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Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,

25-27 Sept. 1989

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  • Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

    Publication Year: 1989
    Request permission for commercial reuse | PDF file iconPDF (107 KB)
    Freely Available from IEEE
  • Managing manufacturing performance

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (33 KB)

    Summary form only given. Participative and performance management, employee involvement, educational upgrades, and organizational redesign are several strategies being employed by Harris Semiconductor to address the 'humanware' side of the equation. Manufacturing technology, with emphasis on tools such as statistics, just-in-time, and computer-aided manufacturing, is equally applied on the 'hardwa... View full abstract»

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  • Fluoropolymer composite multichip modules

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (199 KB)

    Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4*4 in. and greater) to be manufactured. Fluoropolym... View full abstract»

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  • Mass production back-grinding/wafer-thinning technology for GaAs devices

    Publication Year: 1989, Page(s):209 - 213
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (543 KB)

    A mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in GaAs device manufacturing is described. Excellent productivity has been realized because the brittleness of GaAs has been overcome. A mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding method with slight chemical etching. The thickness of the defo... View full abstract»

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  • Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

    Publication Year: 1989
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (124 KB)

    Summary form only given. A number of plastic encapsulated devices in the as-received condition were screened and documented using SLAM (scanning laser acoustic microscopy). Those parts containing flaws were then examined using a C-SAM (C-mode scanning acoustic microscope) to characterize the type of flaw and depth of the defect. Several of the defect-free parts were also evaluated on the C-SAM to ... View full abstract»

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  • Enhanced high speed performance from HDI thin film multichip modules

    Publication Year: 1989
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (114 KB)

    Summary form only given. A novel packaging technology, ideal for CMOS multichip modules, is described. Thin-film metal and polymer dielectric are used to fabricate five aluminum metal layer structures with 25- mu m-wide, 5- mu m-thick traces, and 11- mu m-thick dielectric layers. The polyimide has a dielectric constant of 3.4 and a dissipation factor of 0.003. A proprietary process is used to gene... View full abstract»

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  • Enhanced high speed performance from HDI thin film multi-chip modules

    Publication Year: 1989, Page(s):355 - 366
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (824 KB)

    A novel packaging technology, ideal for CMOS multichip modules, is described. Thin-film metal and polymer dielectric are used to fabricate five metal-layer structures with 25-μm-wide traces and 11-μm-thick dielectric layers. Features on the top pad layer can be fabricated to match the chip pads, allowing for orthogonal wire bonding with no fanout. In a microstrip configuration, the typical c... View full abstract»

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  • Is design realization a process? A case study

    Publication Year: 1989, Page(s):344 - 354
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    A Bell Labs study of high-technology development and manufacturing activities has established that design realization is a process in a design organization. Process quality management and improvement methods were applied to the analysis, and an action plan was developed to improve the process. The analysis of the process indicated that a substantial fraction of the design cycle time is for noncrea... View full abstract»

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  • SPC implementation and real time results

    Publication Year: 1989, Page(s):99 - 103
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    A laboratory program used by the Circuit Board Division of Tektronix to automatically obtain real-time analysis and statistical process control information is described. As processes are analyzed and adjusted by the laboratory, data are available to anyone in the plant for review in an easily understandable format. Process trends and upsets are quickly detectable, and necessary adjustments are eas... View full abstract»

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  • Preparation of custom gate array silicon wafers to handle specific wafer size in metallization process

    Publication Year: 1989, Page(s):336 - 343
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1008 KB)

    A wafer reduction sizing and backgrinding process has been developed to downsize larger wafers received from semiconductor vendors to 4-in. diameter and personalize them through Tandem's prototype wafer Fab line. This process avoided the equipment changes necessary to convert to a 5- or 6-in. wafer line, yet made it possible to accept larger wafers from vendors. The wafer sizing and backside grind... View full abstract»

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  • A successful strategy for implementing statistical process controls

    Publication Year: 1989, Page(s):96 - 98
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (168 KB)

    In the summer of 1987, the IBM Endicott (NY) Substrate Business Unit Management Team made a commitment to formulate and implement a comprehensive statistical process control (SPC) strategy for the entire substrate manufacturing line. The cornerstone of this strategy was the creation of a management support team consisting of upper-level management and statisticians to develop the strategy, manage ... View full abstract»

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  • Analyzing the mechanical strength of SMT attached solder joints

    Publication Year: 1989, Page(s):61 - 69
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (468 KB)

    Analytic approaches to the pull strength and shear strength of SMT (surface mount technology) attached solder joints have been studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages correlated with the experimentally measured data quite well. Lead/pad design is shown to have the most significant impact on the solder joint strength. The design rules for bu... View full abstract»

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  • A CAD coupled laser beam test system for digital circuit failure analysis

    Publication Year: 1989, Page(s):332 - 335
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (272 KB)

    A nondestructive automated digital test system is described. It consists of a laser scanning microscope (LSM) coupled to a CAD (computer-aided design) layout database. Logic state detection and automated failure analysis in CMOS circuits can be done without the need of vacuum and with a minimum of circuit environment preparation. The coupling of the LSM and the CAD layout database leads to automat... View full abstract»

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  • Electron beam direct writing technology for printed wiring board

