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[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium

16-18 Sept. 1991

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Displaying Results 1 - 25 of 102
  • Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)

    Publication Year: 1991
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    Freely Available from IEEE
  • Optimization of the gull wing lead

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (24 KB)

    Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two diff... View full abstract»

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  • Leverages and bottlenecks of MCMs

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (70 KB)

    Summary form only given. The authors discuss the fundamental issues confronting designers and manufacturers of the multichip modules (MCMs). All of them ultimately determine the product cost, be it the in-process and final test yields, the engineering effort in design and manufacturing support, or the MCM quality and reliability. Challenges are compounded in a situation where MCMs are assembled wi... View full abstract»

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  • Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (67 KB)

    Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat tr... View full abstract»

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  • IC manufacturing diagnosis based on statistical analysis techniques

    Publication Year: 1991, Page(s):402 - 405
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    The authors present algorithms which can be used to analyze parametric data for the purposes of understanding the causes of yield loss for a batch of manufactured wafers. Data from an industrial fabrication line were analyzed to show the validity of the approach. Key features of this approach are a brief learning phase and the ability to use both spatial information and electrical characteristics ... View full abstract»

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  • Evaluating storage requirements for standard electronics assembly

    Publication Year: 1991, Page(s):141 - 146
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (580 KB)

    The development of an Integrated Facilities Plan has required evaluation of and assumptions about the manufacturing facility. The analysis of requirements for equipment has progressed from back-of-the-envelope-type calculations through spreadsheets to sophisticated computer simulations. This has resulted in excellent analysis of the equipment requirements for facility automation. However, the anal... View full abstract»

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  • A statistical method to integrate manufacturing tolerance in high-speed digital circuit design

    Publication Year: 1991, Page(s):395 - 401
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    The authors outline a computationally efficient statistical method to design high-speed digital circuits, taking into account the manufacturing tolerance of interconnects. The proposed method can be used in the design of high-density printed circuit packs and multi-chip modules (MCMs). It can also be used to bring the aspects of manufacturability into the early stage of the design to minimize the ... View full abstract»

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  • Robust-design of a metallization process for ceramic substrates

    Publication Year: 1991, Page(s):379 - 382
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (180 KB)

    The electroless nickel deposition process on ceramic substrates was optimized using a Taguchi-based robust-design method. The plating parameter settings were obtained in only 27 experiments. The savings in experiments is significant when compared to a full factorial design of 486 runs. The yield of completely metallized substrate was increased substantially. Under the optimal conditions, a 100% yi... View full abstract»

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  • JIT manufacturing in a highly complex, low volume capital equipment business

    Publication Year: 1991, Page(s):138 - 140
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (256 KB)

    The implementation of JIT (just-in-time) manufacturing is described. It is concluded that JIT required a fundamental change in the company's business philosophy. It requires time, commitment, and belief in the value of its basic concepts. It is not a quick fix, an inventory reduction scheme or a way to have suppliers hold one's inventory. With a patient approach and dedicated teams, it has produce... View full abstract»

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  • Recognition of pattern defects of printed circuit board using topological information

    Publication Year: 1991, Page(s):202 - 206
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    The authors discuss an optical inspection system in which topological information on conductors and insulators of PCBs (printed circuit boards) is used for the detection of defects. The conventional image comparison methods, such as direct comparison of two images and image expansion-contraction for a design-rule inspection, have some difficulties in finding large defects, missing patterns, and a ... View full abstract»

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  • Wire bonding limitations for high density fine pitch plastic packages

    Publication Year: 1991, Page(s):75 - 79
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (468 KB)

    The limits of process capability for fine pitch high density packages are shown. By the help of a special design test die and a PQFP (plastic quad flat package) frame, three different wire diameters with different lengths were bonded, molded, analyzed, and compared. Different ball sizes with special design capillary were made and measured. These measurements were used to study the ball size deform... View full abstract»

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  • Laser created silicon vias for stacking dies in MCMs

    Publication Year: 1991, Page(s):262 - 265
    Cited by:  Papers (6)  |  Patents (39)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    The stacking of silicon devices is gaining some interest as it will allow even greater densities over current multichip module (MCM) approaches. One type of approach being tried in the industry is interconnecting stacked dies by routing their metal lines to the edge of the die and then strapping the appropriate lines from each die together. An approach being pursued by the Center for Microelectron... View full abstract»

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  • An integrated approach to process monitoring and data analysis

    Publication Year: 1991, Page(s):391 - 394
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    The authors describe two architectures: the Automated Process Monitoring (APROM) System, which examines a large combination of trend charts and shows the symptoms of problems to the engineers by sending a high level message and a chart when a process variable is out of control; and the Interactive Data Extraction and Analysis (IDEA) System, which provides a simple menu interface to get a block of ... View full abstract»

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  • Paperless assembly using touchscreen based graphics

    Publication Year: 1991, Page(s):231 - 234
    Cited by:  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    An automated system has been implemented to develop and electronically distribute manufacturing process information. One component of this system focuses on replacing paper instructions and drawings in the hand assembly and manual inspection areas with a touchscreen-based graphical user interface (GUI). All information available in the system is automatically generated by process planners and main... View full abstract»

