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Circuits and Systems Magazine, IEEE

Issue 4 • Date Fourthquarter 2014

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Displaying Results 1 - 10 of 10
  • [Front cover]

    Page(s): C1
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    Freely Available from IEEE
  • Table of contents

    Page(s): 1 - 2
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    Freely Available from IEEE
  • Editorial Board

    Page(s): 2
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  • [Message from the Vice President]

    Page(s): 4
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    Freely Available from IEEE
  • John Choma in Memoriam: I Did It My Way [Memorial]

    Page(s): 6 - 14
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    Freely Available from IEEE
  • Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream

    Page(s): 16 - 35
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (3944 KB)  

    A 3D IC is a chip having multiple tiers of stacked dies. The vertically stacked dies are electrically connected through 3D/vertical interconnects or popularly known as through-silicon-vias (TSVs). Development of a reliable 3D integrated system is largely dependent on the choice of filler material used in the TSV. Although, several researchers and fabrication houses have demonstrated the usage of copper as filler material, but, over the time it would suffer due to the rapid increase in resistivity under the combined effects of enhanced grain boundary scattering, surface scattering and the presence of a highly diffusive barrier layer. However, these limitations can be overcome by CNTs that exhibit higher mechanical and thermal stability, higher conductivity and larger current carrying capability. Moreover, a bundle of CNT conducts current parallely that drastically reduces the resistive parasitic and thereby propagation delay. Thus, bundled CNTs can be predicted as one of the potential candidates for future high-speed TSVs. However, the CNT growth temperature is greater than 600?A 3D IC is a chip having multiple tiers of stacked dies. The vertically stacked dies are electrically connected through 3D/vertical interconnects or popularly known as through-silicon-vias (TSVs). Development of a reliable 3D integrated system is largely dependent on the choice of filler material used in the TSV. Although, several researchers and fabrication houses have demonstrated the usage of copper as filler material, but, over the time it would suffer due to the rapid increase in resistivity under the combined effects of enhanced grain boundary scattering, surface scattering and the presence of a highly diffusive barrier layer. However, these limitations can be overcome by CNTs that exhibit higher mechanical and thermal stability, higher conductivity and larger current carrying capability. Moreover, a bundle of CNT conducts current parallely that drastically reduces the resistive parasit- c and thereby propagation delay. Thus, bundled CNTs can be predicted as one of the potential candidates for future high-speed TSVs. However, the CNT growth temperature is greater than 600°C that is unfortunately incompatible with CMOS devices and many other temperature-sensitive materials, therefore, the manufacturing of CNTs largely depends on the success of fabrication houses.C that is unfortunately incompatible with CMOS devices and many other temperature-sensitive materials, therefore, the manufacturing of CNTs largely depends on the success of fabrication houses. View full abstract»

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  • When Structure Meets Function in Evolutionary Dynamics on Complex Networks

    Page(s): 36 - 50
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    Evolutionary dynamics play a fundamental role in exploring the underlying mechanism of collective behaviors over a multi-agent network. Traditionally, evolutionary dynamics focus on the analysis of evolutionary behaviors of unstructured complex systems. However, recent research reveals that system structure is essential in the formation of collective behaviors. This article shows the intrinsic relation between structure and function of a complex dynamical network with evolutionary dynamics. In particular, the impact of node dynamics and network structure on evolutionary dynamics is investigated. Methods are given to find invasion hubs of a network and to design efficient networks for innovation diffusion. Moreover, it discusses some potential real-world applications and highlights some challenging problems for future studies. View full abstract»

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  • Simulation of Real World Circuits: Extending Conventional Analysis Methods to Circuits Described by Heterogeneous Languages

    Page(s): 51 - 70
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    Circuit simulation is seen by some people as a well established discipline, where there remains little or no space for improvement. Yet, no steady state and stability analysis methods are available for circuits described by a combination of analog, digital and behavioral parts. Recently, the theory necessary for development of such simulators was proposed and a circuit simulator incorporating these theoretical developments has been presented. It manages analog, digital and behavioral components, while retaining all the classical "spice-like" features. This was possible by importing some mathematical concepts from the hybrid dynamical systems realm. Such tools represent the interface between the conventional analog world and the more contemporary digital/behavioral one. The reviewed simulation framework is appealing not only for people interested in circuit analysis and design, but for all researches and engineers working in the wider field of system simulation where the analog mixed signal concept is absolutely pervasive. View full abstract»

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  • ISCAS 2015

    Page(s): 71
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  • 2014 Index IEEE Circuits and Systems Magazine Vol. 14

    Page(s): 1
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Aims & Scope

Insofar as the technical articles presented in the proposed magazine, the plan is to cover the subject areas represented by the Society's transactions, including: analog, passive, switch capacitor, and digital filters; electronic circuits, networks, graph theory, and RF communication circuits; system theory; discrete, IC, and VLSI circuit design; multidimensional circuits and systems; large-scale systems and power networks; nonlinear circuits and systems, wavelets, filter banks, and applications; neural networks; and signal processing.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Chi K. Tse
Hong Kong Polytechnic University