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Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Sept. 30 1992-Oct. 1 1992

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  • Sequential screening in semiconductor manufacturing: exploiting lot-to-lot variability and spatial dependence

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (70 KB)

    Summary form only given. Screening at the wafer level to exploit lot-to-lot variability is considered. The yield is modeled using an empirical Bayes framework: the number of bad chips on each wafer in a given lot is a gamma random variable, and the scale parameter is unknown and varies from lot to lot according to another gamma distribution. The resulting problem is an optimal stopping problem emb... View full abstract»

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  • Technology outreach

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (97 KB)

    Summary form only given. Technology transfer available at universities and federal laboratories, how to assess that technology, and why it is of vital importance to American global competitiveness have been examined.<> View full abstract»

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  • Managing safety for results

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (104 KB)

    Summary form only given. The Du Pont Company's safety and occupational health program is described and the continuous improvement process employed throughout the corporation is outlined. A commitment to preventing all injuries and high priority attention by line management to the task of integrating safety into the total management function is described. A comprehensive reporting system and suppor... View full abstract»

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  • IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC '92 Proceedings (Cat. No.92CH3182-3)

    Publication Year: 1992
    Request permission for commercial reuse | PDF file iconPDF (30 KB)
    Freely Available from IEEE
  • Yield and productivity management

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (71 KB)

    Summary form only given. The approaches, attitudes, and methodologies used by over 20 semiconductor manufacturers to manage yield and improve productivity have been examined. Selected topics in management systems and measurements, long- and short-loop analysis, data and information generation and handling, and manufacturing operational procedures have been considered.<> View full abstract»

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  • A market-driven methodology for improving servicability through an integrated customer/supplier partnership (CSP)

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (64 KB)

    Summary form only given. The customer/supply partnership (CSP), an innovative market-driven supply/commit process which integrates customer and supplier business operations, is discussed. CSP provides quick turn-around in a dynamic market, and produces accurate, detailed delivery projections which optimize customer production schedules and supplier servicability. CSP's all-encompassing approach to... View full abstract»

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  • An automated system for loading Atmoscan process tubes using intrabay material handling technologies

    Publication Year: 1992
    Cited by:  Papers (1)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (63 KB)

    Summary form only given. The authors point out that a tracked robot (intrabay) system that uses adaptive hardware to reliably load conventional shovel-type cantilevers as well as the Atmoscan-type has been implemented into production. In addition, a networked VAX software package has been deployed that controls and gathers data from the furnace controller via its SECS-II interface, making the oper... View full abstract»

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  • The challenge for American manufacturing

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (39 KB)

    Summary form only given. The status of various segments of the American manufacturing industry is discussed, comparing the prominence of these segments now versus a decade ago. Tools (concepts) in use today by prominent manufacturers and examples of success experienced by manufacturers utilizing these tools are presented. The examples are sufficiently specific to provide simulating questions to th... View full abstract»

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  • MOS device technology trend and future direction

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (54 KB)

    Summary form only given. It is pointed out that IC speed improvements slowed down after achieving 1- mu m geometry and will be very slight after 0.5 mu m. Scaling down the IC circuit in the depth direction is reaching the limit of existing technology. The real estate for isolation of CMOS SRAM structures occupies more than 80% of the total chip area and the possibility of any great improvement is ... View full abstract»

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  • Plasma-etching induced damage in thin oxide

    Publication Year: 1992, Page(s):79 - 83
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    It is pointed out that plasma Al etching and resist ashing processes cause Fowler-Nordheim current to flow through the oxide and that plasma-induced damage can be simulated and modeled as damage produced by constant current electrical stress. The current produced by the plasma process increases with the antenna size of the device structure. C-V measurement is a more sensitive tec... View full abstract»

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  • New ultra large field submicron i-line stepper for advanced mix-and-match applications

    Publication Year: 1992, Page(s):75 - 78
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    Lens and stage technologies that vastly reduce lithography processing costs, which have been incorporated into the Model 2244i ultra-large-field submicron i-line stepper, are described. It is shown how the technology reduces the overall cost of producing IC devices. The 2244i features a 22-mm×44-mm rectangular or 27-mm square field size. This field size, coupled with an extremely fast and ac... View full abstract»

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  • Optimized metalization processing for improved manufacturability

    Publication Year: 1992, Page(s):72 - 74
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    Improvements brought about in 1.0-μm and 1.5-μm production CMOS processes through modifications in the metalization process are discussed. The standard metalization process consists of dry via etching with a bottom Ti-W thickness of 2200 Å deposited in the same pump-down as the Al film (no air exposure of bottom Ti-W). In the modified process, via etching is wet/dry and the bottom Ti-W... View full abstract»

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  • Simultaneous in-situ measurement of film thickness and temperature by using multiple wavelength pyrometric interferometry (MWPI)

    Publication Year: 1992, Page(s):67 - 71
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (368 KB)

    An optical in situ method for simultaneous film thickness and temperature measurements is discussed. Multiple-wavelength pyrometric interferometry (MWPI) is capable of high resolution (0.5 nm for thickness and 0.05 K for temperature) and real-time data evaluation. It can be used for process control as well as in situ quality inspection without time delay or additional handling mechanisms and is su... View full abstract»

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  • A continuous operations workschedule implementation