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  • A software tool for technology tradeoff evaluation in multichip packaging

    Publication Year: 1991, Page(s):337 - 341
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (628 KB)

    A software tool for evaluating performance tradeoffs in multichip packaging is described. The tool enhances the manufacturability and decreases the design risk associated with the selection of packaging technologies for integrated circuits. Geometric, electrical, thermal, and manufacturing metrics can be estimated using the tool. The tool allows technologies to be changed and design rules to be mo... View full abstract»

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  • Effects of RCA claning upon breakdown voltages of thin gate oxides

    Publication Year: 1991, Page(s):374 - 378
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    The authors investigated the effects of pre and post-oxidation RCA cleaning on thin oxides using breakdown voltages at current densities of 100 μA/cm2 and 100 mA/cm2. The RCA clean consisted of SC1 (NH4OH in water and H2O2 ), a dilute HF dip and SC2 (HCl in water and H2O2 ). Three experiments were performed to test the... View full abstract»

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  • Pull logic manufacturing based on CIM to approach JIT

    Publication Year: 1991, Page(s):134 - 137
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (236 KB)

    The authors describe a pull logic approach to JIT (just-in-time) by an improvement of MRP (material requirement planning) which is integrated into CIM (computer integrated manufacturing). Latest sales information and production plan information are reflected by CIM in the production control system, in order to realize timely production. This approach changes pull manufacturing from push manufactur... View full abstract»

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  • In-situ film thickness measurements by using pyrometric interferometry

    Publication Year: 1991, Page(s):197 - 201
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    A novel optical in situ method for film thickness measurements, pyrometric interferometry (PI), is introduced, which is capable of high-resolution (0.5 nm) data acquisition during the process (in situ measurement) and real-time data evaluation. It can be used for process control as well as for online quality inspection without time delay or additional handling mechanisms and is suitable for monito... View full abstract»

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  • An integrated methodology for electronic assembly planning

    Publication Year: 1991, Page(s):218 - 221
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (348 KB)

    The authors discuss an integrated planning, scheduling, and control methodology for electronic assembly. The activities of a placement workstation for electronic assembly are addressed. Placement sequence planning, vision analysis, inspection, and control issues of the developed methodology are discussed. The placement workstation is hierarchically controlled by the electronic manufacturing cell c... View full abstract»

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  • Highly manufacturable multi-layered ceramic surface mounted package

    Publication Year: 1991, Page(s):424 - 428
    Cited by:  Papers (1)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB)

    A surface mount package was designed in 1983 to satisfy a multi-chip cost-performance market requirement where a large number of components can be replaced with a few integrated devices in a single package. It was decided to use the IBM multi-layer ceramic (MLC) technology for the carrier substrate because of proven reliability, volume manufacturing capacity, multi-chip capability, wiring flexibil... View full abstract»

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  • Criticality of die placement on wire bonding

    Publication Year: 1991, Page(s):69 - 74
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (556 KB)

    It is pointed out that wire bonder suppliers are keeping up with the demands for six-sigma quality levels by opening up process windows and minimizing sensitivity of the equipment to set up and material variations. Die bonder suppliers are challenged even more. Their process windows are in fact becoming tighter. Fine-pitch, large I/O packages have put greater constraints on die positioning within ... View full abstract»

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  • Closing the engineering to manufacturing information loop

    Publication Year: 1991, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (272 KB)

    It is pointed out that, as printed circuit boards (PCBs) grow more complex and development time shrinks, the need for accurate and timely transfer of information from engineering to manufacturing has increased. This increased need has forced manufacturing to define information requirements, standardize data, improve data transfer capabilities, and verify engineering information. NCR E&M Columb... View full abstract»

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  • Multi-chip-module substrate decreasing signal delay and improving thermal conductivity

    Publication Year: 1991, Page(s):255 - 261
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    An MCM (multi-chip-module) substrate which has less parasitic capacitance and less thermal stress displacement than the conventional type of substrate has been developed. A low-ε fluorocarbon resin for interlayer insulator underneath the multi-wiring layers in the substrate on which LSI chips should be mounted was used. The remaining portion of the substrate was filled with insulating materia... View full abstract»

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  • Cost saving opportunities with multi-chip modules

    Publication Year: 1991, Page(s):413 - 416
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    The author describes an MCM (multi-chip module) application that was driven by cost. A study of MCM technologies focused on the MCM assembly and interconnect to the motherboard. Models were developed to calculate the assembly and test costs for MCMs using wirebond and tape automated bonding technologies. Another model was used to evaluate interconnect options, both separable and nonseparable (e.g.... View full abstract»

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  • Survey of various statistical process control methods

    Publication Year: 1991, Page(s):387 - 390
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (288 KB)

    The author discusses the various statistical process control (SPC) techniques currently being used by different industries. He also introduces a few nonconventional SPC charts which were published recently and could be used for better results. He also describes the Motorola method of performing characterization of processes View full abstract»

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