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Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Date 25-27 Sept. 1989

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Displaying Results 1 - 25 of 67
  • Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

    Publication Year: 1989
    Request permission for commercial reuse | PDF file iconPDF (107 KB)
    Freely Available from IEEE
  • Mass production back-grinding/wafer-thinning technology for GaAs devices

    Publication Year: 1989, Page(s):209 - 213
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (543 KB)

    A mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in GaAs device manufacturing is described. Excellent productivity has been realized because the brittleness of GaAs has been overcome. A mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding method with slight chemical etching. The thickness of the defo... View full abstract»

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  • Fabrication of high density multichip modules

    Publication Year: 1989, Page(s):104 - 109
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    A novel high-density multilayer interconnect (HDMI) technology has been shown to provide very high functional densities and a fabrication platform for extremely compact and complex systems. The technology comprises an interconnect fabrication method for microelectronic circuits based on vacuum thin-film metallization and polymeric insulation between layers. The HDMI technology makes wafer-scale in... View full abstract»

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  • Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)

    Publication Year: 1989, Page(s):300 - 306
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The knowledge that low aromatic polymers promote improved dielectric response allowed the development of a polycyanate resin from a cycloaliphatic/aromatic hybrid. This product allows improvement in dielectric properties without reduction in the enhanced thermal properties associated with triazine resins. The cured polycyanate (containing cycloaliphatic bridges between aromatic rings) is capable o... View full abstract»

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  • Dielectric studies of solder paste fluxes and applications to no-clean paste formulations

    Publication Year: 1989, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (224 KB)

    Ionic mobility is monitored using a 12.5-μm interdigitated electrode to monitor conductivity, loss factor, and permittivity of solder flux, solder vehicle, and solder residue. Maximum ionic mobility is achieved at the temperature for minimum viscosity (87°C) and other increases can be seen at the melting point of abietic acid. Ionic mobility is shown to be dependent on the amount of plastic... View full abstract»

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  • Recent developments in silicon hybrid multi-chip modules

    Publication Year: 1989, Page(s):111 - 117
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (548 KB)

    The author describes the Research Initiative Silicon Hybrids (RISH) programme, established in September, 1986, to investigate all aspects of silicon in multichip module applications. A series of test vehicles has been fabricated to demonstrate the merits for real circuit applications. The author summarizes the merits of silicon as a multichip module substrate and considers, in detail, the specific... View full abstract»

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  • Technology transfer-a future imperative

    Publication Year: 1989, Page(s):176 - 181
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    The Lehigh graduate program in manufacturing systems engineering, now in its sixth year, is described. An industrial advisory board has been enlisted with the mission of assisting the Center for Manufacturing Systems Engineering, guiding the program, and ensuring that technology transfer is accomplished both from campus into industry and from industry into the classroom. The Center for Manufacturi... View full abstract»

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  • Reducing the cost and effort of computer-aided test program development

    Publication Year: 1989, Page(s):129 - 132
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (260 KB)

    Hewlett-Packard's marketing research over the past several years reveals that the chief concern of computer-aided test (CAT) managers is to reduce the cost and effort of program development. CAT software tools and techniques for rapidly developing high-performance test programs at lower costs and with less effort are discussed. Functional test manager (FTM) and interactive test generator (ITG) sof... View full abstract»

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  • Total productive maintenance; TPM that works

    Publication Year: 1989, Page(s):13 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Tennessee Eastman Company (TEC) has defined TPM (total productive maintenance) as a partnership between the maintenance and production organizations to improve product quality, reduce waste, reduce manufacturing cost, increase equipment availability, and improve TEC's state of maintenance. This partnership emphasizes the involvement of all employees in maintaining facilities and equipment. TPM at ... View full abstract»

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  • In-line statistical process control and feedback for VLSI integrated circuit manufacturing

    Publication Year: 1989, Page(s):70 - 75
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    A number of quality control and yield improvement techniques are used in the Hewlett Packard Fort Collins IC wafer fabrication line. Four of these are described, with examples of how each has improved quality and yield. Silicon wafer measurements obtained from the vendor or made at incoming inspection are correlated with device parameters and chip yield. Control charts on the manufacturing line ar... View full abstract»

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  • High performance controlled impedance interconnection system

    Publication Year: 1989, Page(s):118 - 120
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (296 KB)

    The limitation of future system performance of very high-speed, massively parallel computers and signal processors lies in the arena of electronic interconnections and packaging. Unless good solutions are found, systems will not be able to capitalize on the intrinsic capabilities of the latest active devices, which are capable of switching in the picosecond and even femtosecond domain. An intercon... View full abstract»

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  • CALCE research opportunities at the University of Maryland

    Publication Year: 1989, Page(s):182 - 185
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    The University of Maryland has initiated an integrated program in computer-aided life cycle engineering (CALCE) to assist the nation's industries in competitively meeting the foreign challenge both economically and technically. To meet current needs in electronic design, the University of Maryland established an Industry/University Cooperative Research Center whose research theme is to promote bas... View full abstract»

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  • Center for Integrated Manufacturing Decision Systems: an overview

    Publication Year: 1989, Page(s):169 - 173
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (580 KB)

    The Center for Integrated Manufacturing Decision Systems at Carnegie Mellon University has been created to perform research in intelligent decision systems for engineering and manufacturing problem solving. The Center's research has two goals: to increase the quality of decisions at each stage of the production manufacturing life cycle, including design, planning, production, distribution, and fie... View full abstract»

