Notice
There is currently an issue with the citation download feature. Learn more

2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

10-13 Nov. 2015

Filter Results

Displaying Results 1 - 25 of 64
  • [USB label]

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (264 KB)
    Freely Available from IEEE
  • [USB welcome]

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (580 KB)
    Freely Available from IEEE
  • [Copyright notice]

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (108 KB)
    Freely Available from IEEE
  • Session list

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (20 KB)
    Freely Available from IEEE
  • Table of contents

    Publication Year: 2015, Page(s):1 - 10
    Request permission for commercial reuse | PDF file iconPDF (55 KB)
    Freely Available from IEEE
  • Brief author index

    Publication Year: 2015, Page(s):1 - 5
    Request permission for commercial reuse | PDF file iconPDF (28 KB)
    Freely Available from IEEE
  • Detailed author index

    Publication Year: 2015, Page(s):1 - 35
    Request permission for commercial reuse | PDF file iconPDF (87 KB)
    Freely Available from IEEE
  • The end of indexes

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (28 KB)
    Freely Available from IEEE
  • About CP

    Publication Year: 2015, Page(s): 1
    Request permission for commercial reuse | PDF file iconPDF (124 KB)
    Freely Available from IEEE
  • Frequently asked questions

    Publication Year: 2015, Page(s):1 - 6
    Request permission for commercial reuse | PDF file iconPDF (506 KB)
    Freely Available from IEEE
  • Chairs MSG

    Publication Year: 2015, Page(s): i
    Request permission for commercial reuse | PDF file iconPDF (151 KB) | HTML iconHTML
    Freely Available from IEEE
  • The technical programme committee

    Publication Year: 2015, Page(s): ii
    Request permission for commercial reuse | PDF file iconPDF (255 KB)
    Freely Available from IEEE
  • One scientific epoch ended and another began with James Clerk Maxwell

    Publication Year: 2015, Page(s): iii
    Request permission for commercial reuse | PDF file iconPDF (489 KB)
    Freely Available from IEEE
  • Sponsors

    Publication Year: 2015, Page(s): iv
    Request permission for commercial reuse | PDF file iconPDF (265 KB)
    Freely Available from IEEE
  • Exhibitors

    Publication Year: 2015, Page(s): v
    Request permission for commercial reuse | PDF file iconPDF (275 KB)
    Freely Available from IEEE
  • Emission reduction in Class D audio amplifiers by optimizing spread spectrum modulation

    Publication Year: 2015, Page(s):1 - 6
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1397 KB) | HTML iconHTML

    Due to their high efficiency compared to conventional Class AB amplifiers, Class D audio amplifiers have increasingly become the amplifier of choice especially for low power applications such as portable electronics. However, Class D amplifiers are still a major source of electromagnetic emission of the electronic applications in which they are used. In this paper the benefits of using spread spec... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • DC/DC converter dead-time variation analysis and far-field radiation estimation

    Publication Year: 2015, Page(s):7 - 12
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4013 KB) | HTML iconHTML

    This paper presents the dead-time variation analysis and far-field radiation estimation of a DC/DC converter. The critical factors influencing the dead-time variation are identified and their statistical distributions are defined. The statistical distribution of the MOSFET parasitic capacitances is optimized to match the values obtained by measurements. The packaging process variation together wit... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A highly-digitized automotive CAN transceiver in 0.14??m high-voltage SOI CMOS

    Publication Year: 2015, Page(s):13 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (831 KB) | HTML iconHTML

    This paper presents a novel CAN transceiver based on a highly-digitized architecture designed and fabricated in 0.14μm high-voltage SOI CMOS. This advanced BCD process allows the implementation of this innovative architecture which combines digital and high-voltage analog circuits. Hence, the output stage can be split in multiple unit cells successively enabled or disabled by a shift regist... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • EMC and switching loss improvement for fast switching power stages by di/dt, dv/dt optimization with 10ns variable current source gate driver

    Publication Year: 2015, Page(s):18 - 23
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1545 KB) | HTML iconHTML

    There is a growing need for motor drives with improved EMC in various automotive and industrial applications. An often referenced approach to reduce EME is to change the shape of the switching signal to reduce the EMI caused by the voltage and current transitions. This requires very precise gate control of the power MOSFET to achieve better switching behaviour and lower EME without a major increas... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Direct power injection on functional and non-functional signals of SPI EEPROM memories

    Publication Year: 2015, Page(s):24 - 28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (658 KB) | HTML iconHTML

    This paper deals with the conducted immunity of SPI EEPROM memories. The design and implementation of a wideband radio frequency-baseband multiplexer are described. This multiplexer makes it possible to superimpose radio frequency noise to a functional baseband signal with controlled and repeatable transfer characteristics. The baseband path has a measured DC - 380MHz bandwidth, while the radio fr... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Electromagnetic coupling circuit model of a magnetic near-field probe to a microstrip line

    Publication Year: 2015, Page(s):29 - 33
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (619 KB) | HTML iconHTML

    Electromagnetic (EM) injection experiments require an accurate and quantitative knowledge of the voltage effectively coupled to a target line or circuit in order to predict disruptive behavior or sensitivity of digital IC circuits to EM threats. To answer this question we derive here a complete quantitative model of the coupling of our magnetic probe to a microstrip line. The novelty of this model... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Bandgap failure study due to parasitic bipolar substrate coupling in Smart Power mixed ICs

    Publication Year: 2015, Page(s):34 - 38
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2161 KB) | HTML iconHTML

    In order to merge low power and high voltage devices on the same chip at competitive cost, Smart Power integrated circuits (ICs) are extensively used. The presence of low power and high voltage devices in Smart Power ICs cause parasitic substrate interaction between switched power stages and sensitive analog blocks. Nowadays this is the major cause of failure of Smart Power ICs inducing costly cir... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Fundamental study on randomized processing in cryptographic IC using variable clock against Correlation Power Analysis

    Publication Year: 2015, Page(s):39 - 43
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (533 KB) | HTML iconHTML

    Correlation Power Analysis (CPA) is one of the typical side-channel analyses targeting cryptographic IC. CPA calculates the Poisson correlation function between transient currents (which are generated from a cryptographic IC depending on the processed data) and hypothetical current values and then recovers the secret key from a high number of correlation computations. Countermeasures against side-... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Dynamic multi-parameter response model for SEED analysis

    Publication Year: 2015, Page(s):44 - 49
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1879 KB) | HTML iconHTML

    System Efficient ESD Design (SEED) [1] at present requires static response data from the devices and circuitry used along the protection chain, typically from the point of entry at the PCB boundary i.e. connector up to the circuit on-chip to be protected. On this path there may be external ESD protection i.e. voltage clamping, interconnect path delay with specific transmission line properties, pac... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principle

    Publication Year: 2015, Page(s):50 - 55
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1459 KB) | HTML iconHTML

    This paper discusses the shielding performance or shielding effectiveness of a board-level shield in function of its bonding method. Improved shielding performance at board-level in order to harden integrated circuits against unintentional and intentional electromagnetic interference, and this under harsh environmental conditions, is getting more and more important to achieve the desired levels of... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.