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Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Sept. 30 1992-Oct. 1 1992

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  • Sequential screening in semiconductor manufacturing: exploiting lot-to-lot variability and spatial dependence

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (70 KB)

    Summary form only given. Screening at the wafer level to exploit lot-to-lot variability is considered. The yield is modeled using an empirical Bayes framework: the number of bad chips on each wafer in a given lot is a gamma random variable, and the scale parameter is unknown and varies from lot to lot according to another gamma distribution. The resulting problem is an optimal stopping problem emb... View full abstract»

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  • Technology outreach

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (97 KB)

    Summary form only given. Technology transfer available at universities and federal laboratories, how to assess that technology, and why it is of vital importance to American global competitiveness have been examined.<> View full abstract»

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  • Managing safety for results

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (104 KB)

    Summary form only given. The Du Pont Company's safety and occupational health program is described and the continuous improvement process employed throughout the corporation is outlined. A commitment to preventing all injuries and high priority attention by line management to the task of integrating safety into the total management function is described. A comprehensive reporting system and suppor... View full abstract»

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  • IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC '92 Proceedings (Cat. No.92CH3182-3)

    Publication Year: 1992
    Request permission for commercial reuse | PDF file iconPDF (30 KB)
    Freely Available from IEEE
  • Yield and productivity management

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (71 KB)

    Summary form only given. The approaches, attitudes, and methodologies used by over 20 semiconductor manufacturers to manage yield and improve productivity have been examined. Selected topics in management systems and measurements, long- and short-loop analysis, data and information generation and handling, and manufacturing operational procedures have been considered.<> View full abstract»

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  • A market-driven methodology for improving servicability through an integrated customer/supplier partnership (CSP)

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (64 KB)

    Summary form only given. The customer/supply partnership (CSP), an innovative market-driven supply/commit process which integrates customer and supplier business operations, is discussed. CSP provides quick turn-around in a dynamic market, and produces accurate, detailed delivery projections which optimize customer production schedules and supplier servicability. CSP's all-encompassing approach to... View full abstract»

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  • An automated system for loading Atmoscan process tubes using intrabay material handling technologies

    Publication Year: 1992
    Cited by:  Papers (1)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (63 KB)

    Summary form only given. The authors point out that a tracked robot (intrabay) system that uses adaptive hardware to reliably load conventional shovel-type cantilevers as well as the Atmoscan-type has been implemented into production. In addition, a networked VAX software package has been deployed that controls and gathers data from the furnace controller via its SECS-II interface, making the oper... View full abstract»

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  • The challenge for American manufacturing

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (39 KB)

    Summary form only given. The status of various segments of the American manufacturing industry is discussed, comparing the prominence of these segments now versus a decade ago. Tools (concepts) in use today by prominent manufacturers and examples of success experienced by manufacturers utilizing these tools are presented. The examples are sufficiently specific to provide simulating questions to th... View full abstract»

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  • MOS device technology trend and future direction

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (54 KB)

    Summary form only given. It is pointed out that IC speed improvements slowed down after achieving 1- mu m geometry and will be very slight after 0.5 mu m. Scaling down the IC circuit in the depth direction is reaching the limit of existing technology. The real estate for isolation of CMOS SRAM structures occupies more than 80% of the total chip area and the possibility of any great improvement is ... View full abstract»

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  • Self-learning fuzzy modeling of semiconductor processing equipment

    Publication Year: 1992, Page(s):100 - 106
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (468 KB)

    A qualitative equipment model for a low pressure chemical vapor deposition (LPCVD) process is presented. The model is based on fuzzy representation of input-output relationships and utilizes self-tuning membership functions. To demonstrate this concept a fuzzy inference system has been built for polysilicon grain size prediction based on deposition and annealing temperatures. After the system is t... View full abstract»

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  • An analytical approach to improving equipment productivity

    Publication Year: 1992, Page(s):3 - 6
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    An analytical approach that shows how data paths from actual stepper fabs are made possible by the use of several computer programs, including computerized networks for collection and analysis of field reliability data, is described. Using the SEMI E-10-90 standard, comprehensive reliability studies are conducted. The database is used by service support personnel to improve scheduled maintenance, ... View full abstract»

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  • Advanced CIM environment for manufacturing data analysis

    Publication Year: 1992, Page(s):19 - 24
    Cited by:  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (500 KB)

    An environment for performing complex analyses of semiconductor manufacturing processes and IC products is described. This innovative analysis toolset has increased the productivity of product engineering, process engineering and design organizations by providing a method for complex manufacturing data reduction without the need for exhaustive training. The interactive, forms-based interface utili... View full abstract»

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  • Energy contamination control in multiple charged ion implantations

    Publication Year: 1992, Page(s):96 - 99
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    A technique for measuring and monitoring charge exchange reactions prior to implantation of multiple charged ion beams on an E500 medium current implanter is discussed. There is a clear relationship between the energy contamination level measured in-situ before implantation and SIMS (secondary ion mass spectrometry) and thermawave measurements afterwards. This electrical technique establishes the ... View full abstract»

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  • Rapid development, in a manufacturing environment, of a 1 μm triple-level metal CMOS process through the use of cross-functional teams

