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Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International

Date 16-18 Sept. 1991

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Displaying Results 1 - 25 of 102
  • Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)

    Publication Year: 1991
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    Freely Available from IEEE
  • Chip on board (COB) multichip modules design possibilities and manufacturing

    Publication Year: 1991 , Page(s): 346 - 347
    Cited by:  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (168 KB)  

    The author describes multichip module applications using COB for low-cost assembly of many dice on the same substrate even on both sides, to achieve full electronic circuitry miniaturization. Multichip modules on the FR4 PWB (printed wiring board) substrate are shown as an alternative to silicon on silicon, with in and out interconnection possibilities of particular note. This original packaging a... View full abstract»

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  • An integrated methodology for electronic assembly planning

    Publication Year: 1991 , Page(s): 218 - 221
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (348 KB)  

    The authors discuss an integrated planning, scheduling, and control methodology for electronic assembly. The activities of a placement workstation for electronic assembly are addressed. Placement sequence planning, vision analysis, inspection, and control issues of the developed methodology are discussed. The placement workstation is hierarchically controlled by the electronic manufacturing cell c... View full abstract»

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  • High density interconnect verification of unpopulated multichip modules

    Publication Year: 1991 , Page(s): 434 - 439
    Cited by:  Papers (8)  |  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (600 KB)  

    Six methods of interconnect verification are discussed. Three are methods in general use for printed circuit applications and are becoming available for the higher resolution requirements of MCM (multichip module) substrates. Flying probe resistance testing is a direct, reliable test method but throughputs are too low for complex MCM substrates. Bed-of-nails (BON) resistance testers can be used fo... View full abstract»

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  • TAB multichip modules: a case study

    Publication Year: 1991 , Page(s): 27 - 30
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (304 KB)  

    A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR's strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing source... View full abstract»

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  • Fundamental study on solder paste for fine pitch soldering

    Publication Year: 1991 , Page(s): 163 - 165
    Cited by:  Papers (2)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (320 KB)  

    For fine pitch QFP soldering, solder amount and locations applied on pad must be precisely controlled. Solder paste has been printed individually on each pad for most card assemblies, but this printing method is confronted with process control difficulties. As a solution of these potential problems, a new type of printing method, in which many pads are covered with one bar (or belt) shaped paste p... View full abstract»

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  • High density interconnect verification using voltage contrast electron beam

    Publication Year: 1991 , Page(s): 270 - 274
    Cited by:  Papers (2)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (500 KB)  

    High reliability testing of multi-chip module (MCM) substrates has been demonstrated using voltage contrast electron beam (VCEB) open-shorts testing. Features as small as 100 μm are probed over an area of 10 cm×10 cm in a tool developed by installing high-precision digital electronics and a novel large field of view secondary electron analyzer into a conventional scanning electron microsc... View full abstract»

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  • Semi-conductor integrated technical data manager

    Publication Year: 1991 , Page(s): 222 - 225
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (336 KB)  

    The author describes the architecture of the Semi-Conductor Integrated Technical Data Manager (SCIM) system. SCIM is a design automation system that integrates data and controls the processes that are required for the release of the masterslice to manufacturing. The two key components of the system are the relational database and its functional controller. As the data are generated by the design c... View full abstract»

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  • In-situ film thickness measurements by using pyrometric interferometry

    Publication Year: 1991 , Page(s): 197 - 201
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (408 KB)  

    A novel optical in situ method for film thickness measurements, pyrometric interferometry (PI), is introduced, which is capable of high-resolution (0.5 nm) data acquisition during the process (in situ measurement) and real-time data evaluation. It can be used for process control as well as for online quality inspection without time delay or additional handling mechanisms and is suitable for monito... View full abstract»

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  • Bridge-gap buried digit-line for high density stacked DRAMs

    Publication Year: 1991 , Page(s): 310 - 314
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (568 KB)  

    Explores the interaction of design and process to achieve a manufacturable low digit-line resistance-a key element to DRAM (dynamic random access memory) speed and to minimizing overall process complexity. They propose an interaction between stacked DRAM design and process called the bridge-gap process for achieving low digit-line resistance while minimizing overall process complexity. A study of ... View full abstract»

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  • Die and MCM test strategy: the key to MCM manufacturability

    Publication Year: 1991 , Page(s): 440 - 445
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (644 KB)  

    Harris Corporation has undertaken a multi-chip module (MCM) project that will develop a four-channel digital RF receiver for use in very dense, lightweight systems. This MCM is designated the Digital Drop Receiver (DDR). Each channel is comprised of three chips: two digital decimating filters, and a numerically controlled oscillator/modulator. The ICs are interconnected to the MCM substrate by bot... View full abstract»

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  • Environmentally conscious products

    Publication Year: 1991 , Page(s): 278 - 279
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (92 KB)  

    IBM's environmental policy and IBM's initial criteria for environmentally conscious products are discussed. The main concept considered is that of a manufacturing loop in which products are made of recyclable materials and designed to be easily taken apart to be reused or recycled again. The tighter that loop, the less worrisome is the waste that will be generated View full abstract»

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  • A tin based TAB assembly process

    Publication Year: 1991 , Page(s): 31 - 35
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (536 KB)  

    The feasibility of using a TinCap TAB (tape automated bonding) ILB (inner lead bond) structure to provide a strong ILB connection has been demonstrated. The project investigated placing a pad of tin on top of a gold TAB bump as part of the wafer fabrication process. The tin is then used to form a reflowed ILB joint with a gold-plated tape lead. This gold/tin bond should provide a strong joint whil... View full abstract»

