Date 24-26 Aug. 2010
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Displaying Results 1 - 25 of 72
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Final program ICSJ 2010
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PDF (429 KB)
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[Copyright notice]
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PDF (25 KB)
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Symposium Committee
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PDF (81 KB)
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Plenary speech
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PDF (205 KB)
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Program sessions
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PDF (173 KB)
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Development of Super Thin TSV PoP
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PDF (1022 KB)
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A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices
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PDF (746 KB)
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Preparation of ferroelectric capacitor films onto the releasable substrate and its application to nano-transfer method
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PDF (665 KB)
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Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder
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PDF (488 KB)
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Effect of solders, underfills and substrates on the reliability of flip-chip bonding of low-k semiconductor chips
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PDF (1242 KB)
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Health monitoring method for load assessment in reliability design of printed circuit board
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PDF (1119 KB)
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Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package
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PDF (631 KB)
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TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with Multi-TSV connections
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PDF (247 KB)
