24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)

5-9 May 2001

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  • 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)

    Publication Year: 2001
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    Freely Available from IEEE
  • Ink jet print head producing simulation and methods

    Publication Year: 2001
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (49 KB)

    Summary form only given. The process for manufacturing a thin film resistor substrate is useful in fabricating an ink jet print head, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. Thermal ink jet print heads play a dominant role in drop-on-demand print head technology. Improvements of efficiency and lifetime are an ongoing challeng... View full abstract»

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  • List of authors

    Publication Year: 2001, Page(s):0_12 - 0_11
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    Freely Available from IEEE
  • Investigation of amorphous V2O5-P2O5 with different metallic contacts

    Publication Year: 2001, Page(s):121 - 124
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (308 KB) | HTML iconHTML

    Amorphous semiconductors applied in switching and memory techniques are, generally, chalcogenous glasses. Their main disadvantage consisted of a relatively low current density. Due to this fact, research has moved on to an amorphous substance, V2O5 -P2O5, with a low CuO dopant content (0.5 to 2.0%) that exhibited higher current density. The metal contact... View full abstract»

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  • Thermal absorption in surface mount assembly

    Publication Year: 2001, Page(s):289 - 292
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (240 KB) | HTML iconHTML

    Thermal phenomena studies in the case of surface mounted devices have two usual directions. Firstly, it is very important to know the thermal dissipation or heat transfer from devices to the user environment, and secondly, it is important to know the thermal absorption or heat transfer from the manufacturing environment to the components and assembly. The first direction offers criteria to fabrica... View full abstract»

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  • Power factor correction circuit with a new modified SEPIC converter

    Publication Year: 2001, Page(s):117 - 120
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (224 KB) | HTML iconHTML

    This paper presents a new topology for a SEPIC converter used in power factor correction circuits. The conventional SEPIC converter was primarily designed to provide a nonpulsating input current, operating with both inductors in continuous current mode and only DC-DC conversion was considered. The modified SEPIC converter is designed to operate as an AC-DC converter and can be viewed as a cascade ... View full abstract»

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  • Using distributed neural networks in automated optical inspection

    Publication Year: 2001, Page(s):286 - 288
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (300 KB) | HTML iconHTML

    This paper introduces the concept of distributed neural networks over a computer network. Each layer in the neural network can be run as a separate application on different computers or on the same computer. The paper emphasizes the advantages of such an architecture over classical ones in terms of issues such as large neural networks and large input data. To test this new architecture, we use ima... View full abstract»

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  • Potentiality of LTCC for sensor applications

    Publication Year: 2001, Page(s):112 - 116
    Cited by:  Papers (2)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (400 KB) | HTML iconHTML

    The potential of low temperature cofired ceramic (LTCC) multilayer technology allows realization of different structures for sensor applications. Examples of sensors realised at the Department of Hybrid Microelectronics in the Faculty of Electrical Engineering and Informatics at the Technical University in Kosice have shown the potential and development possibilities of LTCC for a wide field of th... View full abstract»

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  • Assessing the reliability and safety of fault tolerant designs

    Publication Year: 2001, Page(s):56 - 58
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (164 KB) | HTML iconHTML

    Present-day fault-tolerant systems are increasingly used in critical applications such as aircraft control systems and industrial controllers. Dependability considerations require that in addition to high reliability, the system must have a high level of safety. Briefly, the reliability R(t) is the probability that the system produces correct output. Safety S(t) is defined as the probability that ... View full abstract»

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  • Intelligent servo hydraulic device for the control of the motion

    Publication Year: 2001, Page(s):282 - 285
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (416 KB) | HTML iconHTML

    Hydraulic servocylinders are electro-hydraulic devices used in automatic control systems to achieve any mechanical parameters-displacement, speed, acceleration, force-precisely. This paper presents a mathematical model and numerical simulation for a servocylinder which contains a double-acting hydraulic cylinder and a servo-valve, with the following parameters: 80 mm tube diameter, 200 bar maximal... View full abstract»

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  • New PSPICE model for power MOSFET devices

    Publication Year: 2001, Page(s):158 - 162
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (288 KB) | HTML iconHTML

    The common PSPICE model for the power MOSFET device is well known to CAD designers. This paper addresses the problem of how to correctly simulate a nonlinear device by modeling the nonlinear components of its PSPICE model: drain-to-source resistance vs. temperature, drain-to-source and gate-to-source capacitance vs. voltage. By comparing the simulation results of the common PSPICE MOSFET model wit... View full abstract»

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  • Using of Macromedia FLASH for development of Internet based lectures at the Department of Electrotechnology of the CTU Prague

    Publication Year: 2001, Page(s):107 - 111
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (368 KB) | HTML iconHTML

    Contemporary trends in education in such a traditional field as technology need the use of modern learning tools, e.g. the Internet, e-mail, multimedia, remote access, animation and interactive work. One of the important goals in teaching of electro-technology is an understanding of technological processes. However, it is not possible to demonstrate all technological processes under laboratory con... View full abstract»

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  • Relationships among properties of sputtered thin films and sputtering process parameters

    Publication Year: 2001, Page(s):42 - 46
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (392 KB) | HTML iconHTML

    This paper focuses on the investigation of the influence of process parameters (pressure, applied power, sputtering time) during the radio frequency magnetron sputtering of nickel, aluminum and combined aluminum-silicon on properties of thin films. The experiments were carried out on the BALZERS PLS 160 radio frequency magnetron sputtering unit, using an argon atmosphere. The sheet resistance and ... View full abstract»

