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Date 15-17 April 1998

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Displaying Results 1 - 25 of 71
  • 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)

    Publication Year: 1998
    Save to Project icon | Request Permissions | PDF file iconPDF (1259 KB)  
    Freely Available from IEEE
  • Author index

    Publication Year: 1998 , Page(s): XV - XVII
    Save to Project icon | PDF file iconPDF (166 KB)  
    Freely Available from IEEE
  • Technology trends of microelectronics in Taiwan

    Publication Year: 1998 , Page(s): 1 - 9
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (467 KB)  

    This paper summarizes the current status of Taiwan microelectronics industry, including both semiconductor technology and flat panel displays, and presents the technology developments leading to the strategic goals of Taiwan towards the year 2000 and beyond. View full abstract»

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  • Future waferlevel CSP packaging

    Publication Year: 1998 , Page(s): 30 - 34
    Cited by:  Papers (4)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (500 KB)  

    The requirements for wafer-level CSP technology concerning reliability and cost are discussed. A simple cost calculation based on cost per I/O for single chip packaging demonstrates the advantage of wafer-level CSP-type packaging and gives a cost limit for wafer-level packaging technologies. The geometrical limitations are noted. The reliability requirements for successful implementation are descr... View full abstract»

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  • Capacitors embedded in the low temperature cofired ceramics

    Publication Year: 1998 , Page(s): 59 - 63
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (483 KB)  

    With the addition of LiF, nonstoichiometric barium titanate can be densified well after sintering at temperatures of less than 1000/spl deg/C, which is compatible with LTCC substrates. From the X-ray diffraction pattern, barium titanate is the main existing crystalline structure. On the observation of the microstructure, no delamination between substrate and capacitor layer is observed after cofir... View full abstract»

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  • High reliability and compression flow underfill encapsulant for flip-chip applications

    Publication Year: 1998 , Page(s): 72 - 76
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (323 KB)  

    We have developed a next generation underfill encapsulant material for a compression bonding chip assembly process that is based on epoxy resin. As it has a high moisture resistance, we selected phenol resin as the curing agent for epoxy resin. The underfill material can be very significant for improvement of the flip chip assembly process for chip scale packages (CSP), multichip modules (MCM), an... View full abstract»

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  • The fine pitch direct bonding technology for chip interconnection

    Publication Year: 1998 , Page(s): 82 - 87
    Cited by:  Papers (1)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (420 KB)  

    We have developed new direct bonding technology using anisotropic conductive film (ACF) connections between two chips. We applied this bonding technology in ultra fine pitch interconnections at 40 /spl mu/m between an LED array and a driver IC, and realized a minimized LED print head. The key point of direct bonding technology is assurance of connection reliability which can be improved by two imp... View full abstract»

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  • Inner bump bonding technology for CSP

    Publication Year: 1998 , Page(s): 88 - 93
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (525 KB)  

    D/sup 2/BGA (die dimension BGA) is an NEC CSP, consisting of die, flexible printed circuit tape, resin, solder bumps and reinforcement resin. Assembly consists of bonding, lamination, encapsulation, solder ball placement and singulation. The bonding technique uses IBB (inner bump bonding) technology. IBB is similar to ILB (inner lead bonding), using an ultrasonic thermocompression single point bon... View full abstract»

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  • Simple assembly scheme of a corner-illuminated PD on a hybridly integrated planar lightwave circuit (PLC) platform

    Publication Year: 1998 , Page(s): 118 - 122
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (397 KB)  

    We report a planar integration scheme for a corner-illuminated photodiode (PD) on a planar lightwave circuit (PLC) platform for highly uniform optical coupling for receiver-PDs and monitor-PDs. We adjusted the marker on the PD to the waveguide on the PLC and the marker on the platform, and deviations from the center position are small, to within /spl plusmn/10 /spl mu/m. The corner-illuminated PD ... View full abstract»

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  • Highly accurate and quick bonding for planar lightwave circuit and laser-diode chip

    Publication Year: 1998 , Page(s): 133 - 137
    Cited by:  Papers (1)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (458 KB)  

    A new method for accurately and quickly bonding a planar light waveguide circuit (PLC) and a laser diode is proposed. The method is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the proposed method was accurate within /spl plusmn/1 /spl mu/m. The turnaround time, from picking up the laser diode with vacuum tweezers to... View full abstract»

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  • Hybrid power modules using a metal matrix composite baseplate: An evaluation

    Publication Year: 1998 , Page(s): 173 - 178
    Cited by:  Papers (2)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (668 KB)  

    This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2"/spl times/1" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction ... View full abstract»

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  • Chip scale package (CSP) solder joint reliability and modeling

    Publication Year: 1998 , Page(s): 216 - 223
    Cited by:  Papers (1)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (979 KB)  

    A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in chip scale packages (CSP) mounted on PCBs. The time-dependent and time-independent viscoplastic strain rate and plastic hardening work factors of solder material were used in 2D plane strain finite element models. The viscoplastic strain r... View full abstract»

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  • High temperature migration of thick film conductor

    Publication Year: 1998 , Page(s): 237 - 242
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (696 KB)  

    When burn-in testing was performed at high temperature with opposing electrodes which were formed on the thick film Ag conductor, a short occurred between the electrodes. We realized that this was due to the electric field strength in addition to the temperature. Moreover, we found the cause of this short from the results of our investigation: in the conductor firing process, Ag is melted with gla... View full abstract»

