Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Date 6-8 Aug. 2000
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Displaying Results 1 - 25 of 64
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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
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PDF (348 KB)
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Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage
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PDF (555 KB)
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Index of authors
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PDF (86 KB)
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Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps
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PDF (368 KB)
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Self-consistent model for dielectric constant prediction of polymer-ceramic composite
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PDF (368 KB)
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Application of phase-change materials in Pentium (R) III and Pentium (R) III XeonTM processor cartridges
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PDF (444 KB)
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Moisture uptake and chemical compatibility of semiconductor plastic encapsulant materials
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PDF (380 KB)
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Wafer level batch packaging (WLBP): incorporation of air pores/foams in a polyimide matrix using a low modulus sacrificial commercial polymer
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PDF (632 KB)
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Issues with fine pitch bumping and assembly
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PDF (960 KB)
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Investigation on effect of carbon black and polymer matrix on conductive polymer composites with positive temperature coefficient
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PDF (424 KB)
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A new light-weight electronic packaging technology based on spray-formed silicon-aluminium
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PDF (468 KB)
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Development of super fine pattern PWB MOSAIC
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PDF (404 KB)
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Comparison of various micro via technology
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PDF (240 KB)
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Investigating molecular interactions between underfill resins and organic passivator layers via flow microcalorimetry
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PDF (264 KB)
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Thru-silicon vias for 3D WLP
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PDF (152 KB)