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  • An experimental study of the variation of wettability of SMDs using the micro-globule wetting method

    Publication Year: 1991 , Page(s): 166 - 170
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (400 KB)  

    Surface mount devices (SMDs) from 10 different sources have been tested using the globule/balance or micro-wetting method; they included both chip capacitors and resistors. Wettability indices measured include incubation time, eventual force normalized by theoretical maximum force, the wetting rate and Schouten's figure of merit. These indices enable a comparison of both the wettability and the va... View full abstract»

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  • Pull logic manufacturing based on CIM to approach JIT

    Publication Year: 1991 , Page(s): 134 - 137
    Cited by:  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (236 KB)  

    The authors describe a pull logic approach to JIT (just-in-time) by an improvement of MRP (material requirement planning) which is integrated into CIM (computer integrated manufacturing). Latest sales information and production plan information are reflected by CIM in the production control system, in order to realize timely production. This approach changes pull manufacturing from push manufactur... View full abstract»

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  • Multichip modules fabrication, a transition from prototypes to production

    Publication Year: 1991 , Page(s): 251 - 254
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (364 KB)  

    The author presents an overview of the rationale behind a pilot facility for manufacturing multichip modules, using a high density multilayer interconnect (HDMI) technology. Although HDMI multichip module fabrication equipment and techniques are somewhat related to semiconductor fabrication, there are significant differences which are due to the size of finished parts and to the materials used in ... View full abstract»

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  • Integrated management of development and manufacturing

    Publication Year: 1991 , Page(s): 95 - 97
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (256 KB)  

    The author describes an integrated management approach in which development and manufacturing activities are carried out in separate environments, but are linked to each other so that developed capabilities can be rapidly replicated for manufacturing purposes. This approach has been successfully applied to wafer fab processes. The author's experiences and his thoughts regarding wider implications ... View full abstract»

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  • Are environmental and manufacturing objectives compatible?

    Publication Year: 1991 , Page(s): 275 - 277
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (248 KB)  

    Attempts to show that environmentally-driven design and operational changes can improve products and be good for business. For example, at IBM product yield improvements have resulted from recycling equipment that is also used to purify incoming chemicals. Cleaners using water instead of CFCs (chlorofluorocarbons) produce better parts at lower cost. In addition, chemical source reduction activitie... View full abstract»

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  • Paperless assembly using touchscreen based graphics

    Publication Year: 1991 , Page(s): 231 - 234
    Cited by:  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (392 KB)  

    An automated system has been implemented to develop and electronically distribute manufacturing process information. One component of this system focuses on replacing paper instructions and drawings in the hand assembly and manual inspection areas with a touchscreen-based graphical user interface (GUI). All information available in the system is automatically generated by process planners and main... View full abstract»

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  • Inert gas wave soldering evaluation

    Publication Year: 1991 , Page(s): 289 - 293
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (304 KB)  

    Production modules were soldered using adipic acid/isopropanol as a flux and atomized formic acid to further enhance oxide reduction over the molten soldered module. The objectives of the evaluation were to assess system capability, measurable performance versus conventional wave soldering equipment performance, and environmental impact. The system capability for overall machine performance, from ... View full abstract»

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  • Production management implementation at SEMATECH

    Publication Year: 1991 , Page(s): 129 - 133
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (344 KB)  

    The author presents a case study concerning the process of production control system implementation in SEMATECH's advanced integrated circuit manufacturing facility. The unique situation at SEMATECH, which emphasizes leading-edge research and development while running multiple integrated manufacturing processes, provides a worst-case scenario for demonstrating world-class manufacturing. A combinat... View full abstract»

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  • Evaluating storage requirements for standard electronics assembly

    Publication Year: 1991 , Page(s): 141 - 146
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (580 KB)  

    The development of an Integrated Facilities Plan has required evaluation of and assumptions about the manufacturing facility. The analysis of requirements for equipment has progressed from back-of-the-envelope-type calculations through spreadsheets to sophisticated computer simulations. This has resulted in excellent analysis of the equipment requirements for facility automation. However, the anal... View full abstract»

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  • Partnering for total quality: an industry's blueprint to regain and retain competitiveness

    Publication Year: 1991 , Page(s): 48 - 54
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (616 KB)  

    The author describes a step-by-step process of implementing total quality as a way of life within the semiconductor industry supply-chain. While this process utilizes the Malcolm Baldridge National Quality Award criteria as a foundation, the application of these criteria has been tailored to this industry. In doing so it adds additional dimensions to these criteria by bringing them to the level of... View full abstract»

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  • Modern bonding processes for large-scale integrated circuits, memory modules and multichip modules in plastic packages

    Publication Year: 1991 , Page(s): 80 - 84
    Cited by:  Papers (2)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (468 KB)  

    It is noted that the decisive factor for the very high market share held by plastic packages is the much lower material and processing costs of designs based on the leadframe compared with the category of singulated devices. For the lower processing costs there are several reasons: handling of lead-frame can be easily automated, rapid gold ball/wedge wire bonding, and automatic encapsulation of th... View full abstract»

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  • Robust-design of a metallization process for ceramic substrates

    Publication Year: 1991 , Page(s): 379 - 382
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (180 KB)  

    The electroless nickel deposition process on ceramic substrates was optimized using a Taguchi-based robust-design method. The plating parameter settings were obtained in only 27 experiments. The savings in experiments is significant when compared to a full factorial design of 486 runs. The yield of completely metallized substrate was increased substantially. Under the optimal conditions, a 100% yi... View full abstract»

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