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Semiconductor Manufacturing Science Symposium, 1992. ISMSS 1992., IEEE/SEMI International

Date 15-16 June 1992

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Displaying Results 1 - 25 of 29
  • IEEE/SEMI International Semiconductor Manufacturing Science Symposium (Cat. No.92CH3161-7)

    Publication Year: 1992
    Request permission for commercial reuse | PDF file iconPDF (345 KB)
    Freely Available from IEEE
  • Monitoring supplier quality at p.p.m. levels

    Publication Year: 1992, Page(s):24 - 30
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (652 KB)

    Lot accept rate had lost its value as a metric for monitoring supplier quality at Motorola, and a new metric was needed. Line p.p.m. was chosen as the new metric for supplier quality. Implementation of a line p.p.m. report was seen to be a major undertaking from the outset of the project. Eventually the reporting system would involve five to seven Motorola manufacturing sites, numerous piece part ... View full abstract»

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  • Estimating semiconductor yield from equipment particle measurements

    Publication Year: 1992, Page(s):18 - 23
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    The authors describe the application of yield models to define the relative contribution of equipment to particle limited yield and outline methods for developing a detailed yield model which includes process characteristics, equipment particle measurements, and product design characteristics. Collecting equipment particle per wafer pass (PWP) measurements using particle measurement systems and va... View full abstract»

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  • Bibliography of books and articles related to manufacturing: 1992

    Publication Year: 1992, Page(s):137 - 140
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    The bibliography presented, comprising over 150 references, has been compiled for the convenience and use of people attending the 1992 International Semiconductor Manufacturing Science Symposium (ISMSS), the Advanced Semiconductor Manufacturing Conference and Workshop (ASMC), and others in the field of manufacturing. The bibliography is broken down into five major areas: just-in-time methodologies... View full abstract»

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  • IC performance prediction from electrical test measurements

    Publication Year: 1992, Page(s):13 - 17
    Cited by:  Papers (6)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (344 KB)

    A model for integrated circuit (IC) binning has been built using measurements collected on a high-volume manufacturing line. This model uses electrical measurements collected before packaging in order to predict the high-speed performance of manufactured parts before final test. A small set of measurable parameters responsible for the variation in fabricated parts was identified. The statistically... View full abstract»

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  • Object-oriented SECS programming system

    Publication Year: 1992, Page(s):130 - 136
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (540 KB)

    An object-oriented programming (OOP) environment for developing SEMI Equipment Communication Standard (SECS) applications with the C++ and C programming languages in a Unix workstation environment is described. The system (referred to as OOSECS) defines a set of programming objects corresponding to the standard SECS-II item types, messages, and headers as well as a number of support classes and op... View full abstract»

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  • From spreadsheets to simulations: a comparison of analysis methods for IC manufacturing performance

    Publication Year: 1992, Page(s):94 - 99
    Cited by:  Papers (7)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    Illustrates the differences between spreadsheet and simulation models through the examples of diffusion cell staffing, material flows through a process segment, and the operations of a full fab. The results show that engineering judgment applied to spreadsheet outputs is not the most prudent solution when more realistic tools are available, and, that by overstating capacity, spreadsheet logic can ... View full abstract»

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  • Optimizing the die probe process using Taguchi techniques

    Publication Year: 1992, Page(s):7 - 12
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    Standard Taguchi methods such as orthogonal experimental design, loss function, and response graphs are used to examine a typical CMOS IG die probe test setup. Particular emphasis was placed on probe needles and contact resistance. Parameters investigated include the probe needle type, test current levels, probe map, probe tip force (or overtravel), and final wafer surface processing. The experime... View full abstract»

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  • Vendor/customer alliance for furnace upgrade

    Publication Year: 1992, Page(s):110 - 113
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    Describes a cooperative, joint development effort between Advanced Micro Devices Inc. and Direction Inc. to improve the technology of horizontal diffusion furnaces. Direction Inc. provided a prototype capsule system and gas injector. Advanced Micro Devices made available a production furnace and measuring equipment. The cross functional team representing disciplines of marketing, development, proc... View full abstract»

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  • A comparison of statistically-based and neural network models of plasma etch behavior

    Publication Year: 1992, Page(s):124 - 129
    Cited by:  Papers (10)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (504 KB)

    A neural network modeling methodology is applied to the removal of polysilicon films by plasma etching. For a polysilicon etch in a CCl4/He/O4 plasma, the etch rate, uniformity, and selectivity to both silicon dioxide and photoresist were modeled as a function of RF power, pressure, electrode spacing, and the three gas flows. Neural process models were subsequently compared t... View full abstract»

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  • Semiconductor manufacturing at a crossroads: the partnership imperative

    Publication Year: 1992, Page(s):1 - 2
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (116 KB)

    The author points out that a recognition of the power of the integrated circuit, combined with the transferability and portability of the technology itself, means the global market for semiconductors is dramatically changing, and so is the business of manufacturing them. He indicates that we have entered a new risk environment-a period when the risks will be nearly as great as the opportunities. H... View full abstract»

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  • Paperless manufacturing for IC assembly

    Publication Year: 1992, Page(s):90 - 93
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (360 KB)

    The ongoing paperless manufacturing programs in application-specific integrated circuit (ASIC) assembly operations are described. Drawbacks of paperwork and approaches to paperwork elimination are discussed. Two projects related to paperless manufacturing in ASIC assembly are presented: an automated marking system project, which minimized operator input during product marking operation, and an ele... View full abstract»

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  • Manufacturing ownership of work-in-process control

    Publication Year: 1992, Page(s):69 - 72
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (336 KB)

