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Component Parts, IEEE Transactions on

Issue 1 • Date Mar 1965

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Displaying Results 1 - 7 of 7
  • Magnetomechanical Applications Utilizing Silicon Iron

    Publication Year: 1965 , Page(s): 11 - 16
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    This paper discusses the processing and use of ironsilicon alloys [American Iron and Steel Institute (AISI) M27, M6, etc.] in electromechanical applications. These materials are more commonly used in electromagnetic applications such as transformer and motor laminations, relays, and solonoids. Resistance to mechanical stress is provided by applying hard carburized or carbonitrided cases to only those areas subjected to mechanical stress. Thus, a single part provides both magnetic softness and resistance to abrasion and impact. The process used to produce grain orientation in M6 electrical steel precludes the use of subsequent case hardening treatments. In this instance, hard inserts can provide similar resistance to impact and abrasion. The magnetic properties of these materials are of prime importance to assure functional performance. This paper describes special annealing practices which provide properties that allow maximum performance from materials of the previously mentioned types. The common industry practice of specifying magnetic properties by using core loss values is of particular interest. In electromechanical applications, these values are not sufficient to guarantee magnetic performance, therefore, properties such as maximum permeability and coercive force must be determined. This entails the selection of materials and practices that will give proper performance. The methods used in selecting suitable materials and the required testing procedures are also covered in this paper. View full abstract»

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  • The Optimization of Square-Law Elements Based on Silicon Carbide Nonlinear Resistors

    Publication Year: 1965 , Page(s): 3 - 7
    Cited by:  Papers (1)
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    A segmental square-law circuit is described employing silicon carbide nonlinear resistors in a parallel configuration analogous to a conventional diode function generator, but having the advantage of requiring no bias supplies and giving an output noticeably free of discontinuities. An optimization procedure is described by which satisfactory values for the circuit elements were obtained. Using only two segments, the square law was fitted to within 1 volt over a working range of 0 to 100 volts. View full abstract»

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  • Application of the Eyring Model to Capacitor Aging Data

    Publication Year: 1965 , Page(s): 34 - 41
    Cited by:  Papers (51)
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    The Eyring Model has been used to derive the "power rule" for capacitors. Analytical models for evaluating progressive and step stress tests are presented. Various methods are discussed for determining the value of the exponent for the power rule. In particular, the relation between the exponent of the power rule and the beta of the Weibull distribution, for both progressive and constant stress tests, is discussed. Data for mica capacitors are used to demonstrate the validity of these relations and to illustrate methods for determining the constants of the equations. View full abstract»

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  • Thin-Film Titanium Dioxide Capacitors for Microelectronic Applications

    Publication Year: 1965 , Page(s): 16 - 20
    Cited by:  Papers (2)
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    This paper discusses investigations of vacuum-deposited thin-film titanium dioxide capacitors applicable to microelectronic circuits. Included are sections covering evaporant materials and their purities, vacuum evaporation techniques, anodizing procedures, substrate materials, and electrical properties of thin-film TiO2capacitors. View full abstract»

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  • Surface Design Factors in the Evaporative Cooling of Electronic Components

    Publication Year: 1965 , Page(s): 29 - 33
    Cited by:  Papers (2)
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    Variations in the size and orientation of a surface cooled by evaporation of a liquid are reflected in the measured heat transfer characteristics. Nucleate boiling curves from tests of "Freon-113" in contact with two sizes of heated flat plates in different positions are used to demonstrate the comparative characteristics. For low levels of heat flux, the lowest surface temperatures are exhibited by the larger of the heated plates facing downward. At higher fluxes, the lowest temperatures observed are those of the larger plates facing upward. The slope of the boiling curve for any size plate becomes progressively greater as the plate is shifted from the face-down position through the vertical to the face-up position. The facility with which bubbles can escape from a heated surface is proposed as a significant determinant of heat transfer characteristics. View full abstract»

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  • A New Approach to the Attainment of the Highest Possible Reliability in Tantalum Capacitors

    Publication Year: 1965 , Page(s): 21 - 29
    Cited by:  Papers (1)
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    The question of how to achieve the highest possible reliability for Tantalum capacitors is discussed from both the theoretical and practical point of view. A method of achieving reliabilities of the order 95 per cent at a confident level of 95 per cent or better is described which involves an analytical treatment of the physics of the main mode of failure, all accounting for over 90 per cent of a failure; and a statistical model is derived which demonstrates this reliability on a highly accelerated test. The test is applicable on a 100 per cent basis to the test capacitors and, as it is nondestructive, it allows the attainment of a reliability figure for each individual unit. This also provides a method of attaining very high reliabilities at a low cost and the test can be carried out in 24 hours or less. View full abstract»

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  • Dielectric Properties of Thin Insulating Films of Photoresist Material

    Publication Year: 1965 , Page(s): 8 - 11
    Cited by:  Papers (3)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (576 KB)  

    This paper discusses measurements of the dielectric properties of thin insulating films of AZ-171and KPR.2The properties include conductivity and dielectric constant as a function of frequency, voltage, and temperature. Also, films have been temperature cycled from 3° to 500° K to determine if structural defects appear. These measurements show that specially prepared films are suitable as large area insulators for fabricating multilayer film circuits. To illustrate the advantages of using photoresist films for both insulator and etch resist, a brief description of a process for fabricating cryotrons will be presented. View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope