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Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

11-13 May 1988

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  • InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88 (Cat. No.88CH2590-8)

    Publication Year: 1988
    Request permission for commercial reuse | PDF file iconPDF (32 KB)
    Freely Available from IEEE
  • Thermal resistance measurements and reliability of GaAs power MESFETs

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (40 KB)

    Summary form only given. Thermal resistance measurements have been carried out on more than 50 devices with an in-house developed instrument, using the well-known electrical method based on temperature dependence of the Schottky junction forward voltage. The selected MESFETs, intentionally chosen with completely different layout and heat-sinking solutions, such as via-hole or air-bridge source con... View full abstract»

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  • Numerical and experimental investigation of heat transfer phenomena over an electronic module

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (50 KB)

    Summary form only given. The three-dimensional conjugate heat transfer problem associated with a heat-dissipation electronic component placed in a forced-convection environment is discussed. Both numerical and experimental data are presented for forced-convection heat transfer over an individual, card-mounted electronic module. The numerical approach was twofold. First, the time-averaged equations... View full abstract»

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  • Forced convection heat transfer of a vertical shrouded fin array

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (78 KB)

    Summary form only given. The detailed local distribution is obtained of the convective heat transfer coefficient on the fin structure. A mass transfer system using the naphthalene sublimation technique is chosen for the study. The test model is fabricated by coating a layer of naphthalene on the fin surface; this gives the surface an equivalence to the isothermal boundary condition in heat transfe... View full abstract»

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  • Use of composite structure to achieve variable rates of thermal expansion in disk drive arms

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (22 KB)

    Summary form only given, as follows. Many drives with either 3.5-in or 5.25-in disks operate without any position feedback mechanism and required that materials used within the drive have carefully controlled coefficients of thermal expansion. Completely eliminating thermal offtrack by simply selecting from available materials is often not possible. A method of fine-tuning the offtrack is presente... View full abstract»

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  • Transport phenomena in crystal growth

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (24 KB)

    Summary form only given, as follows. Some representative vapor, melt, and solution growth techniques are described and the essential transport phenomena for each is identified. Recent research to gain further understanding and a better description of transport phenomena in crystal growth is discussed. The problems of this type include: natural convection in shallow enclosures; mixed force and free... View full abstract»

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  • Thermal stresses in the bulk and epitaxial growth of III-V materials

    Publication Year: 1988
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (61 KB)

    Summary form only given. Large temperature gradients and substantial differences in thermal expansion coefficients are among the major factors for thermal stress generation in many materials systems. The field of electronic materials provides striking illustrations with regard to the role of thermal stress in crystal growth. In the LEC (liquid encapsulation Czochralski) growth of GaAs and InP, the... View full abstract»

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  • Characteristics of heat transfer in helium gas enclosed disk enclosure

    Publication Year: 1988, Page(s):1452 - 1456
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    Experimental results of heat transfer in helium-gas-enclosed disk enclosure (DE) are described. The following results were obtained. (1) The windage loss of a DE containing helium gas is about one fifth of that of a DE containing air. This effectively decreases DE temperature and disk runout. (2) The temperature increase of the positioner coil in helium gas is about one half of that in air. (3) Sm... View full abstract»

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  • Effects of high current pulses on integrated circuit metallization reliability

    Publication Year: 1988, Page(s):3 - 6
    Cited by:  Papers (4)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    Transient heat flow analysis using two-dimensional finite-element method has been used to calculate the temperature rise of aluminum lines on passivated and unpassivated silicon substrates. The results are used to predict the effect of self-heating on the electromigration lifetime of aluminum interconnects under pulse current stressing. A model has been developed to incorporate damage relaxation a... View full abstract»

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  • Low temperature semiconductor electronics

    Publication Year: 1988, Page(s):106 - 114
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    The authors consider that, at any technology level, operation at liquid nitrogen temperature (LNT: 77.3 K) can directly yield a performance improvement exceeding that provided through down-scaling by a factor of two. Thus, MOS technology limits are extended by one generation through LNT operation. Because of its attractive speed, density, and power attributes, liquid-nitrogen-cooled CMOS represent... View full abstract»

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  • Thermal characteristics of a fixed disk drive

    Publication Year: 1988, Page(s):137 - 141
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (316 KB)

    The thermal characteristics of an IMB 5.25-in fixed disk drive were experimentally determined to aid in the development of a general disk drive model. In general, the thermal model was able to predict the transient temperature profiles. At 4000 r.p.m., the steady-state temperature of the air and arms were predicted within 0.4°C, and the base temperature was predicted within 2.4°C. The air ... View full abstract»

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  • Temperature distribution in IC plastic packages in the reflow soldering process

    Publication Year: 1988, Page(s):50 - 59
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    Temperature distribution in the packages is evaluated by both experimental method and an analytical finite-element method (FEM). It is found that the FEM analysis is useful for the temperature estimation of the packages. Temperature sensors imbedded in silicon chips were used to measure the temperature distribution in the package in both the reflow soldering process and the dip-coating process. Th... View full abstract»

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  • Simulation of thermal behaviour in hybrid circuits

    Publication Year: 1988, Page(s):15 - 20
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    A model is presented to investigate the hot-spot effect, occurring at the termination point of a trimming out in screen-printed resistors. The phenomenon is studied by means of a potential problem to calculate the electrical field in the resistor, for which a 2D thermal model, and a 3D thermal model have been built up. The steady-state behavior and the transient behavior are presented. Several exa... View full abstract»

