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Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on

Date 5-9 May 2001

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Displaying Results 1 - 25 of 71
  • 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)

    Publication Year: 2001
    Save to Project icon | Request Permissions | PDF file iconPDF (342 KB)  
    Freely Available from IEEE
  • List of authors

    Publication Year: 2001 , Page(s): 0_12 - 0_11
    Save to Project icon | Request Permissions | PDF file iconPDF (103 KB)  
    Freely Available from IEEE
  • Optimization of inspection strategies by use of quality cost models and SPC

    Publication Year: 2001 , Page(s): 293 - 297
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (352 KB) |  | HTML iconHTML  

    The main goals of quality management are customer satisfaction by delivery of defect free products, and radical reduction of defect rates and quality costs in production. Controlled processes are the most important way to reach these goals. In electronics production, the processes are complex and are subject to many strong environmental influences, especially for production of small batches of ass... View full abstract»

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  • Modeling moisture caused failures in stress tests

    Publication Year: 2001 , Page(s): 129 - 132
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (272 KB) |  | HTML iconHTML  

    The most important time related parameter of electronic systems is MTTF (mean time to failure). In accelerated aging tests, the circuits are exposed to enormously harsh environmental conditions. The accelerating parameters and events like mechanical vibration and shock, temperature, pressure, humidity and their combinations are used as loads in stress test methods. There are different models to de... View full abstract»

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  • Characterization of differential interconnects from time domain reflectometry measurements

    Publication Year: 2001 , Page(s): 298 - 301
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (292 KB) |  | HTML iconHTML  

    Differential signaling schemes are a common approach to achieving higher noise immunity for critical signals in a high-speed digital design. A differential pair constitutes a set of coupled transmission lines and, therefore, can be modeled and simulated as such. Short differential lines can be modeled using coupled LC matrices, but a distributed model is required for longer lines. In this article,... View full abstract»

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  • Accelerated life time test methods for new package technologies

    Publication Year: 2001 , Page(s): 215 - 219
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (344 KB) |  | HTML iconHTML  

    This paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters of new packaging technologies. Another goal of the paper is to introduce some models of the life time acceleration. The most commonly used stresses are: temperature-related accelerated test; temperature cycling; thermal shock, which can be more severe than temperature ... View full abstract»

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  • Some investigations on a “hidden” discontinuity: T-branch

    Publication Year: 2001 , Page(s): 133 - 136
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (240 KB) |  | HTML iconHTML  

    Among branch discontinuities found in PCB and microwave planar structures, the most usual are “T-branch” (or “T-junction”) and “cross”, the former having greater weight in practical applications. “T-branch” discontinuity is often found in standard passive interconnection structures. Normally, the designers use it during multi-connection trees generat... View full abstract»

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  • Platinum IR sources for NDIR gas monitors

    Publication Year: 2001 , Page(s): 189 - 192
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (300 KB) |  | HTML iconHTML  

    The work presents the results of research of the new thermal IR sources to be used in NDIR (nondispersive infrared) gas monitors. The developed sources are adapted to direct modulation that consists of supplying the heater with variable voltage. Appropriate heat transfer makes it possible to reach a modulation frequency as high as 50 Hz. This value is considerably greater then the frequency limit ... View full abstract»

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  • Embedded passive components for MCM

    Publication Year: 2001 , Page(s): 73 - 77
    Cited by:  Papers (6)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (400 KB) |  | HTML iconHTML  

    MCMs often have a large number of passive components connected to a small number of active devices. Integration of passive components into the MCM substrate improves electrical properties and reliability, and also reduces the cost, size and weight of electronic systems. The embedded components are mostly used in MCM-D (thin film) and MCM-C (thick film) modules. The use of embedded elements for MCM... View full abstract»

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  • Design principles for modeling and simulations of microwave circuits

    Publication Year: 2001 , Page(s): 102 - 106
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (300 KB) |  | HTML iconHTML  

    It has often proven difficult to simulate microwave and RF circuits accurately. This paper presents an easy method for modeling and simulation of nonlinear active microwave circuits using the Ansoft Serenade 8.0 Design Environment. Starting with some simple circuits (MESFET mixer circuits, GaAs BJT feedback microwave amplifier), the authors describe the main principles of simulating RF and microwa... View full abstract»

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  • Multilevel modeling and simulation of a switched reluctance machine

    Publication Year: 2001 , Page(s): 248 - 252
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (284 KB) |  | HTML iconHTML  

    In this paper, the modeling and simulation of a switched reluctance machine is described. Modeling and simulation is an already accepted method in the design of drive systems. The entire drive, including power converter, SRM, mechanical load and control are modeled in one multilevel model. The paper explains why use is made of a multilevel package for modeling and simulation of a complete drive sy... View full abstract»

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  • Education of the computer aided design

    Publication Year: 2001 , Page(s): 220 - 224
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (324 KB) |  | HTML iconHTML  

    Circuit module design is one of the most important topics in electronic education. During their study, students have to design, simulate, realize and document a functional circuit. The education includes lectures and laboratory exercises. On the lectures, the students are acquainted with the design rules and the use of OrCAD software. The lecturer uses a PC-projector for the PowerPoint show and fo... View full abstract»

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  • Conductive adhesive-an alternative to solder in SMT

    Publication Year: 2001 , Page(s): 20 - 25
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (496 KB) |  | HTML iconHTML  

    Isotropic conductive adhesives (ICAs) provide an environmentally friendly alternative to solders for interconnections in electronic applications with advantages of low processing temperature and an improved fine pitch capability. However, unstable electrical conductivity under elevated temperature and humidity conditions, and low interconnect impact resistance were major obstacles preventing ICAs ... View full abstract»

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  • Influence of plasma treatment on the improvement of surface energy [packaging]

