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Semiconductor Manufacturing Technology Workshop, 2000

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Semiconductor Manufacturing Technology Workshop, 2000

Date 14-15 June 2000

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Title History

2000 Semiconductor Manufacturing Technology Workshop (Cat. No.00EX406)

An effective SPC approach to monitoring semiconductor quality data with multiple variation sources

Ultrathin (2.7 nm) oxy-nitride for suppressing boron penetration characterized by direct hole tunneling current in p+/pMOS

CMP area automation in SMIF fab

Perspective of Semiconductor Manufacturing from IC Design

Design and operation of reactive gas delivery systems for IC fabrication plants

A new isolation technology for mixed-mode and general mixed-technology SOC chips

Product mix planning in semiconductor foundry manufacturing

Notch elimination in polycide gate stack etching for advanced DRAM technology

Statistical modeling of MOS devices and ICs based on end-of-line manufacturing data

A cost-based heuristic for statistically determining sampling frequency in a wafer fab

Technical and Business Issues of 300mm Inplementation

Application of dynamic manufacturing service provisioning mechanism to delivery commitment

DRAM Production Strategy in Taiwan

SHEWMAC: an end-of-line SPC scheme via exponentially weighted moving statistics

Non-uniformity of temperature distribution in ballroom type cleanrooms with FFU systems

Photolithography area dispatching scheme for advanced technology in foundry fabs

A tool portfolio planning methodology for semiconductor wafer fabs

Translating fab cycle time and output targets into production control requirements for tool groups

Operation management interface for foundry operation users

Run-to-run control schemes for CMP process subject to deterministic drifts

Dynamic scheduling rule selection for fab operations

Global ESH cooperation & Technical Advances

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