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Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,

25-27 Sept. 1989

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Displaying Results 1 - 25 of 67
  • Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

    Publication Year: 1989
    Request permission for commercial reuse | PDF file iconPDF (107 KB)
    Freely Available from IEEE
  • Managing manufacturing performance

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (33 KB)

    Summary form only given. Participative and performance management, employee involvement, educational upgrades, and organizational redesign are several strategies being employed by Harris Semiconductor to address the 'humanware' side of the equation. Manufacturing technology, with emphasis on tools such as statistics, just-in-time, and computer-aided manufacturing, is equally applied on the 'hardwa... View full abstract»

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  • Fluoropolymer composite multichip modules

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (199 KB)

    Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4*4 in. and greater) to be manufactured. Fluoropolym... View full abstract»

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  • Mass production back-grinding/wafer-thinning technology for GaAs devices

    Publication Year: 1989, Page(s):209 - 213
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (543 KB)

    A mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in GaAs device manufacturing is described. Excellent productivity has been realized because the brittleness of GaAs has been overcome. A mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding method with slight chemical etching. The thickness of the defo... View full abstract»

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  • Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

    Publication Year: 1989
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (124 KB)

    Summary form only given. A number of plastic encapsulated devices in the as-received condition were screened and documented using SLAM (scanning laser acoustic microscopy). Those parts containing flaws were then examined using a C-SAM (C-mode scanning acoustic microscope) to characterize the type of flaw and depth of the defect. Several of the defect-free parts were also evaluated on the C-SAM to ... View full abstract»

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  • Enhanced high speed performance from HDI thin film multichip modules

    Publication Year: 1989
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (114 KB)

    Summary form only given. A novel packaging technology, ideal for CMOS multichip modules, is described. Thin-film metal and polymer dielectric are used to fabricate five aluminum metal layer structures with 25- mu m-wide, 5- mu m-thick traces, and 11- mu m-thick dielectric layers. The polyimide has a dielectric constant of 3.4 and a dissipation factor of 0.003. A proprietary process is used to gene... View full abstract»

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  • Knowledge based control of adhesive dispensing for surface mount device assembly

    Publication Year: 1989, Page(s):267 - 272
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    The results to date of a project using knowledge-based control techniques to resolve the problems encountered in the dispensing of the very viscous adhesives used to secure mounted components to mixed technology circuit boards before wave soldering are given. The work has two major thrusts, the accommodation of process variability with a rule-based system that controls a manufacturing cell and the... View full abstract»

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  • Using coarse/fine manipulation with vision to place fine pitch SMD components

    Publication Year: 1989, Page(s):262 - 266
    Cited by:  Papers (3)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (428 KB)

    An experimental system that can accurately align and place SMDs (surface mount devices) on a printed circuit board is described. Features of the system are fine positioning and endpoint sensing after an IBM 7576 robot coarsely aligns the SMD to its target. Fine positioning is done using a customer-designed micropositioning device. The endpoint sensor is a single camera vision system that by image ... View full abstract»

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  • Vacuum mechatronics and self-contained manufacturing for microelectronics processing

    Publication Year: 1989, Page(s):257 - 261
    Cited by:  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The Center for Robotic Systems in Microelectronics (CRSM) has developed the core of a self-contained automated robotic factory (SCARF). This includes a central chamber with various transfer and monitoring ports, a vacuum-compatible robot for wafer transfer, and a particle monitoring system, all under automation. The cylindrical coordinate SCARF vacuum-compatible robot is unique due to its fully va... View full abstract»

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  • Electronic system packaging: the search for manufacturing the optimum in a sea of constraints

    Publication Year: 1989, Page(s):149 - 164
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1068 KB)

    The author details some of the constraints on electronic system design and manufacturing that affect system performance, reliability, materials selection, and the assembly of the product. The electronic constraints include chip crossing delay, fanout (number of receivers on a driven net), crosstalk (unwanted electromagnetic coupling between independent signal lines and power supplies), DC voltage ... View full abstract»

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  • Evolution of integrated manufacturing in the 1980s

    Publication Year: 1989, Page(s):251 - 256
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (640 KB)

    The ways in which electronic manufacturing businesses have used specific elements of CIM (computer-integrated manufacturing) to their competitive advantage are described. Three GE operations are used as examples of modernization projects that utilized CIM technologies that were appropriate for the situation and the time. In all of these cases, a phased approach to CIM implementation was employed. ... View full abstract»

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  • A study of the roles of consultants in facilitating theassembly manufacturing flow among segments of the US semiconductor and electronics industries

    Publication Year: 1989, Page(s):133 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1040 KB)

    Three separate research approaches were utilized to study technology, markets, and business factors underlying current and future demand for consulting services in packaging and assembly. This research included a literature search, an expert opinion survey, and a series of case studies of consulting practices. Findings of the individual studies were compared and combined to develop conclusions abo... View full abstract»

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  • Electron beam direct writing technology for printed wiring board

    Publication Year: 1989, Page(s):246 - 250
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    An electron-beam lithography system has been developed which can write electric circuit patterns directly on printed wiring boards from computer-aided design data without making the master and working film masks which are necessary for conventional photolithography. The electron beam is focused to 34 μm in diameter at an accelerating voltage of 60 kV. The sensitivity of an electrodeposited phot... View full abstract»

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  • Using process dissection to achieve design for manufacturability for electronic assemblies