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  • Advanced MCM-Ls for consumer electronics

    Publication Year: 1998 , Page(s): 249 - 254
    Cited by:  Patents (2)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (465 KB)  

    We have developed an advanced MCM (multichip module) using the SBB/sup TM/ (stud-bump bonding) flip-chip technique on an ALIVH/sup TM/ (any layer inner via hole) structure substrate. The SBB technique is an advanced flip-chip bonding technique for high density MCM, which can mount bare LSI chips directly on substrates. The bonding portion structure is composed of Au bumps with two-stepped construc... View full abstract»

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  • An MCM-D module using newly structured thermal management technique

    Publication Year: 1998 , Page(s): 255 - 260
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (604 KB)  

    This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM te... View full abstract»

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  • The future of 3D packaging

    Publication Year: 1998 , Page(s): 261 - 271
    Cited by:  Patents (3)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (670 KB)  

    Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory mo... View full abstract»

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  • 3-dimensional memory module assembly technology

    Publication Year: 1998 , Page(s): 272 - 277
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (615 KB)  

    In order to meet the demand for higher density and greater capacity, a three dimensional memory module has been developed. NEC has developed a new type of 3D memory module which uses single memory module stacking technology. It satisfies the demands for higher packaging density using a simple structure. The reliability of the single memory modules and 3D memory module was tested using 16 Mb DRAM c... View full abstract»

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  • Analysis of small-sized winding type directional coupler

    Publication Year: 1998 , Page(s): 278 - 283
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (345 KB)  

    Directional couplers are utilized in many communication systems and measuring instruments. The coupler is usually made of two-conductor coupled transmission-lines in the VHF and UHF ranges. Since the coupler becomes large in these frequency ranges, the bifilar line winding can be used to reduce its size. Then, the phase velocity of u- and b-modes become unequal v/sub u//spl ne/v/sub b/, which lead... View full abstract»

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  • Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations

    Publication Year: 1998 , Page(s): 290 - 295
    Cited by:  Papers (3)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (739 KB)  

    Thermomechanical reliability of electronic packaging such as flip chip and chip scale packaging is most important for adoption of these technologies in industrial applications. However, various kinds of inhomogeneities, localized stresses and thermal mismatch between several components lead to interface delaminations, chip cracking and solder interconnect fatigue. Nonlinear finite element simulati... View full abstract»

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  • Electrical characterization of a 500 MHz frequency EBGA package

    Publication Year: 1998 , Page(s): 296 - 301
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (556 KB)  

    We developed a 420-ball enhanced BGA (EBGA) package that can accommodate a 500 MHz ASIC with 15 W power consumption. This package uses a low voltage differential signal with 400 mV full amplitude and 240 ps risetime as its highest speed signal, and consists of 8 pairs of differential signals. Each pair is composed of 2 signals with an isometric length. Two pairs have an identical length and form a... View full abstract»

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  • Micro/chip scale packages and the semiconductor industry road map

    Publication Year: 1998 , Page(s): 302 - 305
    Cited by:  Papers (1)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (322 KB)  

    Micro/chip scale packages are the hot topic in the IC packaging industry at present, but important questions regarding the fit between advances in IC technology and packaging technology remain unanswered. By exploring the recently published Semiconductor Industry Association (SIA) semiconductor technology road map, some of the answers are forthcoming, particularly with regard to the role of miniat... View full abstract»

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  • Vertical microvia connections achieved using a unique conductive composite material

    Publication Year: 1998 , Page(s): 306 - 311
    Cited by:  Patents (1)
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (824 KB)  

    A novel base technology applicable to all major packaging and redistribution elements in an electronic module is presented. A unique polymer/metal composite conductor family based on transient liquid phase sintering (TLPS) can be used for chip package and PWB substrate applications, in interlayer connections, and for SMT assembly. High density multilayer circuits with landless blind and buried via... View full abstract»

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  • Development of heat dissipation structure for face-down bonded devices

    Publication Year: 1998 , Page(s): 337 - 342
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (607 KB)  

    We developed a heat dissipation structure for face-down bonded surface acoustic wave (SAW) filter packages. This structure enables compact packages at low cost. Heat dissipation from the transmission (Tx) SAW filter and filter sealing are important factors in enhancing package reliability. Tx and reception (Rx) SAW filters were bonded on a printed wiring board (PWB) with a branching circuit, and t... View full abstract»

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  • Excess low frequency noises in some electronic materials and components

    Publication Year: 1998 , Page(s): 343 - 346
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (290 KB)  

    We devised burst noise eliminating equipment and characterized the 1/f and burst noise in some electronic materials, components, electric contacts and bipolar transistors. The burst-eliminated noise spectrum is the 1/f type. The noise intensity is proportional to the square of the current and to the fifth power of the contact resistance. This contact resistance dependence of the noise is analyzed ... View full abstract»

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  • Gallium based interconnects for flip-chip assembly

    Publication Year: 1998 , Page(s): 347 - 352
    Save to Project icon | Click to expandAbstract | PDF file iconPDF (770 KB)  

    A feasibility study into alternative methods of producing interconnection between a PCB and flip chip has been undertaken. A number of initial ideas were investigated, the least promising being discarded at an early stage, whilst the ideas showing the greatest chance of success were subject to a more rigorous examination. Of the initial ideas, the most promising were amalgam materials and magnetic... View full abstract»

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