[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium

16-18 Sept. 1991

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  • Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)

    Publication Year: 1991
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    Freely Available from IEEE
  • Optimization of the gull wing lead

    Publication Year: 1991
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    Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two diff... View full abstract»

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  • Leverages and bottlenecks of MCMs

    Publication Year: 1991
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    Summary form only given. The authors discuss the fundamental issues confronting designers and manufacturers of the multichip modules (MCMs). All of them ultimately determine the product cost, be it the in-process and final test yields, the engineering effort in design and manufacturing support, or the MCM quality and reliability. Challenges are compounded in a situation where MCMs are assembled wi... View full abstract»

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  • Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

    Publication Year: 1991
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    Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat tr... View full abstract»

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  • Criticality of die placement on wire bonding

    Publication Year: 1991, Page(s):69 - 74
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    It is pointed out that wire bonder suppliers are keeping up with the demands for six-sigma quality levels by opening up process windows and minimizing sensitivity of the equipment to set up and material variations. Die bonder suppliers are challenged even more. Their process windows are in fact becoming tighter. Fine-pitch, large I/O packages have put greater constraints on die positioning within ... View full abstract»

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  • What does the customer expect from a perfectly designed and manufactured PQFP package?

    Publication Year: 1991, Page(s):64 - 68
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (496 KB)

    It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they ... View full abstract»

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  • TAB multichip modules: a case study

    Publication Year: 1991, Page(s):27 - 30
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (304 KB)

    A case history of the design, development, and production of a commercial, high-performance multichip module at NCR Corporation is presented. Included is a brief description of NCR's strategy followed by design and manufacturing considerations encountered in the development of a tape automated bonded (TAB) module for volume production. These considerations include everything from developing source... View full abstract»

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  • Effects of RCA claning upon breakdown voltages of thin gate oxides

    Publication Year: 1991, Page(s):374 - 378
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (408 KB)

    The authors investigated the effects of pre and post-oxidation RCA cleaning on thin oxides using breakdown voltages at current densities of 100 μA/cm2 and 100 mA/cm2. The RCA clean consisted of SC1 (NH4OH in water and H2O2 ), a dilute HF dip and SC2 (HCl in water and H2O2 ). Three experiments were performed to test the... View full abstract»

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  • Concurrent engineering for consumer, industrial products, and government systems

    Publication Year: 1991, Page(s):44 - 47
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    Recent Institute for Defense Analysis reports, National Science Foundation workshop results, and other current efforts and publications addressing concurrent engineering (CE) are discussed. It is noted that CE has yielded benefits involving reduction in change orders, development time, development costs, inventories, scrap, rework, defects, and production costs View full abstract»

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  • A vector concept methodology for the appraisal of manufacture technology

    Publication Year: 1991, Page(s):61 - 63
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    It is pointed out that the most deterministic factor in selecting the technological processes and the organization scheme for a specific manufacturing task is the particularity of the technological structure of the production object. Nevertheless, there is still a broad variety of options. The resolution of this latter issue depends upon diverse abstract factors common to different products, e.g.,... View full abstract»

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  • Environmentally conscious products

    Publication Year: 1991, Page(s):278 - 279
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (92 KB)

    IBM's environmental policy and IBM's initial criteria for environmentally conscious products are discussed. The main concept considered is that of a manufacturing loop in which products are made of recyclable materials and designed to be easily taken apart to be reused or recycled again. The tighter that loop, the less worrisome is the waste that will be generated View full abstract»

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  • Design for in-circuit testability

    Publication Year: 1991, Page(s):325 - 328
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (372 KB)

    The author discusses all of the test requirements and design parameters which must be identified in order to ensure that the proper physical characteristics of a printed circuit board (PCB) design allow for complete test coverage at the in-circuit test level. Several strategies for providing the proper physical layout are presented. Additional strategies for maintaining the usage of existing desig... View full abstract»

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  • TAB inner-lead bond process characterization for single-point laser bonding

    Publication Year: 1991, Page(s):21 - 26
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    Results are presented for a set of screening experiments used to characterize a process for performing inner-lead bonding (ILB) using a continuous-wave (CW) laser. Three key parameters were selected for initial analysis: the force exerted by the bonding stylus; the laser power; and the on-time of the laser. Using a Box-Behnken statistical design for the experiment, an efficient set of tests was de... View full abstract»

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  • Production management implementation at SEMATECH

    Publication Year: 1991, Page(s):129 - 133
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    The author presents a case study concerning the process of production control system implementation in SEMATECH's advanced integrated circuit manufacturing facility. The unique situation at SEMATECH, which emphasizes leading-edge research and development while running multiple integrated manufacturing processes, provides a worst-case scenario for demonstrating world-class manufacturing. A combinat... View full abstract»

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  • Using fuzzy mathematics to detect dimple defects of polished wafer surface