    Publication Year: 2001 , Page(s): 37 - 41
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (332 KB) |  | HTML iconHTML  

    Surface treatment is increasingly important in electronic packaging. Reasons for this development are increasing demands on the reliability of component packaging and the application of different materials with either high-energy or low-energy surfaces. High-energy materials include metals, metal oxides and inorganic compounds. Low-energy materials include organic materials and water. The surface ... View full abstract»

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  • Complexity computations in code cracking problems

    Publication Year: 2001 , Page(s): 225 - 232
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (608 KB) |  | HTML iconHTML  

    The linear complexity of a sequence is the size of the shortest feedback drift register, which generates the sequence. A method of estimating this complexity consists in successive processing of the sequence and obtaining a monotone increasing sequence of estimators (linear complexity profile), of which the limit is the linear complexity. The results presented here have applications in cryptograph... View full abstract»

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  • A new methodology for using OrCAD applications on a network

    Publication Year: 2001 , Page(s): 238 - 242
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (380 KB) |  | HTML iconHTML  

    Designing in a network environment is the most effective way to obtain the best results, but this design method is often difficult to organize when taking into account the network management problems imposed by the CAD environment used. This paper presents a new solution for implementing a network methodology for working with OrCAD in a multi-layer design team. The proposed methodology solves the ... View full abstract»

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  • How to teach electronics packaging technology?

    Publication Year: 2001 , Page(s): 7 - 12
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (568 KB) |  | HTML iconHTML  

    The preparation of engineers for the 21st century's requirements of rapidly developing information technology as well as microelectronics and electronics packaging technology is a real challenge for education. An approach that teaches electronics packaging technology and associated topics, providing lecture courses, lab sessions and independent research studies supported by a prototype manufacturi... View full abstract»

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  • Investigation on an integrated liquid cooling system in LTCC-multilayer

    Publication Year: 2001 , Page(s): 178 - 182
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (440 KB) |  | HTML iconHTML  

    Thermal management is one of the most important problems of electronic packaging design. Different concepts are discussed for material selection and design for LTCC modules. This paper gives an overview of the experimental and simulation results of a special concept with an integrated liquid cooling system in the LTCC multilayer. This concept, based on the integration of a channel system direct in... View full abstract»

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  • High sensitive pulse inductive eddy current measurement for mine detection systems

    Publication Year: 2001 , Page(s): 207 - 211
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (352 KB) |  | HTML iconHTML  

    Due to military conflicts, more than 100 million landmines are scattered all over the world. Besides the unbelievable human suffering these mines cause, mines are a strong economic and environmental problem and prevent industrial and agricultural use of land. State of the art mine detection is mainly based on metal detectors (MD). Due to military and urban metal parts like shrapnel, nails, etc., a... View full abstract»

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  • The computer aided design concept in the concurrent engineering context

    Publication Year: 2001 , Page(s): 97 - 101
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (384 KB) |  | HTML iconHTML  

    Modern design concepts are focused on the product life-cycle, such that all the aspects of designed systems and their corresponding dependencies are considered. These conditions are fulfilled by the concurrent engineering (CE) approach, which creates a new context for design and management according to which the life-cycle design is performed by functional and disciplinary heterogeneous teams. Thi... View full abstract»

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  • Assessing the reliability and safety of fault tolerant designs

    Publication Year: 2001 , Page(s): 56 - 58
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (164 KB) |  | HTML iconHTML  

    Present-day fault-tolerant systems are increasingly used in critical applications such as aircraft control systems and industrial controllers. Dependability considerations require that in addition to high reliability, the system must have a high level of safety. Briefly, the reliability R(t) is the probability that the system produces correct output. Safety S(t) is defined as the probability that ... View full abstract»

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  • Visual modelling of physical processes

    Publication Year: 2001 , Page(s): 78 - 82
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (620 KB) |  | HTML iconHTML  

    The development of information technology has also opened new perspectives in modeling and simulation of processes used in electronics packaging technology. In September of 1999 an IEEE/NSF supported Project has been launched for the creation of a virtual laboratory (http://www.ett.bme.hu/vlab or http://www.ewh.ieee.org/mm/cpmt/vlab) environment to present and study equipment, and to promote proce... View full abstract»

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  • Using of Macromedia FLASH for development of Internet based lectures at the Department of Electrotechnology of the CTU Prague

    Publication Year: 2001 , Page(s): 107 - 111
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (368 KB) |  | HTML iconHTML  

    Contemporary trends in education in such a traditional field as technology need the use of modern learning tools, e.g. the Internet, e-mail, multimedia, remote access, animation and interactive work. One of the important goals in teaching of electro-technology is an understanding of technological processes. However, it is not possible to demonstrate all technological processes under laboratory con... View full abstract»

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  • Machine and process capability coefficient of solder paste printers

    Publication Year: 2001 , Page(s): 26 - 31
    Cited by:  Papers (1)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (348 KB) |  | HTML iconHTML  

    For manufacturers of assembled boards seeking ISO 9000 certification, a number of requirements are placed on measurement instruments and tooling. This standard requires a system to document and maintain calibration and machine capabilities. One of these problems is the measurement of printing accuracies of solder paste printers. The paper presents: short theoretical overview of machine capabilitie... View full abstract»

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  • An investigation of thick-film resistor, fired at different temperatures, for strain sensors

    Publication Year: 2001 , Page(s): 32 - 36
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (508 KB) |  | HTML iconHTML  

    Some commercial 10 kΩ/sq. thick-film resistors based on RuO 2, ruthenates or a mixture of RuO2 and ruthenates, were evaluated for strain gauge applications. The resistors were fired at different temperatures to determine the influence of firing temperature on the electrical characteristics. The conductive phase in the resistors was determined with X-ray powder-diffracti... View full abstract»

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