Date 8-12 May 2011
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Displaying Results 1 - 25 of 110
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2011 IITC Organizing committee
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PDF (84 KB)
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Past general co-chairs
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PDF (92 KB)
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2011 IITC program committee
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PDF (84 KB)
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Sponsors
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PDF (53 KB)
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Table of contents
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PDF (176 KB)
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Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
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PDF (386 KB)
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Interconnect technologies for SmartPower integrated circuits in the area of automotive power applications
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PDF (285 KB)
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Interconnect performance and energy-per-bit for post-CMOS logic circuits: Modeling, analysis, and comparison with CMOS logic
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PDF (1582 KB)
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Mechanism of resistivity decrease in networked-nanographite wires for multi-layer graphene interconnects
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PDF (203 KB)
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Integration of dense CNTs in vias on 200mm diameter wafers: Study of post CNT growth processes
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PDF (499 KB)
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Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact
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PDF (764 KB)
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Evaluation of aluminum film properties and microstructure for replacement metal gate application at 28nm technology node
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PDF (365 KB)
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Post Porosity Plasma Protection a new approach to integrate k ≤ 2.2 porous ULK materials
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PDF (921 KB)
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Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner
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PDF (1541 KB)
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ZrBO dielectrics for TSV production process
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PDF (783 KB)
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Strain measurement for the semiconductor industry with nm-scale resolution by dark field electron holography and nanobeam electron diffraction
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PDF (5640 KB)
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Stress-induced voids in Ni-Pt silicide: Disconnection of narrow (Ni-Pt)Si between gate canyons on wide active area
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PDF (363 KB)