    Publication Year: 1991, Page(s):187 - 191
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (332 KB)

    Using the concept of fuzzy mathematics, the authors developed an automated visual inspection system to detect dimple defects of polished wafer surfaces. The algorithm consists of two major processing phases. At the first phase, pre-processing is performed to eliminate noise and to reduce the number of potential candidates of dimple defects. At the second phase, four pattern features are defined ba... View full abstract»

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  • Development of anti-glare coating for high resolution color display tubes

    Publication Year: 1991, Page(s):371 - 373
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (188 KB)

    Research on the development of anti-glare coating material for coating high-resolution display tubes is described. The coating solution that is considered is highly dispersed on the screen of display tubes, thus forming a special coating for anti-glare instead of forming an anti-reflection film. The degrees of hydrolysis and polycondensation of tetraethyl orthosilicate (TEOS) which forms the anti-... View full abstract»

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  • A pilot line for multichip modules substrates

    Publication Year: 1991, Page(s):420 - 423
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (236 KB)

    In 1990 Thomson Hybrides started design and installation of a pilot production line for high density thin film substrates. Copper/polyimide multilayer structures are processed on alumina substrates. Vacuum metallization, electroplating, and photolithography processes will be progressively transferred to new automatic equipment. Starting with standard square plates (4"×4"), the pilot line has... View full abstract»

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  • The latest molding technology for fine pitch P-QFP

    Publication Year: 1991, Page(s):85 - 88
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    The author describes the molding technology for fine pitch P-QFP. Problems associated with the packaging technology for fine pitch P-QFP are discussed with reference to the best directions for package structure concerning larger package, larger IC chips, thinner package, and fine lead pitch package; molding methods; and the questions of what kind of a molding compound can satisfy the above mention... View full abstract»

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  • Employee empowered quality improvement

    Publication Year: 1991, Page(s):39 - 43
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (452 KB)

    Continuous improvement in quality has been made possible by the use of a complete quality program which fully utilizes the knowledge and capabilities of an entire workforce. The program includes formal quality policy deployment, training, a seven-step quality improvement process, and the use of poka-yoke or mistake-proofing devices. It is concluded that employees empowered to create continuous qua... View full abstract»

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  • Introduction of BiCMOS into a production CMOS facility

    Publication Year: 1991, Page(s):58 - 60
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    A unique set of circumstances is required for the rapid introduction of a 1-μm BiCMOS capability from R&D into a CMOS production facility. Not only was the lead time very short, but the wafer size and equipment sets were not compatible and the main thrust/experience of the personnel was different. The authors review the proposed novel solution, organizational details, technical approach, an... View full abstract»

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  • High-density and very fine-pitch IC packages: a technology assessment

    Publication Year: 1991, Page(s):151 - 158
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (916 KB)

    To meet the technological challenges of the future in terms of device performance and miniaturization, a number of IC packages have been developed in the industry, with very high levels of integration. The distinguishing features of these packages include high density, small profile, very fine lead spacings, and superior electrical and thermal characteristics. The author provides a comparative ass... View full abstract»

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  • Are environmental and manufacturing objectives compatible?

    Publication Year: 1991, Page(s):275 - 277
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    Attempts to show that environmentally-driven design and operational changes can improve products and be good for business. For example, at IBM product yield improvements have resulted from recycling equipment that is also used to purify incoming chemicals. Cleaners using water instead of CFCs (chlorofluorocarbons) produce better parts at lower cost. In addition, chemical source reduction activitie... View full abstract»

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  • Automated assembly of new 3D molded interconnection devices

    Publication Year: 1991, Page(s):320 - 324
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (572 KB)

    It is pointed out that the assembly of electronic devices is determined by separate construction of flat printed circuit boards with discrete components and insertion in a mechanical unit. New opportunities of integrating housing and circuitry by means of molded interconnects result in new challenges of the insertion technique. Thus, future application-specific industrial robots have to insert com... View full abstract»

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  • Statistically designed polyimide coating process for TAB bumping

    Publication Year: 1991, Page(s):15 - 20
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (344 KB)

    Design of experiments and statistical data analysis were used to develop a wafer coating process for straight wall bumping of 6" wafers for TAB (tape automated bonding). The effect of important parameters and their interactions on polyimide coat thickness, uniformity, and quality were identified, and models were developed. Using the results of the experiments, a dynamic coating process was develop... View full abstract»

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  • Die and MCM test strategy: the key to MCM manufacturability

    Publication Year: 1991, Page(s):440 - 445
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (644 KB)

    Harris Corporation has undertaken a multi-chip module (MCM) project that will develop a four-channel digital RF receiver for use in very dense, lightweight systems. This MCM is designated the Digital Drop Receiver (DDR). Each channel is comprised of three chips: two digital decimating filters, and a numerically controlled oscillator/modulator. The ICs are interconnected to the MCM substrate by bot... View full abstract»

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