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  • Reproducibility investigations and different experiments with a new type of electronically-conducting-polymer based bipotentiostatic uric acid sensor

    Publication Year: 2001, Page(s):268 - 272
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (392 KB) | HTML iconHTML

    Reproducibility investigations and different experiments with a new type of electronically-conducting-polymer based bipotentiostatic uric acid sensor have been conducted. The sensor was constructed by using dodecyl sulfate doped poly-N-methyl-pyrrole for enzyme immobilization. This polymer film can incorporate the enzyme in one step during electropolymerisation. By the bipotentiostatic measuring m... View full abstract»

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  • Modeling moisture caused failures in stress tests

    Publication Year: 2001, Page(s):129 - 132
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (272 KB) | HTML iconHTML

    The most important time related parameter of electronic systems is MTTF (mean time to failure). In accelerated aging tests, the circuits are exposed to enormously harsh environmental conditions. The accelerating parameters and events like mechanical vibration and shock, temperature, pressure, humidity and their combinations are used as loads in stress test methods. There are different models to de... View full abstract»

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  • High frequency E-field probe

    Publication Year: 2001, Page(s):172 - 174
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (212 KB) | HTML iconHTML

    This paper describes the construction of a high frequency E-field probe produced using polymer thick film technology. The probe is the key element of a complex measurement system which examines the absorbed power caused by the electromagnetic field of cellular phone equipment. The measurement system meets the requirements of the CENELEC recommendations in this area. The probe measures magnitude of... View full abstract»

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  • Rework of flip-chip populated PCBs by laser desoldering

    Publication Year: 2001, Page(s):63 - 67
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (448 KB) | HTML iconHTML

    New packaging concepts for electronic components and assemblies are an essential base for continuing miniaturization. The successful use of flip-chip, chip scale packages and microball grid arrays depends on the availability of suitable rework techniques to minimize refuse by replacing defective components. Laser desoldering of flip chips is a promising precisely controllable alternative to standa... View full abstract»

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  • Utilization of the seven Ishikawa tools (old tools) in the six sigma strategy

    Publication Year: 2001, Page(s):51 - 55
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (336 KB) | HTML iconHTML

    Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, also known as the seven quality control tools, are among the most useful and famous tools. The main goal of the use of these tools in manufacturing processes is to det... View full abstract»

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  • Tracking tool in MCM-L prototyping system

    Publication Year: 2001, Page(s):154 - 157
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (280 KB) | HTML iconHTML

    For a manufacturing firm, it is fundamental to know the cost of production and the status of orders in the production process. Although the authors' PWB (printed wiring board) prototyping laboratory complex is not a real firm but a part of an academic institution, the cost reduction and identification of different orders in progress are important questions. For these purposes, we have defined an i... View full abstract»

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  • Design principles for modeling and simulations of microwave circuits

    Publication Year: 2001, Page(s):102 - 106
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (300 KB) | HTML iconHTML

    It has often proven difficult to simulate microwave and RF circuits accurately. This paper presents an easy method for modeling and simulation of nonlinear active microwave circuits using the Ansoft Serenade 8.0 Design Environment. Starting with some simple circuits (MESFET mixer circuits, GaAs BJT feedback microwave amplifier), the authors describe the main principles of simulating RF and microwa... View full abstract»

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  • Complexity computations in code cracking problems

    Publication Year: 2001, Page(s):225 - 232
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (608 KB) | HTML iconHTML

    The linear complexity of a sequence is the size of the shortest feedback drift register, which generates the sequence. A method of estimating this complexity consists in successive processing of the sequence and obtaining a monotone increasing sequence of estimators (linear complexity profile), of which the limit is the linear complexity. The results presented here have applications in cryptograph... View full abstract»

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  • Influence of plasma treatment on the improvement of surface energy [packaging]

    Publication Year: 2001, Page(s):37 - 41
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (332 KB) | HTML iconHTML

    Surface treatment is increasingly important in electronic packaging. Reasons for this development are increasing demands on the reliability of component packaging and the application of different materials with either high-energy or low-energy surfaces. High-energy materials include metals, metal oxides and inorganic compounds. Low-energy materials include organic materials and water. The surface ... View full abstract»

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  • Modeling and analysis of accelerated life test data

    Publication Year: 2001, Page(s):306 - 309
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (228 KB) | HTML iconHTML

    An algorithm has been developed to implement accelerated life test data analysis for multiple type stress. The advantage is that it combines in one model most of the known life-stress relationships for one or two types of stresses such as the temperature-nonthermal modes. The solution to this model provides the engineers with an opportunity to expand their selection types, stresses and test condit... View full abstract»

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  • The concepts, methods and technics for the electronic testability implementation

    Publication Year: 2001, Page(s):263 - 267
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (372 KB) | HTML iconHTML

    The first part of the paper briefly describes the necessity of testability and the design-for-test concept. The testability problem is presented at the integrated circuit, printed circuit board layout and electronics module levels. In the second part, several very important strategies for testability development are proposed (in nine stages). As applications, testing practice problems are presente... View full abstract»

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  • Thermal investigation of plastic-encapsulated and hermetically sealed components for automotive industry

    Publication Year: 2001, Page(s):167 - 171
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (484 KB) | HTML iconHTML

    The reliability and lifetime of electronic components are mainly influenced by aging processes related to superposition effects of mechanical vibrations, thermomechanically induced stress and thermal loads. The latter two factors can be minimized by optimizing the component's thermal design. In simple cases, a satisfying thermal design can be found in an empirical way. However, in order to reduce ... View full abstract»

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