    IBM's semiconductor manufacturing facility in Essex Junction, Vermont has made the transition from business-as-usual to continuous flow manufacturing. As a result, traditional tools used to control the production line have become ineffective, with new and more creative ways of managing work in process (WIP) required. This facility manufactures high-volume logic chips with multiple part numbers. Be... View full abstract»

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  • SEMATECH and the factory of the future

    Publication Year: 1992, Page(s):31 - 32
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (112 KB)

    It is noted that from now through the year 2000, US semiconductor manufacturing lines will undergo remarkable changes. SEMATECH's role in helping shape those changes as it works with the industry to develop manufacturing techniques that will withstand ever-greater pressures for cost-containment, precision processing, and submicron geometries is discussed. SEMATECH is driving efforts to improve man... View full abstract»

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  • Cooperative research and technology transfer

    Publication Year: 1992, Page(s):100 - 105
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    The Semiconductor Research Corporation (SRC) is a cooperative effort of US and Canadian companies organized to strengthen and maintain the vitality and competitive ability of the semiconductor industry. A not-for-profit organization, the SRC plans and implements an integrated program of basic research conducted by faculty and graduate students at leading US universities. in order to better underst... View full abstract»

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  • Bulletproofing new product fab implementation

    Publication Year: 1992, Page(s):114 - 116
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    A detailed procedural flow and checklist used in bringing new products into the United Technologies Microelectronics Center (UTMC) foundry fab are presented. Rigorous adherence to this standardized flow has been found critical to achieving first-pass success on new products not designed to fit within the existing manufacturing technology. The UTMC foundry frequently must run new products not origi... View full abstract»

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  • From trendcharts to control charts: setup tests for making the leap

    Publication Year: 1992, Page(s):3 - 7
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    The early stages of industrial SPC (statistical process control) programs are typically characterized by trendcharts at critical process steps. As processes are brought under control, these trendcharts are replaced by control charts. But premature replacement of trendcharts by control charts, before processes are under control, may undermine the credibility of nascent SPC programs, causing a barra... View full abstract»

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  • Run-by-run process control: performance benchmarks

    Publication Year: 1992, Page(s):73 - 78
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    The run-by-run (RbR) controller provides a framework for controlling the manufacturing process which is subject to disturbances such as shifts and drifts as a normal part of its operation. The RbR controller combines the advantages of statistical process control and feedback control to provide accuracy and flexibility of control that cannot be obtained by using either method alone. The RbR control... View full abstract»

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  • Evolution of an integrated manufacturing organization

    Publication Year: 1992, Page(s):33 - 37
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (404 KB)

    The evolution of an integrated manufacturing organization in the logic wafer fabricator at IBM's semiconductor facility in Essex Junction, Vermont is discussed. In 1987, the manufacturing organization had sole responsibility for production operations and was dependent on support groups for solutions to technical and planning problems. Since then, equipment maintenance and process control engineeri... View full abstract»

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  • Long-term partnering for success: a teamwork approach for positive results

    Publication Year: 1992, Page(s):106 - 109
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    Texas Instruments LMOS and Electroglas have joined forces to develop a method for improving quality and reliability for some older-vintage equipment. The two companies, working together, have achieved a 500% improvement in equipment reliability. A system was developed which provided a multipurpose database that could be used by both companies to establish a quantitative starting point for their pr... View full abstract»

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  • A virtual factory-based environment for semiconductor device development

    Publication Year: 1992, Page(s):117 - 123
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (764 KB)

    The Simulation Experiment Workbench (SEWB), an integrated design environment for rapid prototyping of semiconductor devices, supports device design within a single user environment by offering a device structure editor, an automatic mesh generator, a collection of statistical experimental design packages, a device simulator, and a task dispatcher/monitor. It maintains a library mechanism to organi... View full abstract»

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  • Application of feed-forward control to a lithography stepper

    Publication Year: 1992, Page(s):79 - 84
    Cited by:  Papers (9)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    Presents a novel feedforward control algorithm that seeks to improve the reproducibility of pattern transfer in modern photolithography process sequences. Coupled with a feedback controller and accurate empirical equipment models, the feedforward controller significantly improves the process capability index (Cpk) of the lithographic sequence by centering its response around the specifications and... View full abstract»

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  • The evolution of employee empowerment

    Publication Year: 1992, Page(s):38 - 47
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1180 KB)

    The authors present the evolution of employee involvement programs into empowered self-directed work teams (SDWTs) to drive continuous improvement methodologies. With the primary goal of increased manufacturing performance and customer satisfaction, SDWTs are responsible for the day-to-day operations and directions of existing wafer fabs at Harris Semiconductor in Palm Bay, Florida. The authors sp... View full abstract»

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  • Competitive manufacturing through total productive maintenance

    Publication Year: 1992, Page(s):85 - 89
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (404 KB)

    The implementation of total productive maintenance (TPM) in component manufacturing at Intel Corporation is described. TPM originates from the fact that productivity, cost, inventory, production output, safety, and quality all depend on equipment performance. The goal of TPM is to eliminate equipment breakdowns and defects caused by the production process. TPM is aimed at increasing the overall ef... View full abstract»

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  • Manufacturing integration through EBI

    Publication Year: 1992, Page(s):49 - 52
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    Manufacturing ownership of mature products and processes remains a priority at IBM's semiconductor fabrication facility in Essex Junction, Vermont. The objective of ownership is to make the manufacturing organization as self-sufficient as possible. The program established to achieve this objective is known as engineering build-in (EBI). Through EBI, process control responsibilities are integrated ... View full abstract»

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