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IEEE Transactions on Parts, Hybrids, and Packaging

Issue 4 • Date Dec 1973

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Displaying Results 1 - 12 of 12
  • Connectors in Very-High-Speed Digital Circuits

    Publication Year: 1973, Page(s):256 - 261
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (704 KB)

    The properties of standard card edge, printed circuit, and flat cable connectors have been investigated from the point of view of transmitting pulses with very short rise times. A simple theory based on linear approximation of the leading and trailing edges of the actual pulse waveform is derived to predict the effect of impedance mismatch caused by the connector. Experimental confirmation of the ... View full abstract»

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  • Application of Glass-Ceramics for Electronic Components and Circuits

    Publication Year: 1973, Page(s):247 - 256
    Cited by:  Papers (46)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1552 KB)

    Ceramic materials of interest for electronic components, such as ferroelectrics, ferrites, and transition metal oxides have no natural glass-forming habit. A rapid cooling of their melt is required to obtain homogeneous glasses. This is the most important requirement for controlling crystallization and phase dispersion, as required for Various applications. Materials and methods used for making di... View full abstract»

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  • Copper Alloy Spring Materials and Spring Properties

    Publication Year: 1973, Page(s):237 - 242
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    Copper alloys have long served as spring materials in electromechanical devices, but the miniaturization of electronic equipment has imposed new demands on these materials. The first is that of improved elastic properties to ensure satisfactory performance at the higher operating stresses and temperatures encountered in these miniaturized devices. The second is that of improved methods for charact... View full abstract»

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  • Thank You, Alex

    Publication Year: 1973, Page(s): 198
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (67 KB)

    First Page of the Article
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  • An Analysis of Current Crowding at 180° Bends in Film Resistors

    Publication Year: 1973, Page(s):262 - 263
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (176 KB)

    First Page of the Article
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  • The Influence of Temperature on Stress Relaxation in a Chill-Cast, Tin-Lead Solder

    Publication Year: 1973, Page(s):243 - 246
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (624 KB)

    Data on the compressive stress relaxation of chill-cast 60/40 tin-lead solders for two loads, 6.89 and 24.8 MN/m2 (mega newtons/ square meter) and for temperatures from 27 to 108°C are presented. For the complete temperature range tested, it is shown that the stress relaxation can be modeled as an Arrhenius reaction-rate process with an activation energy of 0.65 eV This activation energy is i... View full abstract»

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  • Evaluation of Electrically Insulative Adhesives for Use in Hybrid Microcircuit Fabrication

    Publication Year: 1973, Page(s):199 - 207
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1664 KB)

    Although it is generally accepted that the use of adhesives in the fabrication of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will ensure sufficient compatibility with microcircuit components and metallization systems to meet the long use-life, high-reliability requirements of military an... View full abstract»

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  • Epitaxial Growth of III-V Compounds for Electroluminescent Light Sources

    Publication Year: 1973, Page(s):208 - 215
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1352 KB)

    During the past decade, semiconductor junction electroluminescence has evolved from a laboratory phenomenon to a manufacturing technology. This success can be attributed to the extensive research in the preparation and characterization of III-V compounds. Materials emitting radiation in various regions of the visible spectrum are now available. The epitaxial growth techniques used in the fabricati... View full abstract»

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  • Characterization of Sputtered Gold-Tungsten and Gold-Molybdenum Metallizations for Microwave Power Transistors

    Publication Year: 1973, Page(s):224 - 229
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (792 KB)

    The stability and hence reliability of sputtered gold-tungsten and gold-molybdenum films has been determined as a function of anneal temperature up to 650°c. Isothermal and isochronal resistivity experiments have yielded an activation energy for particle growth in 3000 Å gold films of 0.4 eV below 200oc and 0.7 eV about 200oc. The activation energy for the refractory layer was calculated... View full abstract»

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  • Cosputtered Aluminum-Rich AlTa Alloy Films

    Publication Year: 1973, Page(s):230 - 233
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB)

    An R F sputtering system was employed with a target consisting of a 20cm diameter aluminum disk, about 1/4 of which was covered by a segment of tantalum. This target construction makes it possible to obtain on a single substrate a broad range of film compositions in one sputtering run. The result, concluded from X-ray analysis, is that only three phases are observed on a 10 cm by 10 cm Coming glas... View full abstract»

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  • Ambient Effect On Ionic Charges in Dielectric Films

    Publication Year: 1973, Page(s):234 - 236
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB)

    The effect of various annealing ambients on the ionic charges contained in the dielectric structures of silicon dioxide-silicon and silicon nitride-silicon dioxide-silicon was investigated. It has been observed that most effective ambients in making ionic species immobile are nitrogen and a mixture of nitrogen and hydrogen chloride gases. Further, silicon nitride used as passivating dielectric fil... View full abstract»

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  • Thick Film Pastes for Multilayer Use

    Publication Year: 1973, Page(s):216 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2208 KB)

    Suecessful multilayer processing requires careful selection of conductor and dielectric pastes. As pastes they must satisfy geometrical and processing needs; as conductors and dielectrics they must meet electrical and other requirements. Some dominating considerations for paste selection are reviewed. A method is described for evaluating paste performance with test patterns which simulate multiley... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope