Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Sept. 30 1992-Oct. 1 1992

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  • Sequential screening in semiconductor manufacturing: exploiting lot-to-lot variability and spatial dependence

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (70 KB)

    Summary form only given. Screening at the wafer level to exploit lot-to-lot variability is considered. The yield is modeled using an empirical Bayes framework: the number of bad chips on each wafer in a given lot is a gamma random variable, and the scale parameter is unknown and varies from lot to lot according to another gamma distribution. The resulting problem is an optimal stopping problem emb... View full abstract»

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  • Technology outreach

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (97 KB)

    Summary form only given. Technology transfer available at universities and federal laboratories, how to assess that technology, and why it is of vital importance to American global competitiveness have been examined.<> View full abstract»

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  • Managing safety for results

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (104 KB)

    Summary form only given. The Du Pont Company's safety and occupational health program is described and the continuous improvement process employed throughout the corporation is outlined. A commitment to preventing all injuries and high priority attention by line management to the task of integrating safety into the total management function is described. A comprehensive reporting system and suppor... View full abstract»

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  • IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC '92 Proceedings (Cat. No.92CH3182-3)

    Publication Year: 1992
    Request permission for commercial reuse | |PDF file iconPDF (30 KB)
    Freely Available from IEEE
  • Yield and productivity management

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (71 KB)

    Summary form only given. The approaches, attitudes, and methodologies used by over 20 semiconductor manufacturers to manage yield and improve productivity have been examined. Selected topics in management systems and measurements, long- and short-loop analysis, data and information generation and handling, and manufacturing operational procedures have been considered.<> View full abstract»

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  • A market-driven methodology for improving servicability through an integrated customer/supplier partnership (CSP)

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (64 KB)

    Summary form only given. The customer/supply partnership (CSP), an innovative market-driven supply/commit process which integrates customer and supplier business operations, is discussed. CSP provides quick turn-around in a dynamic market, and produces accurate, detailed delivery projections which optimize customer production schedules and supplier servicability. CSP's all-encompassing approach to... View full abstract»

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  • An automated system for loading Atmoscan process tubes using intrabay material handling technologies

    Publication Year: 1992
    Cited by:  Papers (1)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (63 KB)

    Summary form only given. The authors point out that a tracked robot (intrabay) system that uses adaptive hardware to reliably load conventional shovel-type cantilevers as well as the Atmoscan-type has been implemented into production. In addition, a networked VAX software package has been deployed that controls and gathers data from the furnace controller via its SECS-II interface, making the oper... View full abstract»

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  • The challenge for American manufacturing

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (39 KB)

    Summary form only given. The status of various segments of the American manufacturing industry is discussed, comparing the prominence of these segments now versus a decade ago. Tools (concepts) in use today by prominent manufacturers and examples of success experienced by manufacturers utilizing these tools are presented. The examples are sufficiently specific to provide simulating questions to th... View full abstract»

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  • MOS device technology trend and future direction

    Publication Year: 1992
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (54 KB)

    Summary form only given. It is pointed out that IC speed improvements slowed down after achieving 1- mu m geometry and will be very slight after 0.5 mu m. Scaling down the IC circuit in the depth direction is reaching the limit of existing technology. The real estate for isolation of CMOS SRAM structures occupies more than 80% of the total chip area and the possibility of any great improvement is ... View full abstract»

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  • Productivity improvement in semiconductor fabrication environment using automode 2E+simulation software

    Publication Year: 1992, Page(s):84 - 89
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (480 KB)

    The development and validation of a wafer fabrication simulation model on Mac II Ci based Automode IIe and the use of this model to improve Fab-2 productivity is discussed. The productivity improvement is achieved by reducing cycle times and work-in-process inventory while increasing factory capacity by optimum utilization of available resources. This study is limited to a 4-in Fab-2 wafer fabrica... View full abstract»

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  • Characterization of the wafer dicing process using Taguchi methodology

    Publication Year: 1992, Page(s):200 - 205
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (416 KB)

    The use of Taguch's method of experimental design to characterize the wafer dicing process and improve the yield by reducing backside damage is described. It is shown how the orthogonal array was modified to accommodate mixed levels. Analysis of variance (ANOVA) was used to identify the significant factors. Using the optimum levels of the significant factors resulted in over 85% reduction in scrap... View full abstract»

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  • Plasma-etching induced damage in thin oxide

    Publication Year: 1992, Page(s):79 - 83
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (324 KB)

    It is pointed out that plasma Al etching and resist ashing processes cause Fowler-Nordheim current to flow through the oxide and that plasma-induced damage can be simulated and modeled as damage produced by constant current electrical stress. The current produced by the plasma process increases with the antenna size of the device structure. C-V measurement is a more sensitive tec... View full abstract»

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  • Energy contamination control in multiple charged ion implantations

    Publication Year: 1992, Page(s):96 - 99
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (292 KB)

    A technique for measuring and monitoring charge exchange reactions prior to implantation of multiple charged ion beams on an E500 medium current implanter is discussed. There is a clear relationship between the energy contamination level measured in-situ before implantation and SIMS (secondary ion mass spectrometry) and thermawave measurements afterwards. This electrical technique establishes the ... View full abstract»

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  • True employee empowerment vs. one more job we have to do

    Publication Year: 1992, Page(s):171 - 173
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (268 KB)

