[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium

16-18 Sept. 1991

Filter Results

Displaying Results 1 - 25 of 102
  • Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)

    Publication Year: 1991
    Request permission for commercial reuse | PDF file iconPDF (20 KB)
    Freely Available from IEEE
  • Optimization of the gull wing lead

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (24 KB)

    Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two diff... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Leverages and bottlenecks of MCMs

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (70 KB)

    Summary form only given. The authors discuss the fundamental issues confronting designers and manufacturers of the multichip modules (MCMs). All of them ultimately determine the product cost, be it the in-process and final test yields, the engineering effort in design and manufacturing support, or the MCM quality and reliability. Challenges are compounded in a situation where MCMs are assembled wi... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (67 KB)

    Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat tr... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Partnering for total quality: an industry's blueprint to regain and retain competitiveness

    Publication Year: 1991, Page(s):48 - 54
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    The author describes a step-by-step process of implementing total quality as a way of life within the semiconductor industry supply-chain. While this process utilizes the Malcolm Baldridge National Quality Award criteria as a foundation, the application of these criteria has been tailored to this industry. In doing so it adds additional dimensions to these criteria by bringing them to the level of... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Concurrent engineering for consumer, industrial products, and government systems

    Publication Year: 1991, Page(s):44 - 47
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    Recent Institute for Defense Analysis reports, National Science Foundation workshop results, and other current efforts and publications addressing concurrent engineering (CE) are discussed. It is noted that CE has yielded benefits involving reduction in change orders, development time, development costs, inventories, scrap, rework, defects, and production costs View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Bridge-gap buried digit-line for high density stacked DRAMs

    Publication Year: 1991, Page(s):310 - 314
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB)

    Explores the interaction of design and process to achieve a manufacturable low digit-line resistance-a key element to DRAM (dynamic random access memory) speed and to minimizing overall process complexity. They propose an interaction between stacked DRAM design and process called the bridge-gap process for achieving low digit-line resistance while minimizing overall process complexity. A study of ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Employee empowered quality improvement

    Publication Year: 1991, Page(s):39 - 43
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (452 KB)

    Continuous improvement in quality has been made possible by the use of a complete quality program which fully utilizes the knowledge and capabilities of an entire workforce. The program includes formal quality policy deployment, training, a seven-step quality improvement process, and the use of poka-yoke or mistake-proofing devices. It is concluded that employees empowered to create continuous qua... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Closing the engineering to manufacturing information loop

    Publication Year: 1991, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (272 KB)

    It is pointed out that, as printed circuit boards (PCBs) grow more complex and development time shrinks, the need for accurate and timely transfer of information from engineering to manufacturing has increased. This increased need has forced manufacturing to define information requirements, standardize data, improve data transfer capabilities, and verify engineering information. NCR E&M Columb... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Statistically designed polyimide coating process for TAB bumping

    Publication Year: 1991, Page(s):15 - 20
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (344 KB)

    Design of experiments and statistical data analysis were used to develop a wafer coating process for straight wall bumping of 6" wafers for TAB (tape automated bonding). The effect of important parameters and their interactions on polyimide coat thickness, uniformity, and quality were identified, and models were developed. Using the results of the experiments, a dynamic coating process was develop... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • World class development: a key enabler for world class manufacturing

    Publication Year: 1991, Page(s):36 - 38
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB)

    It is pointed out that achievement and maintenance of status as a world class manufacturing organization is dependent on numerous factors. Analysis of those factors in the manufacturing environment often ignores the role of product development and its input to the manufacturing process. This is because the creative development process is not typically considered amenable to measurement. The author... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • An AI-based manufacturing design rule checker and path optimizer for PCB production preparation and manufacturing

    Publication Year: 1991, Page(s):244 - 249
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    The authors discuss printed circuit board (PCB) manufacturing design rule checking (MDRC) in combination with the path optimizing of the assembly process in a heterogeneous, distributed, and networked information system environment linked with databases in a defined factory infrastructure. An increase in the degree of automation requires greater continuity of information flow starting with the cus... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Development of fine pitch and high lead count ceramic QFP

    Publication Year: 1991, Page(s):175 - 180
    Cited by:  Papers (1)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    A compact ceramic quad flat package (C-QFP) for use in logic LSI devices with fine pitch and high lead counts has been developed. The ceramic base outer size of the new C-QFP with 356 inner leads and 288 outer leads is 27 mm by 30 mm. The pitch of the inner and outer lead is 0.15 and 0.38 mm, respectively. The new C-QFP is composed of a fine pitch thin film wiring layer on a ceramic base interconn... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The ES/9000 glass ceramic thermal conduction module, design for manufacturability

    Publication Year: 1991, Page(s):351 - 355
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB)

    The highest performing models of IBM's recently announced ES/9000 family of mainframe computers utilize a new high-performance thermal conduction module (TCM). To achieve improved system performance, a newly developed corderite glass ceramic material with an internal copper metallurgy and top surface thin film wiring was used. The new glass ceramic material provides a superior dielectric constant ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Practical scheduling and line optimization technology for ASIC manufacturing lines

