Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Date 18-21 June 2000
Filter Results
Displaying Results 1 - 25 of 58
-
4/sub th/ International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing [front matter]
|
PDF (301 KB)
-
Conference Author Index
|
PDF (69 KB)
-
Processing and performance of high density interconnect (HDI) PWB with laser microvias
|
PDF (773 KB)
-
-
-
-
-
-
-
-
Modelling of ICA creep properties
|
PDF (372 KB)
-
Characterization of thin layers in microelectronic packaging using acoustic microscopy
|
PDF (536 KB)
-
-
Electrically conductive polyaniline adhesive
|
PDF (252 KB)
-
Delamination analysis of electronic package assemblies with insulated metal substrate
|
PDF (584 KB)
-
-
Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology
|
PDF (632 KB)
-
The evaluation of anisotropically conductive film for use in portable electronic products
|
PDF (44 KB)
-
Characterization and performance of electrically conductive adhesives for microwave applications
|
PDF (572 KB)
-
Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system
|
PDF (512 KB)
-
The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs
|
PDF (220 KB)
-
Modeling stresses in ultra-thin flip chips
|
PDF (336 KB)
-
Smart cards and smart labels-high volume applications of adhesive flip-chip technologies
|
PDF (612 KB)
-
-
