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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

18-21 June 2000

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  • 4/sub th/ International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing [front matter]

    Publication Year: 2000, Page(s):i - ix
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    Freely Available from IEEE
  • Conference Author Index

    Publication Year: 2000, Page(s):x - xii
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    Freely Available from IEEE
  • Processing and performance of high density interconnect (HDI) PWB with laser microvias

    Publication Year: 2000, Page(s):274 - 279
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (773 KB)

    Why do we need to supply microvias? New components, such as thin small outline packages (TSOPs), chip size packages (CSPs) and direct chip attachment (DCA) are forcing designers to create new layouts which challenge the fabricator to manufacture printed wiring boards (PWBs) with higher packaging densities, finer lines, smaller holes and blind vias to accommodate more functions on the interconnect ... View full abstract»

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  • Development of processing diagrams for underfill resins

    Publication Year: 2000, Page(s):174 - 181
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    Underfill resins are used to reduce the solder fatigue in flip-chip assemblies. Both the underfilling and the curing process are crucial to the reliability of the finished products. A variety of techniques have been used to characterize the essential phenomena governing the processing of underfill resins. Such phenomena include wetting, flow behavior, cure kinetics, cure stresses, outgassing pheno... View full abstract»

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  • Epoxy adhesives with soldering properties

    Publication Year: 2000, Page(s):168 - 173
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB)

    There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: parti... View full abstract»

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  • Investigations of plasma cleaning on the reliability of electrically conductive adhesives

    Publication Year: 2000, Page(s):41 - 45
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (488 KB)

    For the replacement of solder as the usual connection between electrical components by Isotropic Electrically Conductive Adhesives (ICAs), it is important to maintain mechanical and electrical properties comparable to the solder's characteristics. One performance area capable of improvement is the mechanical adhesion between the ICA and the contact surface. Plasma cleaning of surfaces should provi... View full abstract»

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  • ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges

    Publication Year: 2000, Page(s):1 - 15
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1692 KB)

    Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental a... View full abstract»

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  • Applicability of no-flow fluxing encapsulants and flip chip technology in volume production

    Publication Year: 2000, Page(s):163 - 167
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    Applicability of no-flow fluxing encapsulants and flip chip technology in volume production was studied. Adhesion of the underfill materials to different solder resists was measured with single lap shear test and the results compared with traditional underfills. No-flow underfiller was dispensed with standard in line dispenser. SnPb-bumped flip chip test structures were pick and placed on FR4 subs... View full abstract»

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  • A novel IMB technology for integrating active and passive components

    Publication Year: 2000, Page(s):269 - 273
    Cited by:  Papers (11)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (748 KB)

    In this study a novel integrated module board (IMB) technology which is used for integrating both active and passive components into ultra-high density printed wiring boards is presented. This non-vacuum and solderless technology is based on a photodefinable epoxy and fully additive electroless plating process. Conductive metals such as copper and nickel are chemically deposited onto photodefined ... View full abstract»

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  • Adhesion studies for flip-chip assemblies

    Publication Year: 2000, Page(s):35 - 40
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    Delamination at polyimide-epoxy interfaces is a major concern in microelectronic packaging (flip-chip assemblies). Typical interfacial fracture toughness values for such interfaces range from 10-60 J/m2 and the failure mode is predominately adhesive. In this study, the adhesive strengths of commercial and model underfill resins are evaluated using interfacial fracture mechanics and the... View full abstract»

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  • Thematic network “Adhesives in Electronics”. A two year review and future plans

    Publication Year: 2000, Page(s):304 - 306
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (228 KB)

    In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called “Thematic Network” on “Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)” was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant informati... View full abstract»

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  • Delamination analysis of electronic package assemblies with insulated metal substrate

    Publication Year: 2000, Page(s):56 - 60
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    Electronic packages are multi-layered structures with a large number of interfaces. Under certain conditions, some interfaces could delaminate, resulting in failures. Reliability tests on flip chip assemblies of L8AA daisy chain die on insulated metal substrate (IMS) have revealed that the lifetime is mainly determined by the material interfaces. The dominating end of life failure mechanism is int... View full abstract»

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  • Development of a rework-technology for flip-chips, using no-flow underfills

    Publication Year: 2000, Page(s):159 - 162
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    Underfill is a material used for filling the gap between a flip-chip and the PCB. Usually the material is dispensed after reflowing the solder joints. Driven by capillary force, it fills the gap and encapsulates the solder balls. No-flow underfills are a new technique to eliminate the time consuming flow and curing step of regular materials. These materials are dispensed before reflowing. The curi... View full abstract»