    Publication Year: 1991, Page(s):147 - 150
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB)

    For application-specific integrated circuit (ASIC) manufacturing lines, quick product turnaround time as well as high throughput is critical. To achieve both, efficient lot management and line operation are required. An automatic scheduler and its application methods have been developed for this purpose. With this technology, highly effective operation of an ASIC manufacturing line has been accomp... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Guidelines for design of machining processes to eliminate solvent cleaning

    Publication Year: 1991, Page(s):300 - 306
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (676 KB)

    The author presents rules for the design of the machining/assembly process, particularly for vended parts, to eliminate the need for subsequent solvent-cleaning. These include the replacement of oil-base lubricants, coolants, and lapping vehicles with water-soluble counterparts; implementation of soldering processes that involve water-soluble fluxes, or are flux-free; keeping the parts wet so that... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design for in-circuit testability

    Publication Year: 1991, Page(s):325 - 328
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    The author discusses all of the test requirements and design parameters which must be identified in order to ensure that the proper physical characteristics of a printed circuit board (PCB) design allow for complete test coverage at the in-circuit test level. Several strategies for providing the proper physical layout are presented. Additional strategies for maintaining the usage of existing desig... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The key sputter deposition step in TAB wafer bump processing: optimizing TiW adhesion and diffusion barrier properties

    Publication Year: 1991, Page(s):10 - 14
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (368 KB)

    Sputter deposition is used in tape automated bonding (TAB) as the first step of wafer processing in order to plate gold bumps at the die pads. The adhesion and barrier properties of TiW films are investigated here. Adhesion is critical for TAB as bond strengths are touted to be 2-x to 3-x that of wire bonding. Barrier integrity is important to enhance the hermetic seal properties again touted with... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Laser created silicon vias for stacking dies in MCMs

    Publication Year: 1991, Page(s):262 - 265
    Cited by:  Papers (6)  |  Patents (40)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    The stacking of silicon devices is gaining some interest as it will allow even greater densities over current multichip module (MCM) approaches. One type of approach being tried in the industry is interconnecting stacked dies by routing their metal lines to the edge of the die and then strapping the appropriate lines from each die together. An approach being pursued by the Center for Microelectron... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A tin based TAB assembly process

    Publication Year: 1991, Page(s):31 - 35
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    The feasibility of using a TinCap TAB (tape automated bonding) ILB (inner lead bond) structure to provide a strong ILB connection has been demonstrated. The project investigated placing a pad of tin on top of a gold TAB bump as part of the wafer fabrication process. The tin is then used to form a reflowed ILB joint with a gold-plated tape lead. This gold/tin bond should provide a strong joint whil... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Real time process planning for PCB assembly

    Publication Year: 1991, Page(s):240 - 243
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (336 KB)

    The authors discuss a blackboard-based process planning system for the surface mount assembly of printed circuit boards (PCBs). The developed system has a user interface, two knowledge sources, a blackboard, and an output module. This process planning system takes into consideration some of the real-time changes in the shop floor of a PCB manufacturing facility View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • New mode crack of LSI package in the solder reflow process

    Publication Year: 1991, Page(s):171 - 174
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (356 KB)

    A new mode crack that could not be explained by a general mechanism has been observed under the condition of the surface mount components being smaller and thinner, and requiring more severe characteristics in the solder reflow process. The mode crack is generated from the upper portion of the die pad corner, and is not caused by the delamination between the die pad and the plastic. This new mode ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Concurrent engineering realization through multichip module vehicles: technology and CAD tool requirements

    Publication Year: 1991, Page(s):348 - 350
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (332 KB)

    It is noted that multichip module (MCM) product developments provide a natural and essential basis for motivating technology and CAD (computer aided design) tool requirements. These requirements are reviewed with reference to three different minimum levels of maturity required for MCM design tools which are to be used, respectively, for near-term, intermediate-term, and long-term system impact. MC... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • IC manufacturing diagnosis based on statistical analysis techniques

    Publication Year: 1991, Page(s):402 - 405
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    The authors present algorithms which can be used to analyze parametric data for the purposes of understanding the causes of yield loss for a batch of manufactured wafers. Data from an industrial fabrication line were analyzed to show the validity of the approach. Key features of this approach are a brief learning phase and the ability to use both spatial information and electrical characteristics ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Evaluating storage requirements for standard electronics assembly

    Publication Year: 1991, Page(s):141 - 146
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (580 KB)

    The development of an Integrated Facilities Plan has required evaluation of and assumptions about the manufacturing facility. The analysis of requirements for equipment has progressed from back-of-the-envelope-type calculations through spreadsheets to sophisticated computer simulations. This has resulted in excellent analysis of the equipment requirements for facility automation. However, the anal... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.