Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Date 20-22 Oct. 2010
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Displaying Results 1 - 25 of 215
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[Front matter]
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PDF (7494 KB)
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Increasing bondability and bonding strength of gold bmps thermosonic bonding to flex substrates by depositing a nickel layer
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PDF (643 KB)
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Application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC
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PDF (175 KB)
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The Contact Characteristics and NMOS performance of ACF-Bonded ultra-thin chip-on-flex (UTCOF) interconnects for bendable electronics
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PDF (309 KB)
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Packaging technologies for 3D integration
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PDF (162 KB)
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Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference
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PDF (530 KB)
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Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects
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PDF (1868 KB)
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Nanofiber based composites for thermal management
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PDF (2071 KB)
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Comprehensive design considerations in die-package-board transceiver channel co-simulation
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PDF (580 KB)
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Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings
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PDF (173 KB)
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Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking
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PDF (547 KB)
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The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation X-ray
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PDF (85 KB)
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The investigation of defect screening methodology using mechanical stress test for Pb-free module product
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PDF (194 KB)
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In-situ reliability monitoring on PBGA packaging through piezoresistive stress sensor
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PDF (185 KB)
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