    The EFFORT (Employee Find and Fix Obvious Risk Teams) program in a semiconductor fabrication facility is discussed. The philosophy of the program is that employees, not managers, could see and find the problems causing a high risk of scrap. The employee teams would be expected to fix the problems they found, not assign them to another group. Results show that the increased output of improvements d... View full abstract»

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  • Rapid development, in a manufacturing environment, of a 1 μm triple-level metal CMOS process through the use of cross-functional teams

    Publication Year: 1992, Page(s):180 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (476 KB)

    The development, in a manufacturing environment, of a 1 μm triple-level-metal, 5 V CMOS process in under 25 weeks is discussed. The manufacturing process engineering group developed cross-functional process integration teams that synthesized device engineering from R&D, manufacturing process engineering, production, yield engineering, product engineering, and reliability engineering. By dev... View full abstract»

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  • Chemical-mechanical planarization

    Publication Year: 1992, Page(s):206 - 210
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (324 KB)

    The chemical-mechanical planarization (CMP) techniques applied to insulating layers in multilayered integrated circuits are discussed. Advantages and concerns of CMP are considered. Process developments are described View full abstract»

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  • Key issues for the unplanned transfer of VLSI technology

    Publication Year: 1992, Page(s):189 - 193
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (336 KB)

    The authors point out that in unplanned transfers i.e. capacity overload of technology license, etc., many manufacturing issues must be resolved on an aggressive schedule and at the lowest possible cost. The key issues which exist under various conditions are covered. The balance between technology requirements and minimized impact is discussed in terms of processing tools and recipes. Critical is... View full abstract»

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  • New ultra large field submicron i-line stepper for advanced mix-and-match applications

    Publication Year: 1992, Page(s):75 - 78
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (396 KB)

    Lens and stage technologies that vastly reduce lithography processing costs, which have been incorporated into the Model 2244i ultra-large-field submicron i-line stepper, are described. It is shown how the technology reduces the overall cost of producing IC devices. The 2244i features a 22-mm×44-mm rectangular or 27-mm square field size. This field size, coupled with an extremely fast and ac... View full abstract»

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  • A novel design for the construction and startup of an eight inch pilot line

    Publication Year: 1992, Page(s):60 - 65
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (412 KB)

    An 8-in wafer line with 0.5-μm CMOS process technology for DRAM and SRAM pilot production is discussed. The pilot line is expected to achieve: (1) speedy construction and startup with overall duration of 16 months; (2) a class-0.1 clean environment at 0.3-μm particle testing level; (3) the flexibility to advance to 0.2-μm process technology when needed; (4) the flexibility to enlarge the ... View full abstract»

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  • Optimization of LPCVD silicon nitride process in a vertical thermal reactor: use of design of experiments

    Publication Year: 1992, Page(s):216 - 219
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (296 KB)

    Process and equipment characterization of a low pressure chemical vapor deposition (LPCVD) nitride vertical thermal reactor is discussed. Film thickness uniformity for the LPCVD silicon nitride film was improved from 6.7% to 4.5%. This was achieved by implementing a systematic methodology involving as the use of gauge capability study, passive data collection and design of experiments. In addition... View full abstract»

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  • Profile control in isotropic plasma etching

    Publication Year: 1992, Page(s):116 - 119
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (320 KB)

    The possibility of controlling the lateral-to-vertical etch ratio of undoped dielectric material is tested. The Lam Research Rainbow 4500i, configured with a downstream isotropic plasma etch chamber, was used for the study. The tetra-ethyl-ortho-silicate (TEOS) isotropic etch profile was examined as a function of process parameters in order to establish trends of isotropic etch profile. A fraction... View full abstract»

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  • The economic benefits of new stepper technology for manufacturing with 0.35 μm IC design rules

    Publication Year: 1992, Page(s):7 - 15
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (576 KB)

    An analysis is made of the economic benefits of stepper technology for manufacturing ICs with 0.35-μm design rules. A table of design rules required for manufacturing 0.35-μm ICs is proposed. With reference to these design rules, three critical budgets, CD control, overlay, and particulate control, are analyzed with respect to cost per critical layer and impact on cumulative yield using the ... View full abstract»

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  • Product defect reduction through the use of business process management

    Publication Year: 1992, Page(s):43 - 48
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (300 KB)

    Points out that understanding the entire manufacturing process, across organizational boundaries, is a key element in improving shipped product quality level (SPQL). Employee participation in the understanding and improving of IBM's business processes improves product quality, business efficiency and employee morale. The impact of the business process teams on employee morale has been positive and... View full abstract»

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  • In-line automated inspection for semiconductor assembly

    Publication Year: 1992, Page(s):127 - 134
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (668 KB)

    Several in-line automated inspection techniques for semiconductor assembly are discussed. First, the characteristics of in-line automated inspection are described. Then, a machine vision system that is being developed for TAB tape inspection is presented. Machine vision techniques for two-dimensional and three-dimensional flaw inspection are proposed. A laser/infrared technique, scanning laser aco... View full abstract»

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  • Application of real-time expert systems in semiconductor manufacturing

    Publication Year: 1992, Page(s):90 - 95
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (508 KB)

    Some requirements of a real-time expert system and applications in process control, statistical process control, and scheduling are presented. Combining the expert system capability with object oriented modeling, one can build powerful applications in a relatively short time span, thus cutting down the time taken to implement a process control system. Also, when implemented, an expert-system-based... View full abstract»

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