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  • Thermal stability of various ball-limited-metal systems under solder bumps

    Publication Year: 1988, Page(s):67 - 70
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    Thermal stability is discussed of ball-limited-metal (BLM) layers formed under controlled-collapse solder (lead-5 wt.% tin) bumps for flip-chip interconnections. All BLM systems used here consist of a triple-layer deposit of Cr or Ti as an adhesive; Ni, Mo, Pd, or Pt as a barrier; and Au as a surface metal. Using test chips with these BLM systems, mechanical pull-strength values of solder-bump joi... View full abstract»

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  • A method to reduce temperature overshoots in immersion cooling of microelectronic devices

    Publication Year: 1988, Page(s):100 - 105
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    It is demonstrated that the generation of vapor below a heated surface is an effective means of reducing the large superheat required for inception of boiling with liquids suitable for direct-immersion cooling of microelectronic devices. In experiments with R-113 and a plain copper heat sink surface, the incipient boiling superheat was reduced from 33 K to as low as 8 K. With sintered boiling surf... View full abstract»

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  • Thermal characteristics of dot-matrix print heads

    Publication Year: 1988, Page(s):132 - 136
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    The general aspects of the thermal characteristics of the dot-matrix impact print heads are discussed. To address the problem, a brief analysis for a typical print head is presented. The rate of heat generated in a dot-matrix print head, depending on its speed, print quality, and print mode (i.e. graphic or text mode), can be very large. The sources of the heat dissipation are found to be: the res... View full abstract»

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  • Heat transfer augmentation in a foam-material filled duct with discrete heat sources

    Publication Year: 1988, Page(s):87 - 91
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    A heat treatment augmentation technique utilizing a foam-material system for potential application to electronics cooling is presented. The geometry under consideration is a foam-material filled duct with discrete heat sources on its walls. The volume-averaged momentum and energy equations are used to analyze the flow and heat transfer. The present analysis includes the boundary, inertial, and dis... View full abstract»

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  • Thermal phenomena in silicon-germanium molecular beam epitaxial growth

    Publication Year: 1988, Page(s):181 - 189
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (464 KB)

    Thermally activated processes control nearly all steps in the cleaning, growth and doping of molecular-beam-grown epitaxial films. The temperature dependence of five such processes important in the emerging technology of MBE growth of silicon and germanium films is discussed: (1) SiO2 removal in the initial cleaning of the substrate, (2) surface diffusion during normal MBE growth, (3) t... View full abstract»

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  • Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation

    Publication Year: 1988, Page(s):41 - 49
    Cited by:  Papers (14)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (BN) as filter. The thermal conductivity of BN filled epoxies is influenced by the sample preparation procedures, due to agglomeration effects of the particles in the matrix. The temperature dependence of the thermal conductivity of resins is measured as a function of... View full abstract»

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  • An inverse method to determine the temperature profile on a semiconductor power diode

    Publication Year: 1988, Page(s):7 - 14
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (548 KB)

    An approach is developed to determine the nonuniform temperature profile on a semiconductor power diode. The temperature distribution over the large junction area of power semiconductor devices is often nonuniform due to voids or cracks in the mountdown media. Since the device packaging typically prevents direct measurement of the junction temperature, the presented technique requires the measurem... View full abstract»

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  • Design of a candidate thermal control system for a cryogenically-cooled computer

    Publication Year: 1988, Page(s):115 - 126
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    The thermal aspects are discussed of an immersion-cooled computer designed to operate at cryogenic temperatures. Several of the major thermal design issues are discussed in detail. These include: (1) the selection of a working fluid; (2) the determination of the mode, or modes, of heat transfer to be used: (3) the selection, or development, of any required heat transfer correlations; and (4) the s... View full abstract»

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  • Photoelastic and numerical investigation of thermally-induced restrained shrinkage stresses in plastics

    Publication Year: 1988, Page(s):60 - 66
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (588 KB)

    A photoelastic analysis is used to determine stress distributions within an epoxy encapsulation material for idealized geometries. Experimental results are compared with analytical and numerical predictions based on actual material data. It is demonstrated that to determine quantitative stress levels using photoelasticity it is necessary to separate orientation effects from an elastically active p... View full abstract»

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  • A microcomputer thermal analysis of a Gunn diode in microstrip circuits

    Publication Year: 1988, Page(s):21 - 28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (504 KB)

    A microcomputer finite-element code has been used to analyze the steady-state thermal behavior of a microstrip Gunn diode circuit with the goal of reducing the device temperature by varying microstrip thicknesses. Although the microstrip is designed mainly for electronic purposes, the analysis has shown that it can also provide a favorable thermal environment to alleviate the device temperature. A... View full abstract»

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  • Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch

    Publication Year: 1988, Page(s):71 - 78
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB)

    A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented View full abstract»

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  • Fluid selection and property effects in single and two-phase immersion cooling [electronic components]

    Publication Year: 1988, Page(s):92 - 99
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    The governing equations for liquid and two-phase heat transfer are used to derive fluid figures-of-merit (FOMs) for liquid-forced and natural convection, boiling incipience, and critical heat flux in both pool and flow boiling modes. These FOMs are given to help evaluate and compare the thermal performance of several candidate immersion cooling fluids. In addition, the governing equations are used... View full abstract»

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