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[1992 Proceedings] IEEE/SEMI International Semiconductor Manufacturing Science Symposium

15-16 June 1992

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  • IEEE/SEMI International Semiconductor Manufacturing Science Symposium (Cat. No.92CH3161-7)

    Publication Year: 1992
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    Freely Available from IEEE
  • Productivity enhancement

    Publication Year: 1992
    Cited by:  Patents (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (79 KB)

    Summary form only given. The semiconductor industry is quickly approaching an era where productivity enhancements must be larger and be developed faster than at the historical pace. Historical trends that have allowed the industry to meet productivity improvement in capital assets are discussed. It is noted that the capital expenditure necessary to build a wafer fabrication facility for a given am... View full abstract»

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  • Estimating semiconductor yield from equipment particle measurements

    Publication Year: 1992, Page(s):18 - 23
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    The authors describe the application of yield models to define the relative contribution of equipment to particle limited yield and outline methods for developing a detailed yield model which includes process characteristics, equipment particle measurements, and product design characteristics. Collecting equipment particle per wafer pass (PWP) measurements using particle measurement systems and va... View full abstract»

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  • IC performance prediction from electrical test measurements

    Publication Year: 1992, Page(s):13 - 17
    Cited by:  Papers (6)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (344 KB)

    A model for integrated circuit (IC) binning has been built using measurements collected on a high-volume manufacturing line. This model uses electrical measurements collected before packaging in order to predict the high-speed performance of manufactured parts before final test. A small set of measurable parameters responsible for the variation in fabricated parts was identified. The statistically... View full abstract»

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  • Manufacturing ownership of work-in-process control

    Publication Year: 1992, Page(s):69 - 72
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (336 KB)

    IBM's semiconductor manufacturing facility in Essex Junction, Vermont has made the transition from business-as-usual to continuous flow manufacturing. As a result, traditional tools used to control the production line have become ineffective, with new and more creative ways of managing work in process (WIP) required. This facility manufactures high-volume logic chips with multiple part numbers. Be... View full abstract»

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  • Bulletproofing new product fab implementation

    Publication Year: 1992, Page(s):114 - 116
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    A detailed procedural flow and checklist used in bringing new products into the United Technologies Microelectronics Center (UTMC) foundry fab are presented. Rigorous adherence to this standardized flow has been found critical to achieving first-pass success on new products not designed to fit within the existing manufacturing technology. The UTMC foundry frequently must run new products not origi... View full abstract»

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  • Establishing teams in a 24-hour seven-day work week environment

    Publication Year: 1992, Page(s):61 - 62
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (152 KB)

    Continuous improvement and customer satisfaction is leading NCR-Microelectronics Manufacturing organization to form teams and emphasize teamwork in the wafer fabrication area. The team formation is to improve quality in manufacturing and employee worklife, and to make the organization more competitive. The team approach is being utilized to bring the operators to the focal point of continuous impr... View full abstract»

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  • Bibliography of books and articles related to manufacturing: 1992

    Publication Year: 1992, Page(s):137 - 140
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    The bibliography presented, comprising over 150 references, has been compiled for the convenience and use of people attending the 1992 International Semiconductor Manufacturing Science Symposium (ISMSS), the Advanced Semiconductor Manufacturing Conference and Workshop (ASMC), and others in the field of manufacturing. The bibliography is broken down into five major areas: just-in-time methodologies... View full abstract»

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  • Optimizing the die probe process using Taguchi techniques

    Publication Year: 1992, Page(s):7 - 12
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    Standard Taguchi methods such as orthogonal experimental design, loss function, and response graphs are used to examine a typical CMOS IG die probe test setup. Particular emphasis was placed on probe needles and contact resistance. Parameters investigated include the probe needle type, test current levels, probe map, probe tip force (or overtravel), and final wafer surface processing. The experime... View full abstract»

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  • Cooperative research and technology transfer

    Publication Year: 1992, Page(s):100 - 105
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    The Semiconductor Research Corporation (SRC) is a cooperative effort of US and Canadian companies organized to strengthen and maintain the vitality and competitive ability of the semiconductor industry. A not-for-profit organization, the SRC plans and implements an integrated program of basic research conducted by faculty and graduate students at leading US universities. in order to better underst... View full abstract»

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  • SEMATECH and the factory of the future

    Publication Year: 1992, Page(s):31 - 32
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (112 KB)

    It is noted that from now through the year 2000, US semiconductor manufacturing lines will undergo remarkable changes. SEMATECH's role in helping shape those changes as it works with the industry to develop manufacturing techniques that will withstand ever-greater pressures for cost-containment, precision processing, and submicron geometries is discussed. SEMATECH is driving efforts to improve man... View full abstract»

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  • Vendor/customer alliance for furnace upgrade

    Publication Year: 1992, Page(s):110 - 113
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    Describes a cooperative, joint development effort between Advanced Micro Devices Inc. and Direction Inc. to improve the technology of horizontal diffusion furnaces. Direction Inc. provided a prototype capsule system and gas injector. Advanced Micro Devices made available a production furnace and measuring equipment. The cross functional team representing disciplines of marketing, development, proc... View full abstract»

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  • The evolution of employee empowerment

    Publication Year: 1992, Page(s):38 - 47
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1180 KB)

    The authors present the evolution of employee involvement programs into empowered self-directed work teams (SDWTs) to drive continuous improvement methodologies. With the primary goal of increased manufacturing performance and customer satisfaction, SDWTs are responsible for the day-to-day operations and directions of existing wafer fabs at Harris Semiconductor in Palm Bay, Florida. The authors sp... View full abstract»

