Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Date 5-9 July 2010
Filter Results
Displaying Results 1 - 25 of 82
-
-
-
-
-
-
-
-
-
Study of turn-on characteristics of SCRs for ESD protection with TDR-O and TDR-S TLPs
|
PDF (313 KB)
-
The influence of decoupling capacitor on the discharge behavior of fully silcided power-clamped device under HBM ESD event
|
PDF (851 KB)
-
The correlation of capacitance-voltage hysteresis measurements with performance during accelerated lifetime testing of polycrystalline thin film solar cells
|
PDF (416 KB)
-
Novel fault localization approach for ATPG / scan-fault failures in complex sub-nano FPGA/ASIC debugging
|
PDF (1904 KB)
-
Defect localization using photon emission microscopy analysis with the combination of OBIRCH analysis
|
PDF (3876 KB)
-
Absorbed-specimen current imaging implementation and characterization in nano-prober for resistive interconnects isolation in 45-nm silicon-on-insulator microprocessors
|
PDF (1892 KB)
-
Physical failure analysis cases by Electron Beam Absorbed Current & Electron Beam Induced Current detection on nano-probing SEM system
|
PDF (2430 KB)
-
-
Advanced direct contact via (DCV) process with Ta/TaN/Ta tri-layer barrier for advanced BEOL dual damascene Cu interconnects
|
PDF (293 KB)
-
-
-
Failure analysis of die crack in lidless packages
|
PDF (1364 KB)
-
Topography and Deformation Measurement and FE Modeling applied to substrate-mounted large area wafer-level packages (including stacked dice and TSVs)
|
PDF (544 KB)
-
Failure analysis of a low yield mixed-signal product due to Deep-Nwell fabrication process marginality
|
PDF (493 KB)
-
-
-
Reliability and breakdown characteristics of HfO
2 -based GaAs metal-oxide-semiconductor capacitors with a thin Si interface layer |
PDF (361 KB)