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  • A successful strategy for implementing statistical process controls

    Publication Year: 1989, Page(s):96 - 98
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (168 KB)

    In the summer of 1987, the IBM Endicott (NY) Substrate Business Unit Management Team made a commitment to formulate and implement a comprehensive statistical process control (SPC) strategy for the entire substrate manufacturing line. The cornerstone of this strategy was the creation of a management support team consisting of upper-level management and statisticians to develop the strategy, manage ... View full abstract»

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  • Is design realization a process? A case study

    Publication Year: 1989, Page(s):344 - 354
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    A Bell Labs study of high-technology development and manufacturing activities has established that design realization is a process in a design organization. Process quality management and improvement methods were applied to the analysis, and an action plan was developed to improve the process. The analysis of the process indicated that a substantial fraction of the design cycle time is for noncrea... View full abstract»

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  • The reliability of reflow soldering by hot air reflow

    Publication Year: 1989, Page(s):43 - 47
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (244 KB)

    The reliability of a solder joint produced on an FR-4 substrate by hot air reflow soldering in SMT (surface mount technology) was investigated. The hot air reflow method is shown to make the temperature of the mounted components and substrate equal to the ambient temperature and does not greatly damage components. The capacitance drift did not change after 700 cycles on MIL-STD-202F(107G), at -65&... View full abstract»

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  • Maglev microrobotics: an approach toward highly integrated small-scale manufacturing systems

    Publication Year: 1989, Page(s):273 - 276
    Cited by:  Papers (6)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    It is noted that current industrial robots are poorly suited to many of the payload, precision, and integration requirements of the semiconductor industry. A general mechanical technology, based on magnetically levitated microrobots, that may be better matched to semiconductor manufacturing needs is described. Magnetic levitation has favorable downward scaling laws and can be used to build multipl... View full abstract»

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  • Fluoropolymer composite multichip modules

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (192 KB)

    Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4×4 in. and greater) to be manufactured. Fluor... View full abstract»

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  • Applications of artificial intelligence in factory management

    Publication Year: 1989, Page(s):18 - 22
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    Aspects of introducing AI-based technology to the manufacturing and administrative tasks encountered on the factory floor are discussed. In particular, it is indicated that the AI program has to be linked to the factory management or control system that contains the relevant shop floor data; this is usually not a trivial task. When AI technology is introduced to a factory floor, it is perceived as... View full abstract»

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  • Kinetic interactions of copper, lead and tin on solder coated PC boards studied using X-ray diffraction

    Publication Year: 1989, Page(s):294 - 299
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (388 KB)

    X-ray diffraction has been used to monitor the growth and decay of the constituent phases existing in solder (60% Sn-40% Pb) coated Cu printed circuit boards. Samples were aged from 145°C to 175°C for times sufficient to allow the Cu3Sn intermetallic phase X-ray peak count rate to exceed that for the Cu6Sn5 phase. Activation energies have been determined fo... View full abstract»

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  • Analysis of an advanced manufacturing cell through computer simulation

    Publication Year: 1989, Page(s):277 - 285
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    The use of a simulation technique with animation capability to analyze an advanced manufacturing cell used in an integrated IC manufacturing facility is described. This animated graphic model includes details of all equipment, the intracell material handling system, and all the process steps from molding through trim/form operations. The simulation model is used to analyze the behavior of the intr... View full abstract»

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  • Using coarse/fine manipulation with vision to place fine pitch SMD components

    Publication Year: 1989, Page(s):262 - 266
    Cited by:  Papers (3)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (428 KB)

    An experimental system that can accurately align and place SMDs (surface mount devices) on a printed circuit board is described. Features of the system are fine positioning and endpoint sensing after an IBM 7576 robot coarsely aligns the SMD to its target. Fine positioning is done using a customer-designed micropositioning device. The endpoint sensor is a single camera vision system that by image ... View full abstract»

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  • Heat seal connectors: a new high density SMT interconnection system

    Publication Year: 1989, Page(s):121 - 125
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (364 KB)

    Most conventional electronic products use liquid-crystal displays (LCDs) to display information. The introduction of the heat seal connector, which uses a conductive adhesive system as the bridge to connect the board substrate and the LCD, has been shown to result in an order of magnitude reduction in size with a corresponding increase in reliability while reducing overall product cost as compared... View full abstract»

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  • The Leaders for Manufacturing Program: a new type of industry/university consortium

    Publication Year: 1989, Page(s):186 - 187
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (148 KB)

    A description is given of the Leaders for Manufacturing Program, an innovative program being conducted jointly by the Massachusetts Institute of Technology's School of Management and School of Engineering. The program represents a partnership between MIT and eleven major US corporations. It includes a graduate, dual-degree master's program as well as a research program in manufacturing. The vision... View full abstract»

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  • The University of Illinois Manufacturing Research Center

    Publication Year: 1989, Page(s):174 - 175
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (116 KB)

    The University of Illinois, recognizing the importance of coordinated engineering research activities, has initiated a program in manufacturing research and education to serve industry's needs. This program is being coordinated through the Manufacturing Research center (MRC). The MRC provides a forum within which industry can participate in research through sponsorship of projects. It enhances the... View full abstract»

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