Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Date 25-27 Oct. 2010
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Displaying Results 1 - 25 of 77
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Table of contents
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PDF (100 KB)
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A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
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PDF (890 KB)
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Power efficiency modeling and optimization of high-speed equalized-electrical I/O architectures
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PDF (430 KB)
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Crosstalk mitigation of high-speed interconnects with discontinuities using modal signaling
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PDF (658 KB)
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Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture
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PDF (1019 KB)
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I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC
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PDF (889 KB)
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RC passive equalizer for through silicon via
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PDF (586 KB)
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A core frequency-loss estimation methodology for a power-delivery network with reduced decoupling capacitance
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PDF (289 KB)
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Design and modelling of a cost-effective embedded filter for low-impedance power distribution network
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PDF (599 KB)
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A rigorous method for fundamentally eliminating the low-frequency breakdown in full-wave finite-element-based analysis: Combined dielectric-conductor case
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PDF (573 KB)
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A novel clustering scheme for reduced-order macromodeling of massively coupled interconnect structures
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PDF (704 KB)
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A two-level waveform relaxation approach for fast transient simulation of long high-speed interconnects
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PDF (663 KB)
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A new bandstop filter using artificial defected ground structures with compact size and low radiation
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PDF (1129 KB)
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