merits for real circuit applications. The author summarizes the merits of silicon as a multichip module substrate and considers, in detail, the specific... View full abstract»

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  • Optimizing the cost of the telecommunication system

    Publication Year: 1989, Page(s):133A - 133D
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (180 KB)

    Over the past three years, a group of professionals at the AT&T Network Software Center have developed and implemented many technical and management procedures. They have made significant contributions to the profitability of the AT&T Network Systems Equipment Division (NSED) during their short tenure. The success of component management, through which much saving is effected, has been acc... View full abstract»

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  • SPC implementation and real time results

    Publication Year: 1989, Page(s):99 - 103
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (248 KB)

    A laboratory program used by the Circuit Board Division of Tektronix to automatically obtain real-time analysis and statistical process control information is described. As processes are analyzed and adjusted by the laboratory, data are available to anyone in the plant for review in an easily understandable format. Process trends and upsets are quickly detectable, and necessary adjustments are eas... View full abstract»

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  • Low stress silver-glass die attach material

    Publication Year: 1989, Page(s):224 - 229
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (404 KB)

    The sintering characteristics of a silver-filled lead borate glass composite were studied since it influences die stresses. This is especially true for very-large-area die attachments. The kinetics of silver particle sintering in the presence of liquid-phase glass was examined by dilatometry and electron microscopy. During heat treatment, the sintering rate is significantly increased after the gla... View full abstract»

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  • Applications of artificial intelligence in factory management

    Publication Year: 1989, Page(s):18 - 22
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (544 KB)

    Aspects of introducing AI-based technology to the manufacturing and administrative tasks encountered on the factory floor are discussed. In particular, it is indicated that the AI program has to be linked to the factory management or control system that contains the relevant shop floor data; this is usually not a trivial task. When AI technology is introduced to a factory floor, it is perceived as... View full abstract»

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  • A real time data acquisition and monitor system for integrated circuit visual inspection

    Publication Year: 1989, Page(s):88 - 95
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (636 KB)

    The design and implementation of a system used for real-time acquisition and monitoring of data collected at an IC manufacturing process are described. How it is used for process improvement and control is discussed. The approach taken to solve this problem can be divided into three functional areas: acquisition, monitor, and integration. The data acquisition task utilizes a touch screen terminal ... View full abstract»

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