    Publication Year: 1989, Page(s):246 - 250
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    An electron-beam lithography system has been developed which can write electric circuit patterns directly on printed wiring boards from computer-aided design data without making the master and working film masks which are necessary for conventional photolithography. The electron beam is focused to 34 μm in diameter at an accelerating voltage of 60 kV. The sensitivity of an electrodeposited phot... View full abstract»

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  • Total productive maintenance; TPM that works

    Publication Year: 1989, Page(s):13 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Tennessee Eastman Company (TEC) has defined TPM (total productive maintenance) as a partnership between the maintenance and production organizations to improve product quality, reduce waste, reduce manufacturing cost, increase equipment availability, and improve TEC's state of maintenance. This partnership emphasizes the involvement of all employees in maintaining facilities and equipment. TPM at ... View full abstract»

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  • A real time data acquisition and monitor system for integrated circuit visual inspection

    Publication Year: 1989, Page(s):88 - 95
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    The design and implementation of a system used for real-time acquisition and monitoring of data collected at an IC manufacturing process are described. How it is used for process improvement and control is discussed. The approach taken to solve this problem can be divided into three functional areas: acquisition, monitor, and integration. The data acquisition task utilizes a touch screen terminal ... View full abstract»

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  • Knowledge based control of adhesive dispensing for surface mount device assembly

    Publication Year: 1989, Page(s):267 - 272
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    The results to date of a project using knowledge-based control techniques to resolve the problems encountered in the dispensing of the very viscous adhesives used to secure mounted components to mixed technology circuit boards before wave soldering are given. The work has two major thrusts, the accommodation of process variability with a rule-based system that controls a manufacturing cell and the... View full abstract»

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  • Solder joint reliability of fine pitch surface mount technology assemblies

    Publication Year: 1989, Page(s):48 - 60
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1080 KB)

    The reliability of fine pitch solder joint interconnection has been studied. It consists of two different fine pitch surface mount components (SMCs), namely, the EIAJ (Electronic Industry Associates of Japan) 160-pin quad flat pack (QFP) and the JEDEC (Joint Electronic Device Engineering Council) 132-pin plastic quad flat pack (PQFP). Each has a lead-spacing (from lead-center to lead-center) of ap... View full abstract»

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  • Nondestructive evaluation of TAB bonds by acoustic microscopy

    Publication Year: 1989, Page(s):330 - 331
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (96 KB)

    A matrix of TAB (tape automated bonding) inner and outer lead devices with a built-in range of quality was investigated. Each bond interface was documented acoustically and then pull-tested to develop a database upon which to formulate a specific test method. Data demonstrate excellent correlation between the degree of bonding and correlative pull tests (destructive) when artifacts of the pull tes... View full abstract»

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  • Cantilever beam micro-contacts in a multi-chip interconnection system

    Publication Year: 1989, Page(s):239 - 245
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    In order to examine the use of a compliant cantilever beam structure as a contact scheme for a multichip interconnection system (MIS), multilayer (metals and SiO2) cantilever beams were fabricated utilizing standard IC processing technologies and micromachining of silicon. The mechanical behavior and electrical characteristics of the beams were investigated to establish their optimum di... View full abstract»

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  • Optimizing the cost of the telecommunication system

    Publication Year: 1989, Page(s):133A - 133D
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (180 KB)

    Over the past three years, a group of professionals at the AT&T Network Software Center have developed and implemented many technical and management procedures. They have made significant contributions to the profitability of the AT&T Network Systems Equipment Division (NSED) during their short tenure. The success of component management, through which much saving is effected, has been acc... View full abstract»

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  • Dynamic behavior of SMT chip capacitors during solder reflow

    Publication Year: 1989, Page(s):23 - 29
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (604 KB)

    A dynamic model of a SMT (surface mount technology) type 1206 chip capacitor is developed. The model is used to determine the effects of pad geometry, chip metallization and dimensions, amount of solder, and chip displacement on the ability of the chip to lift (tombstone) and to self-align itself during solder reflow. Both static and dynamic characterizations are shown. The model simulations show ... View full abstract»

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  • Computer integrated manufacturing [semiconductor processing]

    Publication Year: 1989, Page(s):1 - 3
    Cited by:  Papers (3)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    It is noted that, in computer-integrated manufacturing (CIM), there are many advantages to collecting and managing data from front-end and back-end operations in a logically integrated structured database. When this is done, correlations between elements in these data sets can be used to localize and quickly diagnose problems that reduce productivity. A simple and flexible system architecture suit... View full abstract»

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  • The Leaders for Manufacturing Program: a new type of industry/university consortium

    Publication Year: 1989, Page(s):186 - 187
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (148 KB)

    A description is given of the Leaders for Manufacturing Program, an innovative program being conducted jointly by the Massachusetts Institute of Technology's School of Management and School of Engineering. The program represents a partnership between MIT and eleven major US corporations. It includes a graduate, dual-degree master's program as well as a research program in manufacturing. The vision... View full abstract»

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  • Reducing the cost and effort of computer-aided test program development

    Publication Year: 1989, Page(s):129 - 132
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (260 KB)

    Hewlett-Packard's marketing research over the past several years reveals that the chief concern of computer-aided test (CAT) managers is to reduce the cost and effort of program development. CAT software tools and techniques for rapidly developing high-performance test programs at lower costs and with less effort are discussed. Functional test manager (FTM) and interactive test generator (ITG) sof... View full abstract»

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