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Microwave and Wireless Components Letters, IEEE

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Microwave and Wireless Components Letters, IEEE

Issue 6 • Date June 2013

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Table of contents

IEEE Microwave and Wireless Components Letters publication information

Simulation of the Scattered Field From a Vibrating Tumor Inside the Tissue Using 3D-FDTD Method

Implementation of a First-Order ABC in Mixed Finite-Element Time-Domain Formulations Using Equivalent Currents

A Compact Bandpass Filter Based on Right- and Left-Handed Transmission Line Sections

Compact Tri-Band Bandpass and Bandstop Filters Based on Hilbert-Fork Resonators

A Solar Cell Stacked Multi-Slot Quad-Band PIFA for GSM, WLAN and WiMAX Networks

Silicon Micromachined Canonical ${\hbox {E}}$ -Plane and ${\hbox {H}}$ -Plane Bandpass Filters at the Terahertz Band

Self-Complementary Metasurface for Designing Narrow Band Pass/Stop Filters

A Wide-Band, High Isolation UHF Lumped-Element Ferrite Circulator

Association of HPWRs and DBRs for a High Rejection C-Band Filter With Post-Tuning Elements

A SU8 Micromachined WR-1.5 Band Waveguide Filter

Design of Sharp Roll-Off Lowpass Filter With Ultra Wide Stopband

Efficient Modeling and Simulation of Graphene Devices With the LOD-FDTD Method

A Low-Noise 150–210 GHz Detector in 45 nm CMOS SOI

A Wideband Distributed Amplifier Employing an Envelope Tracking Technique

An UHF RFID Energy-Harvesting System Enhanced by a DC-DC Charge Pump in Silicon-on-Insulator Technology

A GaN-Based Lamb-Wave Oscillator on Silicon for High-Temperature Integrated Sensors

Test-Fixture for Suspended-Strip Gap-Waveguide Technology on Ka-Band

Comments on Reply to Comments on "Wideband coupled-line microstrip filters with high-impedance short-circuited stubs"

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