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  • The formula: world class manufacturing for hybrid thin-film component production

    Publication Year: 1992, Page(s):53 - 60
    Cited by:  Papers (2)  |  Patents (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB)

    In less than one year, the hybrid thin-film component (HTFC) production operation at Avantek transformed itself into a showcase for successful world-class manufacturing (WCM). Production cycle time was reduced by 60%, work-in-progress inventory was reduced by 92%, and overall process yields were improved by over 15%. WCM for this HTFC operation included the application of a number of productivity ... View full abstract»

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  • Object-oriented SECS programming system

    Publication Year: 1992, Page(s):130 - 136
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (540 KB)

    An object-oriented programming (OOP) environment for developing SEMI Equipment Communication Standard (SECS) applications with the C++ and C programming languages in a Unix workstation environment is described. The system (referred to as OOSECS) defines a set of programming objects corresponding to the standard SECS-II item types, messages, and headers as well as a number of support classes and op... View full abstract»

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  • From trendcharts to control charts: setup tests for making the leap

    Publication Year: 1992, Page(s):3 - 7
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    The early stages of industrial SPC (statistical process control) programs are typically characterized by trendcharts at critical process steps. As processes are brought under control, these trendcharts are replaced by control charts. But premature replacement of trendcharts by control charts, before processes are under control, may undermine the credibility of nascent SPC programs, causing a barra... View full abstract»

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  • From spreadsheets to simulations: a comparison of analysis methods for IC manufacturing performance

    Publication Year: 1992, Page(s):94 - 99
    Cited by:  Papers (7)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    Illustrates the differences between spreadsheet and simulation models through the examples of diffusion cell staffing, material flows through a process segment, and the operations of a full fab. The results show that engineering judgment applied to spreadsheet outputs is not the most prudent solution when more realistic tools are available, and, that by overstating capacity, spreadsheet logic can ... View full abstract»

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  • Monitoring supplier quality at p.p.m. levels

    Publication Year: 1992, Page(s):24 - 30
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (652 KB)

    Lot accept rate had lost its value as a metric for monitoring supplier quality at Motorola, and a new metric was needed. Line p.p.m. was chosen as the new metric for supplier quality. Implementation of a line p.p.m. report was seen to be a major undertaking from the outset of the project. Eventually the reporting system would involve five to seven Motorola manufacturing sites, numerous piece part ... View full abstract»

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  • Run-by-run process control: performance benchmarks

    Publication Year: 1992, Page(s):73 - 78
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    The run-by-run (RbR) controller provides a framework for controlling the manufacturing process which is subject to disturbances such as shifts and drifts as a normal part of its operation. The RbR controller combines the advantages of statistical process control and feedback control to provide accuracy and flexibility of control that cannot be obtained by using either method alone. The RbR control... View full abstract»

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  • A virtual factory-based environment for semiconductor device development

    Publication Year: 1992, Page(s):117 - 123
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (764 KB)

    The Simulation Experiment Workbench (SEWB), an integrated design environment for rapid prototyping of semiconductor devices, supports device design within a single user environment by offering a device structure editor, an automatic mesh generator, a collection of statistical experimental design packages, a device simulator, and a task dispatcher/monitor. It maintains a library mechanism to organi... View full abstract»

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  • The implementation of total quality management in a semiconductor manufacturing operation

    Publication Year: 1992, Page(s):63 - 67
    Cited by:  Papers (2)  |  Patents (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (532 KB)

    The author reviews five years of experience in the implementation of total quality management (TQM) in the operation of the silicon wafer fabrication (fab) facility in the Xerox Microelectronics Center (MEC). The basic concepts of TQM and its operational implications are summarized. This is followed by a detailed description of the TQM implementation process in the wafer fab. The implementation pr... View full abstract»

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  • Long-term partnering for success: a teamwork approach for positive results

    Publication Year: 1992, Page(s):106 - 109
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    Texas Instruments LMOS and Electroglas have joined forces to develop a method for improving quality and reliability for some older-vintage equipment. The two companies, working together, have achieved a 500% improvement in equipment reliability. A system was developed which provided a multipurpose database that could be used by both companies to establish a quantitative starting point for their pr... View full abstract»

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  • Evolution of an integrated manufacturing organization

    Publication Year: 1992, Page(s):33 - 37
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    The evolution of an integrated manufacturing organization in the logic wafer fabricator at IBM's semiconductor facility in Essex Junction, Vermont is discussed. In 1987, the manufacturing organization had sole responsibility for production operations and was dependent on support groups for solutions to technical and planning problems. Since then, equipment maintenance and process control engineeri... View full abstract»

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  • Manufacturing integration through EBI

    Publication Year: 1992, Page(s):49 - 52
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    Manufacturing ownership of mature products and processes remains a priority at IBM's semiconductor fabrication facility in Essex Junction, Vermont. The objective of ownership is to make the manufacturing organization as self-sufficient as possible. The program established to achieve this objective is known as engineering build-in (EBI). Through EBI, process control responsibilities are integrated ... View full abstract»

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  • Application of feed-forward control to a lithography stepper

    Publication Year: 1992, Page(s):79 - 84
    Cited by:  Papers (9)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    Presents a novel feedforward control algorithm that seeks to improve the reproducibility of pattern transfer in modern photolithography process sequences. Coupled with a feedback controller and accurate empirical equipment models, the feedforward controller significantly improves the process capability index (Cpk) of the lithographic sequence by centering its response around the specifications and... View full abstract»

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