    Publication Year: 1992, Page(s):180 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The development, in a manufacturing environment, of a 1 μm triple-level-metal, 5 V CMOS process in under 25 weeks is discussed. The manufacturing process engineering group developed cross-functional process integration teams that synthesized device engineering from R&D, manufacturing process engineering, production, yield engineering, product engineering, and reliability engineering. By dev... View full abstract»

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  • Application of real-time expert systems in semiconductor manufacturing

    Publication Year: 1992, Page(s):90 - 95
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (508 KB)

    Some requirements of a real-time expert system and applications in process control, statistical process control, and scheduling are presented. Combining the expert system capability with object oriented modeling, one can build powerful applications in a relatively short time span, thus cutting down the time taken to implement a process control system. Also, when implemented, an expert-system-based... View full abstract»

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  • New ultra large field submicron i-line stepper for advanced mix-and-match applications

    Publication Year: 1992, Page(s):75 - 78
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    Lens and stage technologies that vastly reduce lithography processing costs, which have been incorporated into the Model 2244i ultra-large-field submicron i-line stepper, are described. It is shown how the technology reduces the overall cost of producing IC devices. The 2244i features a 22-mm×44-mm rectangular or 27-mm square field size. This field size, coupled with an extremely fast and ac... View full abstract»

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  • Examining process induced contamination: plasma etching and chemical vapor deposition reactors coupled to an in situ surface analytical capability

    Publication Year: 1992, Page(s):111 - 115
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (500 KB)

    A comprehensive approach developed for the systematic examination of process induced contamination and reaction mechanisms seen during electronics processing is discussed. The approach is based on a tool which models a cluster tool environment, incorporating both plasma and thermal processing, and coupling them in vacuo to a surface analytical instrument. This tool has been used to examine a numbe... View full abstract»

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  • Managing technology transfer: a matrix approach

    Publication Year: 1992, Page(s):186 - 188
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    The use of a multilevel matrix management approach to maximize the transfer of knowledge from the SEMATECH manufacturing research consortium to Harris Semiconductor is described. The technology transfer manager works through site coordinators to ensure transfer of technology in all areas, and on all levels. Harris management interacts with SEMATECH management to provide direction on major programs... View full abstract»

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  • Characterization of the wafer dicing process using Taguchi methodology

    Publication Year: 1992, Page(s):200 - 205
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (416 KB)

    The use of Taguch's method of experimental design to characterize the wafer dicing process and improve the yield by reducing backside damage is described. It is shown how the orthogonal array was modified to accommodate mixed levels. Analysis of variance (ANOVA) was used to identify the significant factors. Using the optimum levels of the significant factors resulted in over 85% reduction in scrap... View full abstract»

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  • Progress toward host tool integration of in situ particle monitors

    Publication Year: 1992, Page(s):16 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    The authors point out that in situ particle monitoring has gained substantial acceptance as a manufacturing process control technique, with the capability of providing automated 100% inspection during process. This is significant for several reasons, including faster detection of out of control events and higher baseline count rates as a consequence of the ability to monitor continuously, the dete... View full abstract»

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  • Productivity improvement in semiconductor fabrication environment using automode 2E+simulation software

    Publication Year: 1992, Page(s):84 - 89
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    The development and validation of a wafer fabrication simulation model on Mac II Ci based Automode IIe and the use of this model to improve Fab-2 productivity is discussed. The productivity improvement is achieved by reducing cycle times and work-in-process inventory while increasing factory capacity by optimum utilization of available resources. This study is limited to a 4-in Fab-2 wafer fabrica... View full abstract»

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  • Optimized metalization processing for improved manufacturability

    Publication Year: 1992, Page(s):72 - 74
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    Improvements brought about in 1.0-μm and 1.5-μm production CMOS processes through modifications in the metalization process are discussed. The standard metalization process consists of dry via etching with a bottom Ti-W thickness of 2200 Å deposited in the same pump-down as the Al film (no air exposure of bottom Ti-W). In the modified process, via etching is wet/dry and the bottom Ti-W... View full abstract»

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  • Product defect reduction through the use of business process management

    Publication Year: 1992, Page(s):43 - 48
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (300 KB)

    Points out that understanding the entire manufacturing process, across organizational boundaries, is a key element in improving shipped product quality level (SPQL). Employee participation in the understanding and improving of IBM's business processes improves product quality, business efficiency and employee morale. The impact of the business process teams on employee morale has been positive and... View full abstract»

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  • Profile control in isotropic plasma etching

    Publication Year: 1992, Page(s):116 - 119
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    The possibility of controlling the lateral-to-vertical etch ratio of undoped dielectric material is tested. The Lam Research Rainbow 4500i, configured with a downstream isotropic plasma etch chamber, was used for the study. The tetra-ethyl-ortho-silicate (TEOS) isotropic etch profile was examined as a function of process parameters in order to establish trends of isotropic etch profile. A fraction... View full abstract»

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  • Wafer fab production controls for the 90s

    Publication Year: 1992, Page(s):36 - 38
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (140 KB)

    The introduction and implementation of production control systems in wafer fabrication operations are discussed. The introduction of production planning systems and the results from the implementation of control systems placed on work-in-process inventory, equipment status, batch queuing/set-up, and statistical processing are considered View full abstract»

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