3D Systems Integration Conference (3DIC), 2010 IEEE International
Date 16-18 Nov. 2010
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Displaying Results 1 - 25 of 71
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Content
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PDF (92 KB)
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Welcome to the IEEE International: 3D system integration conference (3DIC)
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PDF (1437 KB)
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3D integration — A server perspective
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PDF (1422 KB)
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3D integration infrastructure & market status
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PDF (11840 KB)
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3D R&D technology for the future voyage in Japan
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PDF (4432 KB)
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Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis
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PDF (71 KB)
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Cost effectiveness of 3D integration options
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PDF (263 KB)
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Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement
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PDF (948 KB)
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Manufacturing service on 3D ICs
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PDF (33 KB)
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Design platform and tools for 3D IC integration
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PDF (2761 KB)
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The NCSU Tezzaron design kit
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PDF (188 KB)
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3D ICs and pixel sensors: The Italian VIPIX project and the European AIDA WP3 project
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PDF (382 KB)
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3D motivations for high energy physics
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PDF (169 KB)
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High sensitivity fully digital photodetector
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PDF (972 KB)
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Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding
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PDF (450 KB)
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High performance 3D interconnects based on electrochemical etch and liquid metal fill
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PDF (819 KB)
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Logic-on-logic 3D integration and placement
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PDF (284 KB)
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Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
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PDF (65 KB)
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