    Publication Year: 1989, Page(s):126 - 128
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    A DFM (design for manufacturability) concept called PPM dissection that uses the assembly defect rates in p.p.m.'s from measurements of variables controllable in the design phase is described. The material presented is on a most basic level, i.e. without the extensive equations and algorithms that make it work. A simple example is presented View full abstract»

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  • Cantilever beam micro-contacts in a multi-chip interconnection system

    Publication Year: 1989, Page(s):239 - 245
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    In order to examine the use of a compliant cantilever beam structure as a contact scheme for a multichip interconnection system (MIS), multilayer (metals and SiO2) cantilever beams were fabricated utilizing standard IC processing technologies and micromachining of silicon. The mechanical behavior and electrical characteristics of the beams were investigated to establish their optimum di... View full abstract»

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  • SPC implementation and real time results

    Publication Year: 1989, Page(s):99 - 103
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    A laboratory program used by the Circuit Board Division of Tektronix to automatically obtain real-time analysis and statistical process control information is described. As processes are analyzed and adjusted by the laboratory, data are available to anyone in the plant for review in an easily understandable format. Process trends and upsets are quickly detectable, and necessary adjustments are eas... View full abstract»

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  • Heat seal connectors: a new high density SMT interconnection system

    Publication Year: 1989, Page(s):121 - 125
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (364 KB)

    Most conventional electronic products use liquid-crystal displays (LCDs) to display information. The introduction of the heat seal connector, which uses a conductive adhesive system as the bridge to connect the board substrate and the LCD, has been shown to result in an order of magnitude reduction in size with a corresponding increase in reliability while reducing overall product cost as compared... View full abstract»

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  • Effect of heat and moisture on thick positive photoresist

    Publication Year: 1989, Page(s):310 - 313
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (828 KB)

    A Novolac resin AZ 4903 for lithographic evaluation is discussed from the standpoint of moisture and heat effects. Differential gravimetric and thermogravimetric analyses (DTG and TGA) were used for investigating the chemical changes of the photoresist associated with heat. The variations of moisture (humidity levels) were used to evaluate the hydrolyzation of the photoresist. The hydrolyzation wa... View full abstract»

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  • TAB implementation: a military user's viewpoint

    Publication Year: 1989, Page(s):234 - 238
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (444 KB)

    The uses of tape automated bonding (TAB) at Hughes Aircraft Company are reviewed. It is noted that TAB design and manufacture is currently troubled by nonstandardization issues and technology issues. Hughes has learned that the existing ASIC and memory chips are not compatible with TAB standards. Reconciliation of ILB (inner lead bond) footprints is an IC design interface, OLB (outer lead bond) is... View full abstract»

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  • Dynamic behavior of SMT chip capacitors during solder reflow

    Publication Year: 1989, Page(s):23 - 29
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (604 KB)

    A dynamic model of a SMT (surface mount technology) type 1206 chip capacitor is developed. The model is used to determine the effects of pad geometry, chip metallization and dimensions, amount of solder, and chip displacement on the ability of the chip to lift (tombstone) and to self-align itself during solder reflow. Both static and dynamic characterizations are shown. The model simulations show ... View full abstract»

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  • A successful strategy for implementing statistical process controls

    Publication Year: 1989, Page(s):96 - 98
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (168 KB)

    In the summer of 1987, the IBM Endicott (NY) Substrate Business Unit Management Team made a commitment to formulate and implement a comprehensive statistical process control (SPC) strategy for the entire substrate manufacturing line. The cornerstone of this strategy was the creation of a management support team consisting of upper-level management and statisticians to develop the strategy, manage ... View full abstract»

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  • High performance controlled impedance interconnection system

    Publication Year: 1989, Page(s):118 - 120
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (296 KB)

    The limitation of future system performance of very high-speed, massively parallel computers and signal processors lies in the arena of electronic interconnections and packaging. Unless good solutions are found, systems will not be able to capitalize on the intrinsic capabilities of the latest active devices, which are capable of switching in the picosecond and even femtosecond domain. An intercon... View full abstract»

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  • Dielectric studies of solder paste fluxes and applications to no-clean paste formulations

    Publication Year: 1989, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (224 KB)

    Ionic mobility is monitored using a 12.5-μm interdigitated electrode to monitor conductivity, loss factor, and permittivity of solder flux, solder vehicle, and solder residue. Maximum ionic mobility is achieved at the temperature for minimum viscosity (87°C) and other increases can be seen at the melting point of abietic acid. Ionic mobility is shown to be dependent on the amount of plastic... View full abstract»

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  • LED array modules by new method micron bump bonding method

    Publication Year: 1989, Page(s):230 - 233
    Cited by:  Papers (5)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    An LED (light-emitting diode) array module was developed by employing the micron bump bonding technique, in which electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light-setting insulating resin. The developed LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 LED chips and 54 driver LSIs on a gl... View full abstract»

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  • Applications of artificial intelligence in factory management

    Publication Year: 1989, Page(s):18 - 22
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    Aspects of introducing AI-based technology to the manufacturing and administrative tasks encountered on the factory floor are discussed. In particular, it is indicated that the AI program has to be linked to the factory management or control system that contains the relevant shop floor data; this is usually not a trivial task. When AI technology is introduced to a factory floor, it is perceived as... View full abstract»

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