Integrated Power Systems (CIPS), 2006 4th International Conference on
Date 7-9 June 2006
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Displaying Results 1 - 25 of 63
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Psi-tronic(TM) ¿ a highly reliable power module for high temperature applications
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PDF (1074 KB)
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Considerations on design and qualification of a high voltage isolation hybrid power module
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PDF (958 KB)
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Compact IGBT phase-leg assemblies, as integrated functional modules for advanced high-speed trains, multivoltage locos and commuters
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PDF (2429 KB)
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Low-Temperature Sintered Silver Attachment for High-Temperature Operation of SiC Power Devices
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PDF (1623 KB)
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Packaging of Large Area Power Chips ¿ Extending the Limits of Standard Module Technology
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PDF (2476 KB)
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Solder Fatigue at High-Power IGBT Modules
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PDF (2819 KB)
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An assessment of the reliability of a new soldering process for automotive power module
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PDF (1244 KB)
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Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules
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PDF (1455 KB)
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Experimental - Simulative procedure to Predict the EMI Generated in High Power Converters based on IGBT modules
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PDF (1018 KB)
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Systems Integration at CPES
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PDF (1511 KB)
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New structure of power integrated module
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PDF (1360 KB)
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IPEM-Based Power Electronics System Integration
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PDF (3320 KB)
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Research Activities of the Power Electronics Research Centre with Special Focus on Wide Band Gap Materials
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PDF (1563 KB)
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Demonstration of High Output Power Density (50 W/cc) Converter using 600 V SJ-MOSFET and SiC-SBD
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PDF (1151 KB)