    Publication Year: 1992, Page(s):165 - 170
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    IBM'S semiconductor facility near Burlington, Vermont, adopted continuous operation (ContOps) in 1990 by implementing a variation of the 12-h work schedule for their production employees. The author discusses that work schedule and how it was implemented. The foundation studies that proved the business need, the analysis of work schedule alternatives, the key business measurements, and the personn... View full abstract»

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  • A novel design for the construction and startup of an eight inch pilot line

    Publication Year: 1992, Page(s):60 - 65
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    An 8-in wafer line with 0.5-μm CMOS process technology for DRAM and SRAM pilot production is discussed. The pilot line is expected to achieve: (1) speedy construction and startup with overall duration of 16 months; (2) a class-0.1 clean environment at 0.3-μm particle testing level; (3) the flexibility to advance to 0.2-μm process technology when needed; (4) the flexibility to enlarge the ... View full abstract»

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  • True employee empowerment vs. one more job we have to do

    Publication Year: 1992, Page(s):171 - 173
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    The EFFORT (Employee Find and Fix Obvious Risk Teams) program in a semiconductor fabrication facility is discussed. The philosophy of the program is that employees, not managers, could see and find the problems causing a high risk of scrap. The employee teams would be expected to fix the problems they found, not assign them to another group. Results show that the increased output of improvements d... View full abstract»

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  • Process flow system for VLSI research and development

    Publication Year: 1992, Page(s):55 - 59
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (376 KB)

    A process flow system consisting of an intelligent process flow design system, a lot scheduling system and a lot tracking system is discussed. The system has been implemented in a VLSI research and development facility. It is shown that the system substantially increases the design efficiency of various complex process flows and the fabrication efficiency of a wide variety of VLSIs under those pro... View full abstract»

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  • Progress toward host tool integration of in situ particle monitors

    Publication Year: 1992, Page(s):16 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    The authors point out that in situ particle monitoring has gained substantial acceptance as a manufacturing process control technique, with the capability of providing automated 100% inspection during process. This is significant for several reasons, including faster detection of out of control events and higher baseline count rates as a consequence of the ability to monitor continuously, the dete... View full abstract»

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  • Why even successful teams sometimes fail-self-directed team catalysts

    Publication Year: 1992, Page(s):174 - 179
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (548 KB)

    The author points out that by systematically creating an environment in which team catalysts can flourish, organizations can move away from the task force approach toward self-directed teams. These teams can accurately predict future issues and work to resolve them before they adversely affect the business by reaching a crisis state. Focusing on long-term investment in such a catalytic environment... View full abstract»

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  • Key technologies for future IC manufacturing: a view from Europe

    Publication Year: 1992, Page(s):50 - 54
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    Current European development trends in IC processing technologies are reviewed. Most research projects are presently carried out in the EEC framework (IESSI-ESPRIT), which therefore acts as a trendsetter in the field of submicron processing. Major efforts are devoted to the improvement of process control at sub-0.5-μm dimensions. Examples can be found in lithography and in the fields of rapid t... View full abstract»

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  • Using a statistical experimental design to optimize a phosphorus deposition process in a high volume production facility

    Publication Year: 1992, Page(s):136 - 142
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (680 KB)

    In this study a statistically designed experiment was first used to improve the uniformity of an existing reactor. Three factors were examined in combination in an 8×8 resolution V experiment. Uniformity was noticeably improved on a batch size that was increased from 50 to the minimum goal of 75 wafers. The result of this first experiment did not achieve the process goal, since the uniformit... View full abstract»

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  • Energy contamination control in multiple charged ion implantations

    Publication Year: 1992, Page(s):96 - 99
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    A technique for measuring and monitoring charge exchange reactions prior to implantation of multiple charged ion beams on an E500 medium current implanter is discussed. There is a clear relationship between the energy contamination level measured in-situ before implantation and SIMS (secondary ion mass spectrometry) and thermawave measurements afterwards. This electrical technique establishes the ... View full abstract»

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  • The economic benefits of new stepper technology for manufacturing with 0.35 μm IC design rules

    Publication Year: 1992, Page(s):7 - 15
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    An analysis is made of the economic benefits of stepper technology for manufacturing ICs with 0.35-μm design rules. A table of design rules required for manufacturing 0.35-μm ICs is proposed. With reference to these design rules, three critical budgets, CD control, overlay, and particulate control, are analyzed with respect to cost per critical layer and impact on cumulative yield using the ... View full abstract»

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  • Rapid development, in a manufacturing environment, of a 1 μm triple-level metal CMOS process through the use of cross-functional teams

    Publication Year: 1992, Page(s):180 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The development, in a manufacturing environment, of a 1 μm triple-level-metal, 5 V CMOS process in under 25 weeks is discussed. The manufacturing process engineering group developed cross-functional process integration teams that synthesized device engineering from R&D, manufacturing process engineering, production, yield engineering, product engineering, and reliability engineering. By dev... View full abstract»

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  • Application of feed-forward and feedback control to a photolithography sequence

    Publication Year: 1992, Page(s):143 - 147
    Cited by:  Papers (2)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    Describe the implementation of supervisory control of three photolithography machines: a spincoat and bake track, a stepper and a developer. The objective of the experiment was to improve the reproducibility of critical dimensions of photoresist patterns. The results showed that the supervisory controller is capable of bringing the lithography process back to its previous specifications, even afte... View full abstract»

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