Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Date 18-20 May 1992
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Displaying Results 1 - 25 of 167
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1992 Proceedings. 42nd Electronic Components and Technology Conference (Cat. No.92CH3056-9)
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PDF (24 KB)
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Multichip module technologies, a win-win strategy based on technology leverage and convergence for IC supplies and workstation customers
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PDF (140 KB)
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A readily pretestable, reworkable MCM
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PDF (608 KB)
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High-density packaging: future outlook
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PDF (344 KB)
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High-density interconnect substrate with low thermal resistance for GaAs LSI multichip modules
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PDF (392 KB)
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Correlation of uniaxial tension-tension, torsion, and multiaxial tension-torsion fatigue failure in a 63Sn-37Pb solder alloy
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PDF (600 KB)
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Design manufacture and performance of receptacle (connectorised) laser diode packages for 1.3 μm and 1.5 μm fibre systems
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PDF (456 KB)
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New analytical study for popcorn phenomenon
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PDF (424 KB)
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A computer-aided, spatially-selective protection technique for multichip module and chip-on-board devices
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PDF (468 KB)
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Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn system
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PDF (836 KB)
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Characterization and reliability of electrolytic capacitors exposed to halogenated solvents
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PDF (420 KB)
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Polymeric resin-filled optical couplers with mode mixing and polarization scrambling microparticles
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PDF (580 KB)
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