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  • Reliability of flip chip die attach in multichip mechatronic power module

    Publication Year: 2000, Page(s):93 - 100
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    Motorola's Interconnect Systems Laboratory in Munich has developed the assembly technology for a mechatronic multichip power module, a new intelligent connector for automotive applications. Product's requirements for simultaneous high power dissipation, current carrying and device interconnecting capability lead to selection of insulated metal substrate (IMS) as a substrate technology and electrop... View full abstract»

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  • Characterization of thin layers in microelectronic packaging using acoustic microscopy

    Publication Year: 2000, Page(s):225 - 231
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    Some of the transducer and image related issues involved in characterizing thin layers in microelectronic packaging are discussed here. Specifically, the cases of Parylene N on stainless steel and thinned silicon wafers are described. For the case of the Parylene coating, it is shown how a thin layer can distort the pulse reflected from the interface to the extent that a well bonded coating appear... View full abstract»

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  • Advanced substrates for wireless terminals

    Publication Year: 2000, Page(s):264 - 268
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    It has been estimated recently that within few years there will be more wireless terminals connected to the Internet and related services than there will be fixed equipment (desktop PCs, etc.). This means that the portable equipment needs high performance and high functionality combined with small size and low energy consumption, all this at low cost. Inevitably, very high packaging efficiency is ... View full abstract»

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  • Assembly of ultra thin and flexible ICs

    Publication Year: 2000, Page(s):20 - 23
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 μm. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or ev... View full abstract»

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  • Role of adhesion and its reliability implications in electronic assemblies

    Publication Year: 2000, Page(s):28 - 34
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1952 KB)

    An important aspect in the fabrication of electronic packages and assemblies is the joining of similar as well dissimilar pairs of materials with a range of physicochemical characteristics. Metal-metal, metal-polymer, and polymer-polymer interface are encountered. It is important to ensure adequate interfacial bonding, namely, adhesion strength between the material pairs for product performance in... View full abstract»

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  • Advanced environmental friendly materials for HDI applications

    Publication Year: 2000, Page(s):296 - 303
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, an... View full abstract»

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  • Laser processing of adhesives and polymeric materials for microelectronics packaging applications

    Publication Year: 2000, Page(s):289 - 295
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1520 KB)

    The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymers, including electrically and/or thermally conductive a... View full abstract»

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  • Development of high-density interconnection techniques for contactless smart cards

    Publication Year: 2000
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (40 KB)

    Summary form only given. This paper deals with techniques that are used for fabricating high density and thin assemblies with emphasis on materials, implementation and reliability. Moreover, a new potential interconnection and packaging technique being particularly suitable for contacting ultra-thin chips is also introduced. In the production tests electroless fine-pitch Ni/Au bumped chips were bo... View full abstract»

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  • A build-up substrate utilizing a new via fill technology by electroplating

    Publication Year: 2000, Page(s):280 - 288
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    A build-up substrate consisting of PPE resin (poly-phenylene ether) was developed to mount high pin count flip chips. It is essential to achieve high density patterns with controlled characteristic impedance for MPU packages and telecommunication devices. Via fill technology by electroplating incorporated with new via designs is effective for this application. Stacked via design and the technology... View full abstract»

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  • Development of solder replacement conductive adhesives with stable resistance and superior impact performance

    Publication Year: 2000, Page(s):110 - 116
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (724 KB)

    With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. Compared to Sn/Pb solders, conductive adhesive technology offers numerous advantages. However, this new technology still has reliability limitations. Two critical limitations are uns... View full abstract»

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  • Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system

    Publication Year: 2000, Page(s):153 - 158
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    Conductive polymer adhesives have been proposed as lead-free materials for flip-chip interconnection. The Semiconductor Industry Association (SIA) roadmap forecasts off-chip clock frequencies over 1 GHz by 2005. In GHz clock distribution issues such as clock skew, power, and timing jitter are becoming more crucial and strongly impact the operating speed of the digital processors. Interconnection t... View full abstract»

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  • Guidelines to select underfills for flip chip on board assemblies

    Publication Year: 2000, Page(s):86 - 92
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB)

    The effect of thermo-mechanical properties of underfill, such as coefficient of thermal expansion (CTE) and stiffness (Young's modulus), on reliability of flip chip on board (FCOB) under thermal cycling stresses is investigated in this study. 3-D and quasi three-dimensional viscoplastic stress analysis using finite element modeling (FEM) is combined with an energy partitioning (EP) model for creep... View full abstract»

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