Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Date 2-5 June 2010
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Displaying Results 1 - 25 of 175
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Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation
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PDF (2011 KB)
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On refining the parameters of a Random Network Model for determining the effective thermal conductivity of particulate thermal interface materials
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PDF (760 KB)
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Scaling consideration on local hotspot for Si MOSFETs - for device length scale typically larger than 100 nm
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PDF (758 KB)
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Immersion Cooling of Light Emitting Diodes
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PDF (666 KB)
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Conduction cooling of large LED array systems
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PDF (1448 KB)
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Thermal characteristics of edge-illumination type LED backlight system in a thin flat panel display
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PDF (277 KB)
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Numerical investigation of optimal spacing between heat-generating blocks in laminar forced convection
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PDF (956 KB)
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Novel heat transfer fluids using mixture formulations for electronics thermal management
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PDF (1411 KB)
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Heat transfer in microchannels: substrate effects and cooling efficiency for rectangular and circular ducts
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PDF (844 KB)
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Numerical investigation of inlet condition effect on thermo-fluid characteristics of turbulent plane jet
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PDF (1388 KB)
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Numerical investigation of a liquid droplet transported by a gas stream impinging on a heated surface: single-phase regime
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PDF (1001 KB)
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Reliability modeling of a single phase liquid cooling system for power electronics applications
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PDF (549 KB)
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Numerical investigation of flow and heat transfer characteristics from an impinging jet on a circular cylinder
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PDF (2503 KB)
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Characterization of thermal field in mixed-convection cooling of a flat plate by an impinging slot jet
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PDF (1074 KB)
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Thermodynamic modeling and calorimetry of nanostructured materials for capacitive thermal management
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PDF (391 KB)
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