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Statistical Metrology, 1999. IWSM. 1999 4th International Workshop on

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Statistical Metrology, 1999. IWSM. 1999 4th International Workshop on

Date 12-12 June 1999

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Title History

1999 4th International Workshop on Statistical Metrology (Cat. No.99TH8391)

Clock skew determination from parameter variations at chip and wafer level

Fault diagnosis of analog integrated circuits using response surface methods

A method of quantitative defect analysis and yield forecast by an advanced kill rate from line monitoring data

A systematic and physical application of multivariate statistics to MOSFET I-V models

A study of within-wafer non-uniformity metrics

Implementation of a TCAD based system to aid process transfer

A new filtering method to extract repeated defects (FIMER) [lithography]

Circuit performance variability decomposition

Application of covariance based models to fit response surfaces to experimental data

Impact of RSF with variable coefficients for CD variation analysis including OPC

High signal-to-noise ratio inspection of sub-quarter micrometer oxide CMP defects by using laser scattering inspection tool

Analysis of the impact of intra-die variance on clock skew

IC technology R&D for the next century

TCAD-prototyping with new accurate worst-case definition for a 0.2 micron CMOS-ASIC process

A new method for calculating one-dimensional process margin in consideration of process variations

Calibration of a 2D numerical model for the optimization of LOCOS type isolations by response surface methodology

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