Date 6-6 June 2001
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Displaying Results 1 - 25 of 94
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Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461)
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PDF (619 KB)
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Author index
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PDF (228 KB)
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Overview for 300 mm foundry manufacturing
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PDF (352 KB)
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Copper wetting of two-dimensional silicates: robust barriers for interconnect applications
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PDF (198 KB)
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Characterization of electroless copper as a seed layer for sub-0.1 /spl mu/m interconnects
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PDF (271 KB)
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Development of low-k copper barrier films deposited by PE-CVD using HMDSO, N/sub 2/O and NH/sub 3/
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PDF (280 KB)
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Leakage current mechanisms for damascene process of Cu/methylsilane-doped low-k chemical vapor deposited oxides
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PDF (349 KB)
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Characterization of methyl-doped silicon oxide film for inter-layer dielectrics application
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PDF (558 KB)
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Proximity dummy feature placement and selective via sizing for process uniformity in a trench-first-via-last dual-inlaid metal process
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PDF (448 KB)
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Pattern dependence study of copper planarization using linear polisher for 0.13 /spl mu/m applications
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PDF (256 KB)
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Highly reliable interconnect integration of Cu and low-k organic polymer based on fine CD controls
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PDF (280 KB)
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Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
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PDF (279 KB)
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Inductive effects on crosstalk evaluation
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PDF (267 KB)
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